公开(公告)号：US06689639B2

公开(公告)日：2004-02-10

申请号：US10291766

申请日：2002-11-12

申请人： Seiki Sakuyama ,  Masayuki Ochiai ,  Ichiro Yamaguchi ,  Joji Fujimori

发明人： Seiki Sakuyama ,  Masayuki Ochiai ,  Ichiro Yamaguchi ,  Joji Fujimori

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  H01L24/11 ,  H01L24/16 ,  H01L2224/03912 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05027 ,  H01L2224/05568 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00

摘要： A method of making a semiconductor device includes a resin film forming step for forming a resin film on a semiconductor substrate 10 provided with electrode portions 11 to cover the electrode portions 11, an opening forming step for forming openings in the resin film at locations corresponding to the electrode portions 11, a loading step for loading a bump material in the openings, a bump forming step for forming bumps 41 in the openings by heating, and a removing step for removing the resin film.

摘要翻译： 制造半导体器件的方法包括：树脂膜形成步骤，用于在设置有电极部分11的半导体衬底10上形成树脂膜以覆盖电极部分11;开口形成步骤，用于在树脂膜中形成开口， 电极部分11，用于将凸起材料装载在开口中的装载步骤，用于通过加热在凸起部分形成凸块41的凸块形成步骤，以及去除树脂薄膜的去除步骤。

公开(公告)号：US06528346B2

公开(公告)日：2003-03-04

申请号：US09749521

申请日：2000-12-28

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC分类号： H01L2148

CPC分类号： B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05599

摘要： First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate 20 are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate 10. The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.

摘要翻译： 制备第一和第二球形成板。 第一板的空腔和第二板20的空腔分别用焊膏填充。 第一板和第二板相互放置成面对的关系，并加热形成金属球，每个金属球对应于第一板的一个空腔中的焊膏的总金属成分和第二板中的一个空腔。 金属球形成在下板10的空腔中。金属球从第一板的空腔传送到要在其上形成凸块的装置。

公开(公告)号：US6025258A

公开(公告)日：2000-02-15

申请号：US516284

申请日：1995-08-17

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC分类号： B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/283

CPC分类号： H01L24/742 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H05K3/3484 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H05K3/3463 ,  H05K3/3489

摘要： A method for fabricating solder bumps onto a semiconductor chip. A solder ball forming member having a flat surface and a plurality of cavities arranged on the flat surface in a predetermined pattern is prepared. The cavities are then filled with a solder paste, and the solder ball forming member is heated to a temperature higher than the melting point of the solder so that the molten solder powder in the solder paste form solder balls due to surface tension. The semiconductor chip is then moved toward the solder ball forming member to transfer the heated solder balls from the solder ball forming member to the semiconductor chip.

摘要翻译： 一种用于在半导体芯片上制造焊料凸块的方法。 制备具有平坦表面的焊球形成构件和以预定图案布置在平坦表面上的多个空腔。 然后用焊膏填充空腔，并将焊球形成构件加热到高于焊料熔点的温度，使得焊膏中的熔融焊料粉由于表面张力而形成焊球。 然后将半导体芯片移动到焊球形成部件，以将加热的焊球从焊球形成部件转移到半导体芯片。

公开(公告)号：US5643831A

公开(公告)日：1997-07-01

申请号：US547532

申请日：1995-10-24

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi ,  Yutaka Yamada ,  Susumu Abe

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi ,  Yutaka Yamada ,  Susumu Abe

IPC分类号： B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/283

CPC分类号： H05K3/3484 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/1476 ,  H05K3/3463 ,  H05K3/3489

摘要： A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a crystallographic plane, and an orientation flat in a crystallographic plane. The cavities are formed on the flat surface of the plate by etching, using a mask having openings in the shape of rhombus arranged such that one side of the rhombus is generally parallel to the crystallographic plane. As a result, the cavities having wedge-shaped bottom are formed. The cavities are then filled with a solder paste and are heated to form solder balls in the cavities while the plate in an inclined position. The solder balls are then transferred from the plate to a semiconductor chip.

