公开(公告)号：US07995161B2

公开(公告)日：2011-08-09

申请号：US12338722

申请日：2008-12-18

申请人： Shin Ito ,  Masato Sumikawa ,  Yutaka Okada

发明人： Shin Ito ,  Masato Sumikawa ,  Yutaka Okada

IPC分类号： G02F1/1335

CPC分类号： G02B6/0073 ,  G02B6/0021

摘要： A surface light source includes a light source and an optical waveguide plate. The light source serves to emit light. The optical waveguide plate has an incident end face where the light is incident and a light exit surface where the light incident on the incident end face exits. Further, the optical waveguide plate has a refractive index n. The incident end face has a plurality of concave portions. The angle between a plane formed by the plurality of concave portions and a tangent plane of the incident end face is not more than (90−2·arcsin(1/n)) degree.

摘要翻译： 面光源包括光源和光波导板。 光源用于发光。 光波导板具有光入射的入射端面和入射在入射端面的光离开的光出射面。 此外，光波导板具有折射率n。 入射端面具有多个凹部。 由多个凹部形成的平面与入射端面的切线角之间的角度不大于（90-2·arcsin（1 / n）））。

公开(公告)号：US20090167989A1

公开(公告)日：2009-07-02

申请号：US12338722

申请日：2008-12-18

申请人： Shin ITO ,  Masato Sumikawa ,  Yutaka Okada

发明人： Shin ITO ,  Masato Sumikawa ,  Yutaka Okada

IPC分类号： G02F1/1335 ,  F21V7/04

CPC分类号： G02B6/0073 ,  G02B6/0021

摘要： A surface light source includes a light source and an optical waveguide plate. The light source serves to emit light. The optical waveguide plate has an incident end face where the light is incident and a light exit surface where the light incident on the incident end face exits. Further, the optical waveguide plate has a refractive index n. The incident end face has a plurality of concave portions. The angle between a plane formed by the plurality of concave portions and a tangent plane of the incident end face is not more than (90−2·arcsin(1/n)) degree.

摘要翻译： 面光源包括光源和光波导板。 光源用于发光。 光波导板具有光入射的入射端面和入射在入射端面的光离开的光出射面。 此外，光波导板具有折射率n。 入射端面具有多个凹部。 由多个凹部形成的平面与入射端面的切面之间的角度不大于（90·2.acsin（1 / n）））。

公开(公告)号：US07692312B2

公开(公告)日：2010-04-06

申请号：US11477928

申请日：2006-06-30

申请人： Masato Sumikawa ,  Kazumi Tanaka

发明人： Masato Sumikawa ,  Kazumi Tanaka

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3171 ,  H01L23/293 ,  H01L23/296 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2924/01004 ,  H01L2924/01012 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/3511

摘要： A semiconductor package providing with a printed circuit board and a semiconductor device, including a semiconductor substrate having a surface provided with an external connection electrode and mounted on the printed circuit board, and, a surface opposite that with said external connection electrode, abrased with a mirror finish and reinforced with a back-surface reinforcement.

摘要翻译： 一种提供印刷电路板和半导体器件的半导体封装，包括具有设置有外部连接电极并安装在印刷电路板上的表面的半导体衬底，以及与所述外部连接电极相反的表面，用 镜面加工和后表面加固。

公开(公告)号：US06441500B1

公开(公告)日：2002-08-27

申请号：US09660477

申请日：2000-09-12

申请人： Masato Sumikawa ,  Kazumi Tanaka ,  Tomotoshi Sato

发明人： Masato Sumikawa ,  Kazumi Tanaka ,  Tomotoshi Sato

IPC分类号： H01L2940

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/94 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/03 ,  H01L2224/11

摘要： A semiconductor device having a plurality of externally connecting electrodes arranged on a semiconductor chip includes on-chip electrodes, resin members formed separately from each other and provided corresponding to the plurality of externally connecting electrodes, and interconnections connecting the corresponding on-chip electrode and the corresponding externally connecting electrode. Such separately formed resin members for the externally connecting electrodes allow relaxation of thermal stress produced in the externally connecting electrodes.

