公开(公告)号：US5360837A

公开(公告)日：1994-11-01

申请号：US990000

申请日：1992-12-11

申请人： Shiro Honda ,  Yasushi Sawamura ,  Masayuki Tanaka ,  Keiji Kayaba ,  Toshihiro Teshiba

发明人： Shiro Honda ,  Yasushi Sawamura ,  Masayuki Tanaka ,  Keiji Kayaba ,  Toshihiro Teshiba

IPC分类号： C08G59/22 ,  C08G59/24 ,  C08K7/18 ,  H01L23/29 ,  C08K7/08

CPC分类号： H01L23/293 ,  C08G59/226 ,  C08G59/245 ,  C08K7/18 ,  H01L2924/0002

摘要： Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A) containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.

摘要翻译： 公开了一种半导体器件封装环氧树脂组合物，其包含（i）含有具有联苯骨架的双官能环氧树脂（a1）和具有萘骨架的双官能环氧树脂（a2）中的至少一种的环氧树脂（A）（ ii）固化剂（B），和（iii）含有特定种类和特定平均粒径的熔融二氧化硅（C）的填料。 该组合物具有优异的焊料耐热性，并且在热循环之后的进一步的可靠性以及焊锡浴浸渍后的可靠性。

公开(公告)号：US5567749A

公开(公告)日：1996-10-22

申请号：US328617

申请日：1994-10-25

申请人： Yasushi Sawamura ,  Toshihiro Teshiba ,  Masayuki Tanaka

发明人： Yasushi Sawamura ,  Toshihiro Teshiba ,  Masayuki Tanaka

IPC分类号： C08G59/24 ,  C08G59/62 ,  H01L23/29 ,  C08L63/00

CPC分类号： C08G59/621 ,  C08G59/245 ,  H01L23/293 ,  H01L2924/0002

摘要： A semiconductor-encapsulating composition comprised of (i) an epoxy resin preferably containing a bifunctional biphenyl-skeletal epoxy resin and/or a bifunctional naphthalene-skeletal epoxy resin, (ii) a curing agent containing 4,4'-dihydroxybiphenyl, and (iii) 70 to 95% by weight, based on the total epoxy resin composition, of a filler.

摘要翻译： 一种半导体封装组合物，其包含（i）优选含有双官能联苯骨架环氧树脂和/或双功能萘骨架环氧树脂的环氧树脂，（ii）含有4,4'-二羟基联苯的固化剂和（iii ）基于总环氧树脂组合物70至95重量％的填料。

公开(公告)号：US5476884A

公开(公告)日：1995-12-19

申请号：US312672

申请日：1994-09-28

申请人： Keiji Kayaba ,  Yasushi Sawamura ,  Masayuki Tanaka

发明人： Keiji Kayaba ,  Yasushi Sawamura ,  Masayuki Tanaka

IPC分类号： H01L23/29 ,  C08L63/00 ,  C08K7/08

CPC分类号： H01L23/293 ,  H01L23/295 ,  H01L2924/0002

摘要： Disclosed is a semiconductor-encapsulating epoxy resin composition comprising (A) an epoxy resin. (B) a curing agent, and (C) fused silica which has been surface-treated with a silane coupling agent having a secondary amino group. This composition has a good moldability and reliability, and a good solder dipping stability.

摘要翻译： 公开了包含（A）环氧树脂的半导体封装环氧树脂组合物。 （B）固化剂，（C）已经用具有仲氨基的硅烷偶联剂表面处理的熔融二氧化硅。 该组合物具有良好的成型性和可靠性，以及良好的焊料浸渍稳定性。

公开(公告)号：US5854316A

公开(公告)日：1998-12-29

申请号：US793460

申请日：1997-02-26

申请人： Ken Shimizu ,  Yasushi Sawamura ,  Masayuki Tanaka

发明人： Ken Shimizu ,  Yasushi Sawamura ,  Masayuki Tanaka

IPC分类号： C08K3/22 ,  H01L23/29 ,  C08L63/00

CPC分类号： H01L23/295 ,  C08K3/22 ,  H01L23/293 ,  H01L2924/0002

摘要： An epoxy resin composition composed of an epoxy resin (A), a hardener (B), and an inorganic filler (C), characterized in that the content of the inorganic filler (C) is 70-97 wt % and the inorganic filler (C) contains 0.1-50 wt % of alumina. When used to seal semiconductor devices, it exhibits good moldability and imparts to the sealed semiconductors good flame retardance, solder heat resistance, and reliability at high temperatures.

