Athermal optical modulator and method of manufacturing the same
    7.
    发明授权
    Athermal optical modulator and method of manufacturing the same 有权
    热光调制器及其制造方法

    公开(公告)号:US09207469B2

    公开(公告)日:2015-12-08

    申请号:US13973521

    申请日:2013-08-22

    CPC classification number: G02F1/025 G02F2203/60 Y02E10/50

    Abstract: An athermal optical modulator includes a waveguide, a ring resonator configured to receive light input from the waveguide and output modulated light to the waveguide, the ring resonator including a ridge unit located at a center of the ring resonator in a vertical section, a first contact connected to one side of the ridge unit and a second contact connected to the other side of the ridge unit, the first contact and the second contact forming paths for applying electricity to the ring resonator to form an electric field in the ring resonator, and a polymer layer covering the ridge unit.

    Abstract translation: 一种无热光调制器,包括波导,环形谐振器,其被配置为接收从波导输入的光并将调制光输出到波导,所述环形谐振器包括位于所述环形谐振器的垂直部分的中心的脊单元,所述第一接触 连接到所述脊单元的一侧,并且连接到所述脊单元的另一侧的第二触点,所述第一触点和所述第二触点形成路径用于向所述环形谐振器施加电力以在所述环形谐振器中形成电场,以及 覆盖脊单元的聚合物层。

    Optoelectronic chips including coupler region and methods of manufacturing the same
    9.
    发明授权
    Optoelectronic chips including coupler region and methods of manufacturing the same 有权
    包括耦合器区域的光电芯片及其制造方法

    公开(公告)号:US09097845B2

    公开(公告)日:2015-08-04

    申请号:US13768204

    申请日:2013-02-15

    Inventor: Seong-ho Cho

    Abstract: An optoelectronic chip, and/or a method of manufacturing the same, include a substrate; a coupler region surrounded by the substrate. The coupler region includes a total reflection surface. The total reflection surface is configured to totally reflect a first light incident through a surface of the substrate such that the reflected first light travels within the substrate, or the total reflection surface is configured to totally reflect a second light guided in the substrate and incident on the total reflecting surface such that the reflected second light travels through the surface of the substrate.

    Abstract translation: 光电子芯片和/或其制造方法包括:基板; 由衬底包围的耦合器区域。 耦合器区域包括全反射面。 全反射面被配置为完全反射通过基板的表面入射的第一光,使得反射的第一光在基板内行进,或者全反射表面被配置为完全反射在基板中引导的第二光并入射到 全反射表面使得反射的第二光穿过基板的表面。

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