公开(公告)号：US5833313A

公开(公告)日：1998-11-10

申请号：US774057

申请日：1996-12-23

申请人： Takuji Kaneda ,  Masaaki Yasuda ,  Eiji Masutani ,  Kazutomo Isonaga ,  Satoshi Hayashi

发明人： Takuji Kaneda ,  Masaaki Yasuda ,  Eiji Masutani ,  Kazutomo Isonaga ,  Satoshi Hayashi

IPC分类号： B60N2/90 ,  A47C31/00 ,  A47C31/02 ,  B60N2/58 ,  B68G7/052

CPC分类号： B60N2/5825 ,  A47C31/00

摘要： An automotive seat comprises a seat back and a seat cushion, the seat cushion having a cushioned padding, a covering sheet covering front and middle sections of the cushioned padding, sides cover covering both side sections of the cushioned padding, and a back cover covering a rear section of the cushioned padding, the back cover formed into a predetermined three-dimensional shape utilizing a sheet of fiber impregnated with thermoelastic synthetic resin, the back cover having a body of a substantially C-shape in section and mounting sections provided at both sides of the C-shaped body, each of the mounting sections laminated with a sheet of hard felt serving as a reinforcement and having a through-hole, each of the side covers including a fastener having a body of a substantially square pole-shape projecting forwardly from a front surface of a rear section of the side cover and a pair of stopper pawls, said back covers disposed arranged between the side covers and secured to the side covers by causing fasteners to be press-fitted through through-holes of the mounting sections of the back cover, a terminal of the covering sheet sewed to an edge of an upper section of the C-shaped body of the back cover.

摘要翻译： 汽车座椅包括座椅靠背和座垫，座垫具有缓冲衬垫，覆盖衬垫的前部和中部的覆盖片，覆盖衬垫的两侧部分的侧盖和覆盖 衬垫的后部，后盖使用浸渍有热塑性合成树脂的纤维片形成预定的三维形状，后盖具有基本上C形的主体和设置在两侧的安装部分 每个安装部分层叠有用作加强件的硬毡片并具有通孔，每个侧盖包括紧固件，该紧固件具有向前突出的大致正方形的主体的主体 从所述侧盖的后部的前表面和一对止动爪，所述后盖设置在所述侧盖之间并固定到侧面c 通过使紧固件通过后盖的安装部分的通孔压配合，将覆盖片的端子缝合到后盖的C形主体的上部的边缘。

公开(公告)号：US07942477B1

公开(公告)日：2011-05-17

申请号：US11910352

申请日：1999-05-14

申请人： Eiji Toba ,  Masaaki Yasuda ,  Shigeru Endo ,  Kazutomo Isonaga ,  Tsutomu Fukui ,  Nobuhiro Koyota ,  Takashi Inoh

发明人： Eiji Toba ,  Masaaki Yasuda ,  Shigeru Endo ,  Kazutomo Isonaga ,  Tsutomu Fukui ,  Nobuhiro Koyota ,  Takashi Inoh

IPC分类号： A47C7/72 ,  A47C7/62

CPC分类号： B60N2/70 ,  B60N2/002 ,  B60N2/5685 ,  B60N2/58 ,  B60R21/01516

摘要： There is disclosed a seat that comprises a trim cover including a sheet of covering material and a wadding layer, a padding member covered with the cover, a seating surface section formed by a portion of the cover and a portion of the padding member, and electric or electronic equipment, the equipment including planar equipment bodies and accessories, the wadding layer including a first wadding member laminated onto the entire sheet, and second wadding members formed separately from the first wadding member and mounted to predetermined regions of the portion of the padding member which forms the seating surface section in cooperation with the portion of the cover, the bodies being disposed on the second wadding members, and the padding member being covered by the cover in such a manner that the second wadding members having the bodies disposed thereon are combined with the first wadding member.

