公开(公告)号：US20070137794A1

公开(公告)日：2007-06-21

申请号：US11627474

申请日：2007-01-26

申请人： Taiquing Qiu ,  Robert Bailey ,  Helmuth Treichel

发明人： Taiquing Qiu ,  Robert Bailey ,  Helmuth Treichel

IPC分类号： H01L21/306 ,  C23C16/00

CPC分类号： H01L21/67757 ,  C23C16/45504 ,  C23C16/45578 ,  C23C16/45591 ,  C23C16/4584 ,  C23C16/46 ,  H01L21/67109 ,  H01L21/67115

摘要： An apparatus is provided for thermally processing substrates held in a carrier. The apparatus includes an across-flow liner to improve gas flow uniformity across the surface of each substrate. The across-flow liner of the present invention includes a longitudinal bulging section to accommodate a across-flow injection system. The liner is patterned and sized so that it is conformal to the wafer carrier, and as a result, reduces the gap between the liner and the wafer carrier to reduce or eliminate vortices and stagnation in the gap areas between the wafer carrier and the liner inner wall.

摘要翻译： 提供了用于热处理保持在载体中的基板的装置。 该装置包括跨流动衬套，以改善穿过每个衬底的表面的气体流动均匀性。 本发明的横流衬套包括纵向凸起部分以适应横流注入系统。 将衬垫图案化并定尺寸使其与晶片载体保持一致，结果减小衬垫和晶片载体之间的间隙，以减少或消除晶片载体和衬垫内部之间的间隙区域中的涡流和停滞 壁。

公开(公告)号：US20070010072A1

公开(公告)日：2007-01-11

申请号：US11482887

申请日：2006-07-07

申请人： Robert Bailey ,  Taiqing Qiu ,  Cole Porter ,  Olivier Laparra ,  Robert Chatham ,  Martin Mogaard ,  Helmuth Treichel

发明人： Robert Bailey ,  Taiqing Qiu ,  Cole Porter ,  Olivier Laparra ,  Robert Chatham ,  Martin Mogaard ,  Helmuth Treichel

IPC分类号： H01L21/20

CPC分类号： C23C16/54 ,  C23C16/308 ,  C23C16/345 ,  C23C16/402 ,  C23C16/45504 ,  C23C16/45578 ,  H01L21/0214 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02222 ,  H01L21/02271 ,  H01L21/02274 ,  H01L21/3145 ,  H01L21/31612 ,  H01L21/3185

摘要： A batch of wafer substrates is provided with each wafer substrate having a surface. Each surface is coated with a layer of material applied simultaneously to the surface of each of the batch of wafer substrates. The layer of material is applied to a thickness that varies less than four thickness percent across the surface and exclusive of an edge boundary and having a wafer-to-wafer thickness variation of less than three percent. The layer of material so applied is a silicon oxide, silicon nitride or silicon oxynitride with the layer of material being devoid of carbon and chlorine. Formation of silicon oxide or a silicon oxynitride requires the inclusion of a co-reactant. Silicon nitride is also formed with the inclusion of a nitrification co-reactant. A process for forming such a batch of wafer substrates involves feeding the precursor into a reactor containing a batch of wafer substrates and reacting the precursor at a wafer substrate temperature, total pressure, and precursor flow rate sufficient to create such a layer of material. The delivery of a precursor and co-reactant as needed through vertical tube injectors having multiple orifices with at least one orifice in registry with each of the batch of wafer substrates and exit slits within the reactor to create flow across the surface of each of the wafer substrates in the batch provides the within-wafer and wafer-to-wafer uniformity.

摘要翻译： 一批晶片基板设置有每个晶片基板具有表面。 每个表面涂覆有同时施加到每批晶片衬底的表面的一层材料。 该材料层被施加到在整个表面上变化小于四个厚度百分比的厚度，而不是边缘边界，并且晶片到晶片的厚度变化小于3％。 如此施加的材料层是氧化硅，氮化硅或氮氧化硅，其中该材料层不含碳和氯。 氧化硅或氮氧化硅的形成需要包含共反应物。 氮化氮也通过包含硝化共反应物形成。 用于形成这样一批晶片衬底的方法包括将前体进料到含有一批晶片衬底的反应器中，并在足以产生这种材料层的晶片衬底温度，总压力和前体流速下使前体反应。 根据需要通过具有多个孔的垂直管注射器输送前体和共反应物，其中至少一个孔与反应器内的每批晶片基板和出口狭缝对齐，以产生跨过每个晶片的表面的流动 该批次中的衬底提供了晶片内和晶片与晶片之间的均匀性。