摘要翻译： PCT No.PCT / JP96 / 01919 Sec。 371日期1996年2月26日 102（e）1996年2月26日PCT 1996年7月10日PCT公布。 公开号WO97 / 03129 日本1997年1月30日由环氧树脂（A），固化剂（B）和无机填料（C）组成的环氧树脂组合物，其特征在于，无机填料（C）的含量为70-97重量％ 无机填料（C）含有0.1-50重量％的氧化铝。 当用于密封半导体器件时，其表现出良好的成型性，并赋予密封半导体良好的阻燃性，焊料耐热性和高温下的可靠性。

公开(公告)号：US5985455A

公开(公告)日：1999-11-16

申请号：US95632

申请日：1998-06-11

申请人： Atsuto Tokunaga ,  Yasushi Sawamura ,  Masayuki Tanaka

发明人： Atsuto Tokunaga ,  Yasushi Sawamura ,  Masayuki Tanaka

IPC分类号： C08G59/24 ,  C08G59/62 ,  C08K3/36 ,  C08L63/00 ,  H01L23/29 ,  B32B27/38 ,  H01L21/203

CPC分类号： C08G59/245 ,  C08G59/621 ,  C08K3/36 ,  C08L63/00 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  Y10S524/919 ,  Y10T428/31511 ,  Y10T428/31529

摘要： Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt % of synthetic silica and 99-1 wt % of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.

摘要翻译： 本文公开了包含环氧树脂（A），固化剂（B）和无机填料的环氧树脂化合物，其特征在于，所述无机填料含有二氧化硅（C）作为必要成分，所述固化剂（B）是 在分子中含有至少两个酚羟基和/或萘酚羟基，所述二氧化硅（C）含有1-99重量％的合成二氧化硅和99-1重量％的天然熔融二氧化硅。 此处还公开了一种其中密封有所述环氧树脂化合物的半导体元件的半导体器件。 环氧树脂化合物在成型时不会引起诸如短丸，树脂剥离，断线，阶段偏移和排气堵塞等问题。 此外，当用作密封材料时，它产生在高温和高湿度下具有良好的可靠性以及良好的耐焊接热的半导体器件。

公开(公告)号：US5798400A

公开(公告)日：1998-08-25

申请号：US696916

申请日：1996-08-22

申请人： Atsuto Tokunaga ,  Yasushi Sawamura ,  Masayuki Tanaka

发明人： Atsuto Tokunaga ,  Yasushi Sawamura ,  Masayuki Tanaka

IPC分类号： C08G59/24 ,  C08G59/62 ,  C08K3/36 ,  C08L63/00 ,  H01L23/29

CPC分类号： C08G59/245 ,  C08G59/621 ,  C08K3/36 ,  C08L63/00 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  Y10S524/919 ,  Y10T428/31511 ,  Y10T428/31529

摘要： Disclosed herein is an epoxy resin compound including an epoxy resin (A), a hardener (B), and an inorganic filler, characterized in that said inorganic filler contains silica (C) as an essential component, said hardener (B) is one which contains at least two phenolic hydroxyl groups and/or naphtholic hydroxyl groups in the molecule, and said silica (C) contains 1-99 wt % of synthetic silica and 99-1 wt % of natural fused silica. Disclosed also herein is a semiconductor device having a semiconductor element sealed therein with said epoxy resin compound. The epoxy resin compound does not cause such troubles as short shot, resin peeling, wire breakage, stage shift, and vent clogging at the time of molding. In addition, when used as a sealing material, it yields semiconductor devices which have good reliability at high temperature and high humidity and good resistance to soldering heat.