摘要翻译： 布置在半导体芯片上的具有多个外部连接电极的半导体器件包括：片上电极，与多个外部连接电极相对应设置的彼此分开形成的树脂部件，以及连接相应的片上电极和 相应的外部连接电极。 用于外部连接电极的这种单独形成的树脂构件允许释放在外部连接电极中产生的热应力。

公开(公告)号：US07038144B2

公开(公告)日：2006-05-02

申请号：US10040804

申请日：2001-11-08

申请人： Masao Yasuda ,  Masato Sumikawa

发明人： Masao Yasuda ,  Masato Sumikawa

IPC分类号： H05K1/16

CPC分类号： H01L24/10 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/0212 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/10234 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012 ,  H01L2924/01074 ,  H01L2924/013

摘要： An electronic component having an electrode structure to increase an allowance positional deviation in a mounting process as well as a method and a structure for mounting a semiconductor device are provided. The semiconductor device includes, on electrodes, connection materials connecting the semiconductor device and a substrate. The connection materials include a composite connection material formed of a core and a conductor covering the core, the core having an a low modulus of elasticity at room temperature smaller than that of the conductor at room temperature, and a single-layer connection material formed of a conductor.

公开(公告)号：US06362529B1

公开(公告)日：2002-03-26

申请号：US09667587

申请日：2000-09-22

申请人： Masato Sumikawa ,  Kazumi Tanaka

发明人： Masato Sumikawa ,  Kazumi Tanaka

IPC分类号： H01L2940

CPC分类号： H01L25/0657 ,  H01L23/481 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05671 ,  H01L2224/16 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014

摘要： A stacked semiconductor device includes a plurality of stacked semiconductor chips, each of the semiconductor chips including a penetrating electrode which penetrates from a front surface to a back surface of the semiconductor chip, a first electrode formed on the front surface, a second electrode formed on the back surface and wiring patterns formed on the front and back surfaces for selectively connecting the first and second electrodes through the penetrating electrode, the first electrode of a lower semiconductor chip abutting the second electrode of an upper semiconductor chip with respect to adjacent two of the stacked semiconductor chips.

摘要翻译： 叠层半导体器件包括多个堆叠的半导体芯片，每个半导体芯片包括从半导体芯片的前表面到后表面穿透的穿透电极，形成在前表面上的第一电极，形成在第一电极上的第二电极 形成在前表面和后表面上的背面和布线图案，用于通过穿透电极选择性地连接第一和第二电极，下半导体芯片的第一电极邻接上半导体芯片的第二电极相对于相邻的两个 堆叠半导体芯片。

公开(公告)号：US20130094245A1

公开(公告)日：2013-04-18

申请号：US13701132

申请日：2011-02-04

申请人： Hirofumi Kanda ,  Masato Sumikawa ,  Takeshi Takayama ,  Koyu Sakai ,  Keiko Mori

发明人： Hirofumi Kanda ,  Masato Sumikawa ,  Takeshi Takayama ,  Koyu Sakai ,  Keiko Mori

IPC分类号： F21V29/00

CPC分类号： G02B6/0085 ,  G02F1/133615 ,  G02F2001/133628

摘要： Provided are a lighting apparatus capable of improving heat-releasing performance while maintaining structural strength, subduing luminance unevenness due to uneven heat distribution, and allowing the device to be thinner, and an image display apparatus including the lighting apparatus. A heat-conducting member (6) includes: a light-source supporter having a plane facing a light-incident plane; and a plate section having a plane facing a light-emitting plane and a plane facing a heat-releasing member (5), the light-source supporter being adjacent to the plate section. On the light-source supporter, a light source (7) is positioned on the plane facing the light-incident plane so as to face the light-incident plane, the plane of the plate section which faces the heat-releasing member (5) contacts a plane of the heat-releasing member (5) which faces a light guide member, and a centroid of the plate section deviates along a direction parallel to both the light-incident and light-emitting planes.

摘要翻译： 提供一种能够在保持结构强度，降低由于不均匀的热分布导致的亮度不均匀性和允许该装置更薄的同时提高散热性能的照明装置，以及包括该照明装置的图像显示装置。 导热构件（6）包括：具有面向光入射面的平面的光源支撑件; 以及具有面向发光面的面和面向散热构件（5）的平面的板部，所述光源支撑体与所述板部相邻。 在光源支架上，光源（7）位于面对光入射面的平面上，以面对光入射面，板部的面向散热构件（5）的平面， 接触散热构件（5）的面向导光构件的平面，并且板部分的质心沿着平行于光入射和发光平面的方向偏离。

公开(公告)号：US08068194B2

公开(公告)日：2011-11-29

申请号：US12137197

申请日：2008-06-11

申请人： Shin Itoh ,  Masato Sumikawa ,  Yoshinobu Nakamura ,  Masahiro Ikehara ,  Tsukasa Inoguchi