摘要翻译： 一种使用具有空腔的焊球形成板制造半导体器件的方法。 该板由具有<110>结晶平面中的平坦表面的硅板制成，并且在<1-11>晶面中平行取向。 通过蚀刻在板的平坦表面上形成空腔，使用具有菱形形状的开口的掩模，其布置成使得菱形的一侧大致平行于<1-11>晶面。 结果，形成了具有楔形底部的空腔。 然后用焊膏填充空腔，并在板中处于倾斜位置的同时加热以在空腔中形成焊球。 然后将焊球从板转移到半导体芯片。

公开(公告)号：US06319810B1

公开(公告)日：2001-11-20

申请号：US08659356

申请日：1996-06-06

申请人： Masayuki Ochiai ,  Yasuo Yamagishi ,  Ichiro Yamaguchi ,  Masahiro Yoshikawa ,  Koki Otake ,  Masataka Mizukoshi ,  Yuuji Watanabe

发明人： Masayuki Ochiai ,  Yasuo Yamagishi ,  Ichiro Yamaguchi ,  Masahiro Yoshikawa ,  Koki Otake ,  Masataka Mizukoshi ,  Yuuji Watanabe

IPC分类号： H01L2144

CPC分类号： H01L24/12 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/48

摘要： Method for forming solder bumps on a first member such as a semiconductor chip having electrode pads formed thereon. A flat plate having holes is prepared and the holes are filled with solder paste by squeezing. The flat plate is then overlapped with the first member with the flat plate above the first plate. The flat plate and the first member are heated to a temperature higher than the melting point of the solder alloy in the solder paste. Therefore, solder bumps having identical sizes and uniform structures can be obtained.

摘要翻译： 在诸如其上形成有电极焊盘的半导体芯片的第一部件上形成焊料凸块的方法。 准备具有孔的平板，并通过挤压填充焊膏。 然后平板与第一构件重叠，平板在第一板上。 平板和第一构件被加热到高于焊膏中的焊料合金的熔点的温度。 因此，可以获得具有相同尺寸和均匀结构的焊料凸块。

公开(公告)号：US5695571A

公开(公告)日：1997-12-09

申请号：US252174

申请日：1994-06-01

申请人： Keiji Watanabe ,  Masayuki Ochiai ,  Yasuo Yamagishi ,  Ei Yano ,  Nobuo Igusa ,  Isamu Takachi

发明人： Keiji Watanabe ,  Masayuki Ochiai ,  Yasuo Yamagishi ,  Ei Yano ,  Nobuo Igusa ,  Isamu Takachi

IPC分类号： B08B3/08 ,  B23K1/00 ,  B23K1/20 ,  C11D7/24 ,  C11D7/26 ,  C11D7/32 ,  C11D7/50 ,  C11D7/60 ,  C11D11/00 ,  C23G5/02 ,  C23G5/024 ,  C23G5/032 ,  C23G5/04 ,  H05K3/26

CPC分类号： C11D7/262 ,  B23K1/203 ,  C11D11/0047 ,  C11D7/261 ,  C11D7/263 ,  C11D7/264 ,  C11D7/266 ,  C11D7/3227 ,  C11D7/5022 ,  C11D7/5027 ,  C23G5/024 ,  C23G5/032 ,  C23G5/04 ,  H05K3/26 ,  C11D7/24 ,  C11D7/265 ,  H05K2203/0257 ,  H05K2203/0783 ,  H05K2203/086 ,  H05K2203/1518

摘要： The defluxing agent for flux residue after soldering contains an acid (preferably an organic acid, and particularly an acid stronger than abietic acid; for example, acrylic acid, acetic acid, propionic acid, benzoic acid) and an organic solvent (for example, xylene, benzyl acetate, methyl .alpha.-hydroxyisobutyrate, cyclohexanone, methyl .beta.-methoxyisobutyrate), and if necessary it further contains a monohydric alcohol, a surfactant and a corrosion inhibitor. Rinsing is preferably performed after the cleaning, using a solvent which is miscible with the defluxing agent, in order to completely remove the acid. There is also disclosed a cleaning apparatus which may be generally used for this and other cleaning.

摘要翻译： 焊接后的焊剂残渣的脱焊剂含有酸（优选为有机酸，特别是比松香酸强的酸），例如丙烯酸，乙酸，丙酸，苯甲酸）和有机溶剂（例如二甲苯 ，乙酸苄酯，α-羟基异丁酸甲酯，环己酮，β-甲氧基异丁酸甲酯），如果需要，它还含有一元醇，表面活性剂和缓蚀剂。 优选在使用与脱流剂混溶的溶剂进行清洗之后进行冲洗以完全除去酸。 还公开了一般可用于这种和其他清洁的清洁装置。