摘要翻译： 公开了一种座椅，其包括：装饰盖，其包括覆盖材料片和填充层，被覆盖的衬垫构件，由所述盖的一部分和所述衬垫构件的一部分形成的座面部，以及电 或电子设备，所述设备包括平面设备主体和附件，所述填充层包括层压在整个片材上的第一填充构件和与所述第一填塞构件分开形成并安装到所述填充构件的所述部分的预定区域的第二填塞构件 其与盖的部分协作形成座面部分，所述主体设置在第二填补构件上，并且衬垫构件被覆盖，使得具有布置在其上的主体的第二填塞构件组合 与第一个填充成员。

公开(公告)号：US20110065260A1

公开(公告)日：2011-03-17

申请号：US12950398

申请日：2010-11-19

申请人： Takashi KAWAMORI ,  Takashi Masuko ,  Shigeki Katogi ,  Masaaki Yasuda

发明人： Takashi KAWAMORI ,  Takashi Masuko ,  Shigeki Katogi ,  Masaaki Yasuda

IPC分类号： H01L21/78 ,  B29C65/52

CPC分类号： H01L23/488 ,  C09J179/08 ,  G03F7/037 ,  H01L21/2007 ,  H01L21/76251 ,  H01L21/78 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  Y10T156/1002 ,  Y10T428/24479 ,  Y10T428/24802 ,  H01L2924/00014

摘要： A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

公开(公告)号：US06303727B1

公开(公告)日：2001-10-16

申请号：US09320838

申请日：1999-05-26

申请人： Ken Maeda ,  Masaaki Yasuda ,  Terunori Fujita ,  Keiji Okada ,  Makoto Kamimura ,  Kazuyuki Takimoto ,  Hidetatsu Murakami ,  Masaaki Kawasaki ,  Keiji Watanabe

发明人： Ken Maeda ,  Masaaki Yasuda ,  Terunori Fujita ,  Keiji Okada ,  Makoto Kamimura ,  Kazuyuki Takimoto ,  Hidetatsu Murakami ,  Masaaki Kawasaki ,  Keiji Watanabe

IPC分类号： C08F13600

CPC分类号： C08F236/22 ,  C07C2/04 ,  C07C11/21 ,  C07C2527/24 ,  C07C2531/14

摘要： A novel and useful linear triene compound represented by the following formula (1) is co-polymerized with an &agr;-olefin to obtain an ethylenically unsaturated copolymer which is superior in weather-ability, heat resitance and fastness to ozone, together with superior scorch stability and vulcanizability at high velocity in which R1, R2, R3, R4, R5 and R6 stand each, independently of each other, for hydrogen atom or an alkyl having 1-3 carbon atoms, R7 represents an alkyl having 1-3 carbon atoms and n is an integer of 0-5, with the proviso that each of R4s or of R5s may be identical with or different from each other, respectively, when n is 2 or greater.

摘要翻译： 由下式（1）表示的新型有用的线性三烯化合物与α-烯烃共聚，得到耐候性，耐热性和耐臭氧性优异的烯属不饱和共聚物，以及优异的焦烧稳定性 和R 1，R 2，R 3，R 4，R 5和R 6各自独立地表示氢原子或具有1-3个碳原子的烷基的高速度下的硫化性，R7表示具有1-3个碳原子的烷基，n表示 是0-5的整数，条件是当n为2或更大时，R 4或R 5中的每一个可以分别彼此相同或不同。

公开(公告)号：US5910591A

公开(公告)日：1999-06-08

申请号：US953517

申请日：1997-10-17

申请人： Masaaki Yasuda

发明人： Masaaki Yasuda

IPC分类号： C07D211/46 ,  C07D211/44

CPC分类号： C07D211/46

摘要： The present invention relates to a method for preparing 4-hydroxy-1,2,2,6,6-pentamethylpiperidine comprising the following steps:(i) reacting 4-hydroxy-2,2,6,6-tetramethylpiperidine with at least one compound selected from the group consisting of formaldehyde, paraformaldehyde and trioxane, optionally in the presence of formic acid;(ii) neutralizing the reaction product of step (i) by adding a base thereto; and(iii) after the neutralization, separating the crude product from the aqueous layer and crystallizing and filtering the crude product to thereby obtain crystals of 4-hydroxy-1,2,2,6,6-pentamethylpiperidine with a water content of 3% by weight or less. The present invention also relates to a method for preparing 4-hydroxy-1,2,2,6,6-pentamethylpiperidine, comprising reacting 4-hydroxy-2,2,6,6-tetramethylpiperidine with at least one compound selected from the group consisting of formaldehyde, paraformaldehyde and trioxane, optionally in the presence of formic acid added in an amount smaller than that of 4-hydroxy-2,2,6,6-tetramethylpiperidine in terms of mole.