发明人： Shin Itoh ,  Masato Sumikawa ,  Yoshinobu Nakamura ,  Masahiro Ikehara ,  Tsukasa Inoguchi

IPC分类号： G02F1/1333

CPC分类号： G02F1/133603 ,  G02B6/0018 ,  G02B6/0023 ,  G02B6/003 ,  G02B6/0068 ,  G02F2001/133607 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In the line light source device and the plane light emission device, first recesses 14 are formed between adjoining light emission elements 5, on surfaces of sealing resin layers 10 opposite to the board 4. The line light source device and the plane light emission device, in which the light emission elements are coated with resin, have a simple configuration and high uniformity in luminous intensity in an emission end face of the device.

摘要翻译： 在线光源装置和平面发光装置中，在与基板4相对的密封树脂层10的表面上，在相邻的发光元件5之间形成有第一凹部14.线光源装置和平面发光装置， 其中发光元件涂覆有树脂，在器件的发射端面中具有简单的结构和高的发光强度均匀性。

公开(公告)号：US20090296017A1

公开(公告)日：2009-12-03

申请号：US12137197

申请日：2008-06-11

申请人： Shin Itoh ,  Masato Sumikawa ,  Yoshinobu Nakamura ,  Masahiro Ikehara ,  Tsukasa Inoguchi

发明人： Shin Itoh ,  Masato Sumikawa ,  Yoshinobu Nakamura ,  Masahiro Ikehara ,  Tsukasa Inoguchi

IPC分类号： G02F1/1335 ,  F21S4/00 ,  F21V9/16 ,  F21V21/00

CPC分类号： G02F1/133603 ,  G02B6/0018 ,  G02B6/0023 ,  G02B6/003 ,  G02B6/0068 ,  G02F2001/133607 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In the line light source device and the plane light emission device, first recesses 14 are formed between adjoining light emission elements 5, on surfaces of sealing resin layers 10 opposite to the board 4. The line light source device and the plane light emission device, in which the light emission elements are coated with resin, have a simple configuration and high uniformity in luminous intensity in an emission end face of the device.

摘要翻译： 在线光源装置和平面发光装置中，在与基板4相对的密封树脂层10的表面上，在相邻的发光元件5之间形成有第一凹部14.线光源装置和平面发光装置， 其中发光元件涂覆有树脂，在器件的发射端面具有简单的结构和高的发光强度均匀性。

公开(公告)号：US20070084904A1

公开(公告)日：2007-04-19

申请号：US10557698

申请日：2004-05-24

申请人： Masato Sumikawa ,  Rina Murayama ,  Masashi Ogawa ,  Kiyoto Matsushita

发明人： Masato Sumikawa ,  Rina Murayama ,  Masashi Ogawa ,  Kiyoto Matsushita

IPC分类号： A47J36/02

CPC分类号： H05K3/3436 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/05655 ,  H01L2224/11 ,  H05K3/3463 ,  H05K2201/10234 ,  Y02P70/613 ,  H01L2924/00014

摘要： A conductive ball is formed by coating a generally spherical-shaped core made of a non-metallic material with a coating layer composed of a Cu layer and an Sn-5.5Ag alloy layer of non-eutectic composition. The conductive ball is disposed on a land of an electronic component via flux and reflown at heating temperatures whose peak temperatures reach 250 to 260° C. The Sn-5.5Ag alloy of non-eutectic composition is put in the state in which a solidus portion and a liquidus portion coexist to keep flowability relatively small. The conductive ball is fixed on the land without exposing an SnCu layer formed on the Cu layer. An electrode is formed without exposing the SnCu layer having relatively poor solder wettability. Between the electronic component and a circuit board, a joint section having a good electric conduction property and mechanical strength may be formed.

摘要翻译： 通过涂覆由非金属材料制成的大致球形的芯由具有Cu层和非共晶组成的Sn-5.5Ag合金层的涂层形成导电球。 导电球通过焊剂置于电子部件的焊盘上，并在峰值温度达到250〜260℃的加热温度下进行退火。将非共晶组合物的Sn-5.5Ag合金置于固体部分 并且液相部分共存以保持流动性相对较小。 导电球固定在焊盘上，而不暴露形成在Cu层上的SnCu层。 形成电极，而不会使焊锡润湿性差的SnCu层露出。 在电子部件与电路基板之间，可以形成具有良好的导电性和机械强度的接合部。