公开(公告)号：US5629053A

公开(公告)日：1997-05-13

申请号：US681131

申请日：1991-04-05

申请人： Helmuth Treichel ,  Oswald Spindler ,  Rainer Braun ,  Bernhard Neureither ,  Thomas Kruck

发明人： Helmuth Treichel ,  Oswald Spindler ,  Rainer Braun ,  Bernhard Neureither ,  Thomas Kruck

IPC分类号： C23C16/34 ,  C23C16/50

CPC分类号： C23C16/342

摘要： The method of the present invention provides in a simple manner, the deposition of boron nitride layers with microcrystalline cubic structure which are suitable as insulating layers in VLSI-circuits, as mask membranes in x-ray lithography, as well as coating hard substances. Due to the use of excited starting substances that already contain boron and nitrogen in one molecule and are preferably liquid or solid, and the use of a plasma-CVD-method, the method can be performed using in temperatures of below 500.degree. C. The excitation of the starting substance proceeds preferably in inductive or capacitative fashion in a hollow cathode.

摘要翻译： 本发明的方法以简单的方式提供了适用于VLSI电路中的绝缘层的微晶立方结构的氮化硼层的沉积，x射线光刻中的掩模膜以及涂覆硬物质。 由于在一分子中使用已经含有硼和氮的优选的起始物质，优选为液体或固体，并且使用等离子体CVD法，可以在低于500℃的温度下进行。 起始物质的激发优选以感应或电容方式在中空阴极中进行。

公开(公告)号：US5399389A

公开(公告)日：1995-03-21

申请号：US94337

申请日：1993-07-20

申请人： Konrad Hieber ,  Jasper Von Tomkewitsch ,  Oswald Spindler ,  Helmuth Treichel ,  Zvonimir Gabric ,  Alexander Gschwandtner

发明人： Konrad Hieber ,  Jasper Von Tomkewitsch ,  Oswald Spindler ,  Helmuth Treichel ,  Zvonimir Gabric ,  Alexander Gschwandtner

IPC分类号： C30B29/18 ,  H01L21/316 ,  H01L21/3205 ,  H01L21/768 ,  B05D3/06 ,  H01L21/02

CPC分类号： H01L21/02164 ,  H01L21/02216 ,  H01L21/02271 ,  H01L21/02304 ,  H01L21/02315 ,  H01L21/31612 ,  H01L21/76819

摘要： In the ozone-activated deposition of insulating layers, different growth rates can be achieved on differently constituted surfaces. When the surfaces of the structured silicon substrates lying at different levels are differently constituted or, respectively, are intentionally varied such that the SiO.sub.2 insulating layer grows more slowly on the higher surfaces than on the more deeply disposed surfaces and when deposition is carried out until the surfaces of the rapidly growing and slowly growing layer regions form a step-free, planar level, a local and global planarization is achieved.

摘要翻译： 在绝缘层的臭氧活化沉积中，可以在不同构造的表面上实现不同的生长速率。 当不同层次的结构硅衬底的表面被不同地构成或分别有意地改变，使得SiO 2绝缘层在较高表面上比在更深的设置表面上更缓慢地生长，并且当沉积被执行直到 快速生长和缓慢生长的层区域的表面形成无梯度的平面水平，实现局部和全局平坦化。

公开(公告)号：US20120186572A1

公开(公告)日：2012-07-26

申请号：US13387937

申请日：2010-07-28

申请人： Helmuth Treichel ,  Dave Bohling ,  Mark George

发明人： Helmuth Treichel ,  Dave Bohling ,  Mark George

IPC分类号： H01L21/301 ,  B28D5/00 ,  B23Q11/10

CPC分类号： B28D5/0076

摘要： A process is provided in which a metal chelating agent is dissolved in an aqueous or glycol-based cooling fluid to form a chelating solution with a chelating agent concentration. A silicon boule is cut with a saw to detach a silicon wafer from the boule while the interface between the silicon boule and the saw is bathed with the chelating solution during the cutting.