公开(公告)号：US4759490A

公开(公告)日：1988-07-26

申请号：US109791

申请日：1987-10-16

申请人： Masayuki Ochiai

发明人： Masayuki Ochiai

IPC分类号： B23K35/22 ,  B23K35/36 ,  B23K35/363 ,  H05K3/34 ,  B23K31/02

CPC分类号： B23K35/3615 ,  B23K35/36 ,  H05K3/3489

摘要： A soldering method using a solder paste composed of solder alloy powder and soldering flux comprising rosin, thixotropic agent, activator, organic solvent and azobis compound such as 1,1'-azobis (cyclohexane-1-carbonitrile) as a free radical generator. The 1,1'-azobis (cyclohexane-1-carbonitrile) generates free radicals of cychlohexane-1-carbonitrile when heated in soldering, and the generated free radicals urge the activator to liberate hydrogen halide which enhances a removing effect of oxide film over a metal surface to be soldered. The azobis compound contributes to diminish the amount of activator and, consequently, hydrogen halide in the flux. The viscosity of the solder paste does not vary for a long time, which results in allowing the solder paste have a long shelf life. Since generation of the free radical is not decreased even though a soldering temperature decreased, which results in increasing solderability for low temperature soldering.

公开(公告)号：US10426813B2

公开(公告)日：2019-10-01

申请号：US13508163

申请日：2010-11-05

申请人： Masayuki Ochiai ,  Koji Morishita ,  Miho Komatsu ,  Kentaro Sugimura

发明人： Masayuki Ochiai ,  Koji Morishita ,  Miho Komatsu ,  Yoichiro Sugimura

IPC分类号： A61K38/05 ,  A61K31/198

摘要： The present invention relates to a method of enhancing endurance of a human subject through administration of alanyl-glutamine or alanyl-glutamine salt. The invention includes unexpected discovery of alanyl-glutamine or alanyl-glutamine salt enhancing durability and endurance of human subject independent of an increase in the blood glutamine level.

公开(公告)号：US06867378B2

公开(公告)日：2005-03-15

申请号：US10078424

申请日：2002-02-21

申请人： Hiroki Uchida ,  Masayuki Ochiai

发明人： Hiroki Uchida ,  Masayuki Ochiai

IPC分类号： B23K1/00 ,  B23K35/02 ,  B23K35/22 ,  B23K35/26 ,  H05K3/34 ,  H05K1/16

CPC分类号： B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H05K3/3421 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218

摘要： A solder paste contains a solder alloy powder and a metal powder dispersed in a flux. The solder alloy contains Sn and Zn, whereas the metal powder contains at least one element selected from the group consisting of Pd, Ti, and Ni. Preferably, the metal powder is contained in an amount exceeding the solubility limit of the metal powder with respect to the solder alloy at the melting point of the solder alloy powder. The solder paste may be used to form a structure for electrically connecting two objects by interposing a solder layer between their terminals.

摘要翻译： 焊膏含有分散在焊剂中的焊料合金粉末和金属粉末。 焊料合金含有Sn和Zn，而金属粉末含有选自Pd，Ti和Ni中的至少一种元素。 优选地，在焊料合金粉末的熔点，金属粉末的含量超过金属粉末相对于焊料合金的溶解度极限的量。 焊膏可以用于形成用于通过在其端子之间插入焊料层来电连接两个物体的结构。

公开(公告)号：US06712513B2

公开(公告)日：2004-03-30

申请号：US09790532

申请日：2001-02-23

申请人： Katsuhiko Tanaka ,  Ikunori Sakatani ,  Yukio Higuchi ,  Takenobu Otsubo ,  Masayuki Ochiai

发明人： Katsuhiko Tanaka ,  Ikunori Sakatani ,  Yukio Higuchi ,  Takenobu Otsubo ,  Masayuki Ochiai

IPC分类号： F16C3206

CPC分类号： F16C33/107 ,  F16C33/12 ,  H02K7/085

摘要： A fluid bearing device achieves superior in wear start-stop resistance and in manufacturing ability. The fluid bearing device includes a shaft having a flange portion, a sleeve opposing to the shaft across a fluid bearing clearance of a radial fluid bearing, a counterpart member opposing to at least one of plane of the flange portion across a fluid bearing clearance of a thrust bearing. The flange portion and the sleeve portion being formed of copper alloy of mutually difference composition.

摘要翻译： 流体轴承装置实现了优异的耐磨起始阻力和制造能力。 所述流体轴承装置包括轴，所述轴具有凸缘部分，与所述轴相对的套筒，跨越所述径向流体轴承的流体轴承间隙;与所述凸缘部分的至少一个平面相对的对应构件， 推力轴承。 凸缘部分和套筒部分由相互不同组成的铜合金形成。