摘要翻译： 本发明涉及一种制备4-羟基-1,2,2,6,6-五甲基哌啶的方法，包括以下步骤：（i）使4-羟基-2,2,6,6-四甲基哌啶与至少一种 选自甲醛，多聚甲醛和三恶烷的化合物，任选在甲酸存在下; （ii）通过向其中加入碱来中和步骤（i）的反应产物; 和（iii）中和后，将粗产物与水层分离并使粗产物结晶并过滤，从而得到水含量为3％的4-羟基-1,2,2,6,6-五甲基哌啶晶体， 以下。 本发明还涉及一种制备4-羟基-1,2,2,6,6-五甲基哌啶的方法，包括使4-羟基-2,2,6,6-四甲基哌啶与至少一种选自下组的化合物 由甲醛，多聚甲醛和三恶烷组成，任选在甲酸的存在下加入的量小于4-羟基-2,2,6,6-四甲基哌啶的摩尔量。

公开(公告)号：US07692296B2

公开(公告)日：2010-04-06

申请号：US11085520

申请日：2005-03-22

申请人： Naotaka Tanaka ,  Kenya Kawano ,  Akira Nagai ,  Koji Tasaki ,  Masaaki Yasuda

发明人： Naotaka Tanaka ,  Kenya Kawano ,  Akira Nagai ,  Koji Tasaki ,  Masaaki Yasuda

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/90 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/45099

摘要： A semiconductor device is provided with connection reliability between a bump electrode and a substrate electrode. An elastic modulus of an adhesive material used to electrically connect a metal bump and an interconnect pattern, and sealing the circuit surface of an LSI chip, after thermosetting is Ea; an elastic modulus of an insulating material of a packaging substrate surface layer after thermosetting is Eb; an elastic modulus of a core material, if used, is Ec, and the following rational expression is satisfied at normal temperature or a thermal contact bonding temperature of the adhesive material: at least Ea

摘要翻译： 半导体器件在凸起电极和衬底电极之间具有连接可靠性。 用于电连接金属凸块和互连图案的粘合材料的弹性模量，并且在热固化之后密封LSI芯片的电路表面是Ea; 热固化后的封装基材表面层的绝缘材料的弹性模量为Eb; 如果使用的话，芯材的弹性模量为Ec，在粘接材料的常温或热接触粘合温度下满足以下有理表达式：至少Ea

公开(公告)号：US07061081B2

公开(公告)日：2006-06-13

申请号：US10220846

申请日：2001-03-06

申请人： Yasuhiro Yano ,  Hidekazu Matsuura ,  Yoshihiro Nomura ,  Yoshii Morishita ,  Touichi Sakata ,  Hiroshi Nishizawa ,  Toshiaki Tanaka ,  Masaaki Yasuda ,  Aizou Kaneda

发明人： Yasuhiro Yano ,  Hidekazu Matsuura ,  Yoshihiro Nomura ,  Yoshii Morishita ,  Touichi Sakata ,  Hiroshi Nishizawa ,  Toshiaki Tanaka ,  Masaaki Yasuda ,  Aizou Kaneda

IPC分类号： C08L79/08 ,  H01L23/48

CPC分类号： H01L21/02118 ,  G03F7/0387 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/312 ,  H01L21/3122 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： There are disclosed a resin composition comprising (A) a heat-resistant resin soluble in a solvent at room temperature, (B) a heat-resistant resin which is insoluble in a solvent at room temperature but becomes soluble by heating, and (C) a solvent; a heat-resistant resin paste further containing (D) particles or liquid state material D showing rubber elasticity; and a semiconductor device using the same and a method for producing the same.