摘要翻译： PCT No.PCT / JP95 / 02742 Sec。 371日期：1996年8月22日 102（e）日期1996年8月22日PCT 1995年12月27日PCT PCT。 第WO96 / 20969号公报 日期1996年7月11日公开的是包含环氧树脂（A），固化剂（B）和无机填料的环氧树脂化合物，其特征在于，所述无机填料含有二氧化硅（C）作为必要成分，所述固化剂（ B）是分子中含有至少两个酚羟基和/或萘酚羟基的化合物，所述二氧化硅（C）含有1-99重量％的合成二氧化硅和99-1重量％的天然熔融二氧化硅。 此处还公开了一种其中密封有所述环氧树脂化合物的半导体元件的半导体器件。 环氧树脂化合物在成型时不会引起诸如短丸，树脂剥离，断线，阶段偏移和排气堵塞等问题。 此外，当用作密封材料时，它产生在高温和高湿度下具有良好的可靠性以及良好的耐焊接热的半导体器件。

公开(公告)号：US20100193961A1

公开(公告)日：2010-08-05

申请号：US12678890

申请日：2008-09-12

申请人： Yukitsuna Konishi ,  Hirohumi Tsuchiya ,  Shinsuke Kimura ,  Yasushi Sawamura

发明人： Yukitsuna Konishi ,  Hirohumi Tsuchiya ,  Shinsuke Kimura ,  Yasushi Sawamura

IPC分类号： H01L23/522 ,  C08L63/00 ,  C08K5/3475 ,  B32B33/00

CPC分类号： C09J183/04 ,  C08L33/08 ,  C08L63/00 ,  C08L83/00 ,  C08L83/04 ,  C08L2666/02 ,  C08L2666/14 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2483/00 ,  H01L23/296 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/73253 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  Y10T428/1471 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20305 ,  H01L2224/0401

摘要： In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is −10° C. to 50° C. and the rate of change of Tg after heat-treating the composition at 175° C. for 1000 hours is 15% or less.

摘要翻译： 为了提供在长期高温条件下，耐热循环性和绝缘可靠性优异的电子部件用粘合剂组合物，是含有热塑性树脂（a），环氧树脂（a）， （b），硬化剂（c）和有机聚硅氧烷（d），其中固化后的玻璃化转变温度（Tg）为-10℃〜50℃，热处理后的Tg变化率 175℃下1000小时的组成为15％以下。

公开(公告)号：US06303219B1

公开(公告)日：2001-10-16

申请号：US08945221

申请日：1997-12-01

申请人： Yasushi Sawamura ,  Shoji Kigoshi ,  Taku Hatano ,  Yukitsuna Konishi ,  Yoshio Ando

发明人： Yasushi Sawamura ,  Shoji Kigoshi ,  Taku Hatano ,  Yukitsuna Konishi ,  Yoshio Ando

IPC分类号： H01L2160

CPC分类号： H01L24/50 ,  C08G59/245 ,  C08L55/00 ,  C08L77/00 ,  C08L2666/02 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, (III) biphenyl skeleton-containing epoxy resins and (IV) naphthalene skeleton-containing epoxy resins as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 60 to 110° C. after having been cured and 50 hours or more in the insulation resistance dropping time after having been allowed to stand in an environment of 130° C. and 85% RH with DC 100 V applied; and a tape with adhesive for wire bonding connection consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film, wherein said adhesive layer has a softening temperature of 120 to 170° C. after having been cured, a storage elastic modulus E′ of 20 to 100 MPa at 150° C. and an insulation resistance dropping time of 50 hours or more after having been allowed to stand in an environment of 130° C. and 85% RH with DC 100 V applied. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

公开(公告)号：US08138580B2

公开(公告)日：2012-03-20

申请号：US12678890

申请日：2008-09-12

申请人： Yukitsuna Konishi ,  Hirohumi Tsuchiya ,  Shinsuke Kimura ,  Yasushi Sawamura

