摘要:
The back surface of a semiconductor wafer having a plurality of chip-forming regions each provided with a plurality of connection pads on the surface is bonded to a dicing tape, followed by fully cutting the semiconductor wafer along a cut line so as to form a cutting groove. Then, a front side protective film is formed on the front surface. The front side protective film has an open portion exposing the central portion of the connection pad, and is filled in the cutting groove. After formation of a columnar electrode connected to the connection pad via a wiring, a sealing film is formed on the front side protective film. Further, the cutting groove filled with the front side protective film is cut in substantially the center in the width direction, followed by peeling off the dicing tape so as to form individual semiconductor devices each forming a chip.
摘要:
A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks.
摘要:
A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks.
摘要:
A semiconductor device includes a semiconductor substrate having bump electrodes and a sealing film formed thereon, the sealing film having laminated layers. The sealing film interposed between adjacent bump electrodes is prepared by laminating a protective film and each layer of the sealing film on the lower surface of the base film, on the bump electrodes, followed by allowing the bump electrodes to project through the sealing film under pressure and heat. The thickness of the sealing film is smaller than the height of the bump electrode, and thus the bump electrode projects through the sealing film. Particles for lowering the thermal expansion coefficient are dispersed in the sealing film to allow the sealing layers to exhibit a thermal expansion coefficient differing in its thickness direction such that the thermal expansion coefficient in the layer which is close to the semiconductor substrate is close to that of the semiconductor substrate.
摘要:
A semiconductor device includes a semiconductor substrate which has a plurality of semiconductor device formation regions and alignment mark formation region having the same planar size as that of the semiconductor device formation region, a plurality of post electrodes which are formed in each semiconductor device formation region, and an alignment post electrode which is formed in the alignment mark formation region and smaller in number than the post electrodes formed in each semiconductor device formation region.
摘要:
First, a trench formed in parts of a semiconductor wafer, a sealing film and others corresponding to a dicing street and both sides thereof. In this state, the semiconductor wafer is separated into silicon substrates by the formation of the trench. Then, a resin protective film is formed on the bottom surface of each silicon substrate including the inner part of the trench. In this case, the semiconductor wafer is separated into the silicon substrates. However, a support plate is affixed to the upper surfaces of the columnar electrode and the sealing film via an adhesive layer. Therefore, when the resin protective film is formed, it is possible to prevent the entirety including the separated silicon substrates from being easily warped.
摘要:
In a laundry washing/drying machine involving drying by a heat pump cycle, in an initial stage of the drying operation the heat within an air circulation path is deficient and therefore it is impossible to effect quick heating of air on a drum inlet side up to a sufficiently high temperature. According to the present invention there is provided a drying unit capable of raising the drum inlet air temperature quickly up to a sufficiently high temperature in an initial stage of the drying operation and thereby shortening the drying time. The drying unit includes a heat pump cycle device for performing a cycle of radiating, with use of a radiator, the heat of a refrigerant compressed by a compressor, passing the refrigerant through a pressure reducing/expansion valve, evaporating the refrigerant in an evaporator and compressing the refrigerant again by the compressor, an air circulation path for allowing air to be circulated by a blower in such a manner that air heated by the radiator is introduced into a drying chamber to dry the laundry, exhaust air discharged from the drying chamber is passed through the evaporator, then is heated again by the radiator and the air thus dehumidified is circulated by the blower, and an external heat source applying device for applying the heat of an external heat source to the evaporator to quicken the rise in temperature of the air in an initial stage of the drying operation.
摘要:
In a laundry washing/drying machine involving drying by a heat pump cycle, in an initial stage of the drying operation the heat within an air circulation path is deficient and therefore it is impossible to effect quick heating of air on a drum inlet side up to a sufficiently high temperature. According to the present invention there is provided a drying unit capable of raising the drum inlet air temperature quickly up to a sufficiently high temperature in an initial stage of the drying operation and thereby shortening the drying time. The drying unit includes a heat pump cycle device for performing a cycle of radiating, with use of a radiator, the heat of a refrigerant compressed by a compressor, passing the refrigerant through a pressure reducing/expansion valve, evaporating the refrigerant in an evaporator and compressing the refrigerant again by the compressor, an air circulation path for allowing air to be circulated by a blower in such a manner that air heated by the radiator is introduced into a drying chamber to dry the laundry, exhaust air discharged from the drying chamber is passed through the evaporator, then is heated again by the radiator and the air thus dehumidified is circulated by the blower, and an external heat source applying device for applying the heat of an external heat source to the evaporator to quicken the rise in temperature of the air in an initial stage of the drying operation.
摘要:
A washing and drying machine has an object to improve a drying efficiency of a laundry and reduce a drying time, and includes an outer drum; an inner drum rotated in this outer drum and having a substantially cylindrical shape to constitute a storage chamber therein; a takeout port which is constituted in one end surface of a cylinder of this inner drum in an axial direction and via which the laundry is to be taken or introduced; a plurality of through holes which are formed around a side surface of the cylinder of the inner drum and in the other end surface of the cylinder in the axial direction and from which water is discharged during the washing and through which circulation air for drying circulates during the drying; and a blowing regulation unit which blows the air for drying into the storage chamber from the side of one end or the other end of the cylinder of the inner drum in the axial direction and which allows the air to flow from the through holes on the other end side or from the one end side and which inhibits outflow of the air for drying from the other through holes.
摘要:
The present invention concerns an on-vehicle air-conditioner, resolving problems of the prior art, and allowing to perform cooling, heating, dehumidification or others efficiently even for vehicles of low waste heat, such as hybrid cars taking electricity and gasoline as energy source, idle stop coping cars or battery cars taking only electricity as energy source, or other vehicles, by cooling by loading a refrigeration circuit, using for example CO2 refrigerant, and provided with an electrically driven two-stage compression system compressor, and at the same time, installing a refrigerant heat exchanger for cooling the refrigerant, compressed in the first stage in a way to exchange heat with the car interior air, and using conveniently also for heating together with the heat of the cooling water for cooling the engine.