摘要翻译： 提供了一种方法，其中将金属螯合剂溶解在水性或乙二醇型冷却流体中以形成螯合剂浓度的螯合溶液。 用锯切割硅芯，以从芯片上分离硅晶片，同时在切割期间硅胶和锯之间的界面用螯合溶液浸泡。

公开(公告)号：US20120111360A1

公开(公告)日：2012-05-10

申请号：US12943868

申请日：2010-11-10

申请人： Helmuth Treichel ,  Flint Thorne ,  Rito Ligutom

发明人： Helmuth Treichel ,  Flint Thorne ,  Rito Ligutom

IPC分类号： B08B7/00 ,  A46B13/00

CPC分类号： B08B1/02 ,  A46B13/001 ,  A46B2200/3086 ,  B08B1/04 ,  H01L21/67046 ,  H01L21/67219

摘要： An integrated cleaner for processing disks is provided. The integrated cleaner includes a pair of spaced apart scrubbers each having a plurality of spaced apart brushes disposed along a length of the scrubbers, the pair of spaced apart scrubbers oriented horizontally and configured to receive a vertically oriented disk therebetween. A track is disposed below a gap defined between the pair of spaced apart scrubbers. The track guides an edge of the disk as the disk travels between ends of the pair of spaced apart scrubbers. The plurality of spaced apart brushes includes a first and/or second pair of opposing brushes having a roughness that is greater than a second and/or third pair of brushes downstream from the first and/or second pair of brushes, respectively. The integrated cleaner includes an edge cleaner configured to exert a force along an edge of the vertically oriented disk during a portion of travel of the vertically oriented disk along the track. A method of cleaning a substrate is also provided.

摘要翻译： 提供了一种用于处理磁盘的集成清洁器。 集成清洁器包括一对间隔开的洗涤器，每个洗涤器具有沿洗涤器长度设置的多个间隔开的刷子，一对间隔开的洗涤器水平地定向并且构造成在其间容纳垂直取向的盘。 轨道设置在限定在一对间隔开的洗涤器之间的间隙的下方。 当盘在两对间隔开的洗涤器的端部之间行进时，轨道引导盘的边缘。 多个间隔开的刷子包括第一和/或第二对相对的刷子，其具有大于分别从第一和/或第二对刷子下游的第二和/或第三对刷子的粗糙度。 集成清洁器包括边缘清洁器，其构造成在垂直定向的盘沿着轨道的行进的一部分期间沿着垂直取向的盘的边缘施加力。 还提供了清洁基板的方法。

公开(公告)号：US20060264066A1

公开(公告)日：2006-11-23

申请号：US11400366

申请日：2006-04-07

申请人： Larry Bartholomew ,  Helmuth Treichel ,  Jon Owyang

发明人： Larry Bartholomew ,  Helmuth Treichel ,  Jon Owyang

IPC分类号： H01L21/31 ,  H01L23/58

CPC分类号： H01L21/3142 ,  C23C16/308 ,  C23C16/45523 ,  H01L21/0214 ,  H01L21/02145 ,  H01L21/02148 ,  H01L21/02153 ,  H01L21/02161 ,  H01L21/0217 ,  H01L21/02181 ,  H01L21/02183 ,  H01L21/02186 ,  H01L21/02194 ,  H01L21/02266 ,  H01L21/0228 ,  H01L21/28194 ,  H01L21/28202 ,  H01L21/3143 ,  H01L21/3145 ,  H01L21/31604 ,  H01L21/31608 ,  H01L21/31637 ,  H01L21/31645 ,  H01L28/40 ,  H01L29/513 ,  H01L29/517 ,  H01L29/518

摘要： The present invention provides systems and methods for forming a multi-layer, multi-component high-k dielectric film. In some embodiments, the present invention provides systems and methods for forming high-k dielectric films that comprise hafnium, titanium, oxygen, nitrogen, and other components. In a further aspect of the present invention, the dielectric films are formed having composition gradients.

摘要翻译： 本发明提供了用于形成多层多组分高k电介质膜的系统和方法。 在一些实施方案中，本发明提供用于形成包含铪，钛，氧，氮和其它组分的高k电介质膜的系统和方法。 在本发明的另一方面，形成具有组成梯度的电介质膜。

公开(公告)号：US20110186088A1

公开(公告)日：2011-08-04

申请号：US12697260

申请日：2010-01-31

申请人： Kenneth C. Miller ,  Rito Ligutom ,  Helmuth Treichel ,  Flint Thorne

发明人： Kenneth C. Miller ,  Rito Ligutom ,  Helmuth Treichel ,  Flint Thorne

IPC分类号： B08B3/00

CPC分类号： H01L21/67057 ,  H01L21/67313

摘要： An apparatus for supporting a work piece is provided. The apparatus includes outer support rails having support slots for supporting the work piece, the outer support rails disposed on opposing sides of the apparatus between opposing end members of the apparatus. Inner support rails extend between the opposing end members of the apparatus. An inner surface of each of the inner support rails has vertically disposed extensions extending therefrom. The vertically disposed extensions are aligned in pairs along a length of the inner support rails. A moveable device is disposed between the pairs of vertically disposed extensions. The moveable device is buoyantly moveable so that as the work piece is lifted, the moveable device follows. A method for cleaning a work piece is also included.