公开(公告)号：US06404068B1

公开(公告)日：2002-06-11

申请号：US09763192

申请日：2001-02-20

申请人： Toshiaki Tanaka ,  Takafumi Dohdoh ,  Tsutomu Kitakatsu ,  Aizou Kaneda ,  Masaaki Yasuda ,  Takashi Kousaka ,  Akira Kageyama

发明人： Toshiaki Tanaka ,  Takafumi Dohdoh ,  Tsutomu Kitakatsu ,  Aizou Kaneda ,  Masaaki Yasuda ,  Takashi Kousaka ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/3128 ,  C08L63/00 ,  C08L71/00 ,  C08L71/126 ,  C08L77/00 ,  C08L77/06 ,  C08L83/10 ,  C09D177/00 ,  C09D177/06 ,  C09D179/08 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3121 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  C08L2666/02 ,  C08L2666/08 ,  C08L2666/04 ,  C08L2666/14 ,  C08L2666/28 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/20753

摘要： A paste composition which comprises as essential ingredients (A) a thermoplastic resin, (B) an epoxy resin, (C) a coupling agent, (D) a powdery inorganic filler, (E) a powder having rubber elasticity and (F) an organic solvent and which, when applied and dried, gives a coating film having a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90 %RH of 500 g/m2·24 h or less; a protective film which is formed by applying the paste composition to a surface of a semiconductor part and drying it and has a void content of 3% by volume or higher and a water vapor permeability as measured at 40° C. and 90%RH of 500 g/m2·24 h or less; and a semiconductor device having the protective film.

摘要翻译： 作为必要成分（A）热塑性树脂，（B）环氧树脂，（C）偶联剂，（D）粉末状无机填料，（E）具有橡胶弹性的粉末和（F） 有机溶剂，当涂布并干燥时，得到空隙率为3体积％以上的涂膜，在40℃，90％RH下测定的水蒸气透过率为500g / m 2·24h， 减; 通过将糊剂组合物涂布在半导体部件的表面并干燥而形成的保护膜，其空隙率为3体积％以上，水分透过率为40℃，90％RH 500 g / m2.24 h以下; 以及具有保护膜的半导体器件。

公开(公告)号：US5408013A

公开(公告)日：1995-04-18

申请号：US159959

申请日：1993-12-01

申请人： Hiroyuki Kawakami ,  Masaaki Yasuda ,  Shoichi Sasaki

发明人： Hiroyuki Kawakami ,  Masaaki Yasuda ,  Shoichi Sasaki

IPC分类号： C08F283/01 ,  C08F283/02 ,  C08L67/06 ,  C08F20/00

CPC分类号： C08F283/02 ,  C08F283/01 ,  C08L67/06 ,  Y10T428/249921 ,  Y10T428/249924 ,  Y10T428/31786 ,  Y10T428/31794

摘要： An unsaturated polyester resin composition capable of affording a molded product having a small cured volume shrinkage, a superior dimensional stability, a surface quality and a high hardness, a sheet-form molding material using the composition and a process for producing a fiber-reinforced plastic molded product are provided, which composition comprises a saturated polyester obtained by reacting a saturated dibasic acid component containing 20% by mol or more of adipic acid with a saturated glycol component and having a number average molecular weight of 4,000 or higher and an acid value of 2 to 8 KOH mg/g, an unsaturated polyester and an ethylenic unsaturated monomer; which sheet-form molding material has the unsaturated resin composition together with a fiber reinforcing material placed between two films.

公开(公告)号：US4962241A

公开(公告)日：1990-10-09

申请号：US309671

申请日：1989-02-03

申请人： Masaaki Yasuda ,  Hisaya Miki

发明人： Masaaki Yasuda ,  Hisaya Miki

IPC分类号： B01J27/02 ,  B01J27/06 ,  B01J27/138 ,  B01J31/04 ,  C07B61/00 ,  C07C27/00 ,  C07C37/055 ,  C07C39/14 ,  C07C67/00 ,  C07C67/055 ,  C07C409/08

CPC分类号： C07C409/08 ,  C07C37/0555 ,  C07C407/00 ,  C07C2102/02

摘要： The process of the present invention for producing dihydroxynaphthalenes comprises hydrolyzing a diacyloxynaphthalene in a water-containing solvent in the presence of an acid catalyst. The use of an acid as a hydrolyzing catalyst enables dihydroxynaphthalenes to be obtained with high purity and in high yield.