发明人： Yukitsuna Konishi ,  Hirohumi Tsuchiya ,  Shinsuke Kimura ,  Yasushi Sawamura

IPC分类号： H01L23/58

CPC分类号： C09J183/04 ,  C08L33/08 ,  C08L63/00 ,  C08L83/00 ,  C08L83/04 ,  C08L2666/02 ,  C08L2666/14 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2483/00 ,  H01L23/296 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4824 ,  H01L2224/73253 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  Y10T428/1471 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20305 ,  H01L2224/0401

摘要： In order to provide an adhesive composition for electronic components that is excellent in adhesion durability under long-term high temperature conditions, thermal cyclability, and insulation reliability, designed is an adhesive composition for electronic components containing a thermoplastic resin (a), an epoxy resin (b), a hardener (c), and an organopolysiloxane (d), wherein the glass transition temperature (Tg) after curing is −10° C. to 50° C. and the rate of change of Tg after heat-treating the composition at 175° C. for 1000 hours is 15% or less.

摘要翻译： 为了提供在长期高温条件下，耐热循环性和绝缘可靠性优异的电子部件用粘合剂组合物，是含有热塑性树脂（a），环氧树脂（a）， （b），硬化剂（c）和有机聚硅氧烷（d），其中固化后的玻璃化转变温度（Tg）为-10℃〜50℃，热处理后的Tg变化率 175℃下1000小时的组成为15％以下。

公开(公告)号：US06716529B2

公开(公告)日：2004-04-06

申请号：US09940513

申请日：2001-08-29

申请人： Yasushi Sawamura ,  Shoji Kigoshi ,  Taku Hatano ,  Yukitsuna Konishi ,  Yoshio Ando

发明人： Yasushi Sawamura ,  Shoji Kigoshi ,  Taku Hatano ,  Yukitsuna Konishi ,  Yoshio Ando

IPC分类号： B32B2738

CPC分类号： H01L24/50 ,  C08G59/245 ,  C08L55/00 ,  C08L77/00 ,  C08L2666/02 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2826 ,  Y10T428/2848 ,  Y10T428/287 ,  Y10T428/2883 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An adhesive sheet for a semiconductor connecting substrate consisting of a laminate having an adhesive layer on a substrate, wherein said adhesive layer contains a thermoplastic resin (A) and an epoxy resin (B) and said epoxy resin (B) contains at least one epoxy resin (B) selected from (I) dicyclopentadiene skeleton-containing epoxy resins, (II) terpene skeleton-containing epoxy resins, and (III) biphenyl skeleton-containing epoxy resins, as an essential component; an adhesive-backed tape for TAB consisting of a laminate having an adhesive layer and a protective film layer on a flexible organic insulating film. The adhesive sheet for a semiconductor connecting substrate, the adhesive-backed tape for TAB and the adhesive-backed tape for wire bonding connection of the present invention are excellent in adhesive strength, insulatability, dimensional accuracy, etc., and can improve the reliability of a semiconductor integrated circuit connecting substrate and a semiconductor device respectively for high density packaging.

摘要翻译： 一种用于半导体连接基板的粘合片，其由在基板上具有粘合剂层的层压体组成，其中所述粘合剂层包含热塑性树脂（A）和环氧树脂（B），并且所述环氧树脂（B）含有至少一种环氧树脂 选自（I）含二环戊二烯骨架的环氧树脂的树脂（B），（II）含萜骨架的环氧树脂和（III）含有联苯骨架的环氧树脂作为必要成分; 用于TAB的粘合剂背衬带由在柔性有机绝缘膜上具有粘合剂层和保护膜层的层压体组成。 用于半导体连接基板的粘合片，用于TAB的粘合剂背衬带和用于本发明的引线接合连接用粘合剂背衬带具有优异的粘合强度，绝缘性，尺寸精度等，并且可以提高 分别用于高密度封装的半导体集成电路连接基板和半导体器件。