摘要翻译： 提供一种用于支撑工件的装置。 该装置包括具有用于支撑工件的支撑槽的外部支撑轨道，设置在该装置的相对端部构件的相对侧上的外部支撑轨道。 内部支撑轨道在装置的相对的端部构件之间延伸。 每个内部支撑轨道的内表面具有从其延伸的垂直设置的延伸部。 垂直设置的延伸部沿着内部支撑轨道的长度成对排列。 可移动装置设置在成对的垂直设置的延伸部之间。 可移动装置是可浮动的，因此当工件被提起时，移动装置跟随。 还包括用于清洁工件的方法。

公开(公告)号：US20060159847A1

公开(公告)日：2006-07-20

申请号：US11239880

申请日：2005-09-30

申请人： Cole Porter ,  Karl Williams ,  Helmuth Treichel

发明人： Cole Porter ,  Karl Williams ,  Helmuth Treichel

IPC分类号： C23C16/00

CPC分类号： H01L21/67017 ,  C23C16/345 ,  C23C16/402 ,  C23C16/4412 ,  C23C16/45512 ,  C23C16/45578

摘要： In one aspect, the present invention provides a method and apparatus configured to form dielectric films or layers at low temperature. In one embodiment dielectric films such as silicon nitride (SixNy) and silicon dioxide (SiO2) are deposited at temperatures equal to or below 550° C. In a further aspect of the present invention, a method and apparatus configured to provide cross flow injection of reactant gases is provided. In one embodiment, reactant gasses (such as a monomolecular precursor and NH3) flow into vertically positioned adjustable injectors that mix reactants prior to injection into the wafer region.

摘要翻译： 一方面，本发明提供一种被配置为在低温下形成介电膜或层的方法和装置。 在一个实施例中，在等于或低于550℃的温度下沉积诸如氮化硅（SixNy）和二氧化硅（SiO 2）之类的电介质膜。在本发明的另一方面，一种方法和 提供了构造成提供反应气体的横流注入的装置。 在一个实施方案中，反应物气体（例如单分子前体和NH 3）流入垂直定位的可调喷射器，其在注入晶片区域之前将反应物混合。

公开(公告)号：US06875091B2

公开(公告)日：2005-04-05

申请号：US09796955

申请日：2001-02-28

申请人： Allan M. Radman ,  Alan J. Jensen ,  Helmuth Treichel ,  Robert G. Boehm ,  Michael S. Lacy ,  Eric A. Dunton

发明人： Allan M. Radman ,  Alan J. Jensen ,  Helmuth Treichel ,  Robert G. Boehm ,  Michael S. Lacy ,  Eric A. Dunton

IPC分类号： B24B1/04 ,  B24B37/04 ,  B24B53/007 ,  B24B53/10 ,  B24B53/07

CPC分类号： B24B1/04 ,  B24B53/017 ,  B24B53/10

摘要： A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer. The method includes positioning a sonic energy generator above the polishing surface of the polishing pad, and applying sonic energy to the polishing surface of the polishing pad. The apparatus a sonic energy generator adapted to be positioned above the polishing surface, the sonic energy generator including a transducer, and a liquid carrier in flow communication with the transducer, wherein the transducer transmits sonic energy into the liquid carrier and the liquid carrier is applied to the polishing surface of the polishing belt.

摘要翻译： 描述了一种用于调整抛光垫的方法和装置，其中抛光垫具有用于抛光半导体晶片的抛光表面。 该方法包括将抛光垫的抛光表面上方的声能量发生器定位，并将抛光垫的抛光表面施加声能。 所述设备适于定位在所述抛光表面上方，所述声能发生器包括换能器和与所述换能器流动连通的液体载体，其中所述换能器将声能传递到所述液体载体中，并且所述液体载体被施加 到抛光带的抛光表面。