公开(公告)号：US06784289B2

公开(公告)日：2004-08-31

申请号：US09747007

申请日：2000-12-21

申请人： Thérèse Ouellet ,  Brian M. Miki ,  Elizabeth Foster ,  Teresa Martin-Heller ,  Lining Tian ,  Daniel C. Brown ,  Peijun Zhang ,  Jiro Hattori ,  Kamal Malik ,  Keqiang Wu ,  David A. Theilmann ,  Raymond Tropiano

发明人： Thérèse Ouellet ,  Brian M. Miki ,  Elizabeth Foster ,  Teresa Martin-Heller ,  Lining Tian ,  Daniel C. Brown ,  Peijun Zhang ,  Jiro Hattori ,  Kamal Malik ,  Keqiang Wu ,  David A. Theilmann ,  Raymond Tropiano

IPC分类号： C07H2104

CPC分类号： C12N15/67 ,  C12N15/8216

摘要： The present invention is directed to translational regulatory elements that mediate the amount of protein produced within a host capable of expressing a construct comprising one or more translational regulatory elements in operative association with a gene of interest. These translational regulatory elements were derived from T1275 (tCUP) and exhibit a high degree of similarity with members of the RENT family of repetitive elements. Translational regulatory elements are disclosed that either increase or decrease he amount of protein produced within the host organism. These translational elements are operative in a wide range of hosts including plant, animals, yeast, fungi and bacteria. Analogs, derivatives and fragments of these translational elements are also disclosed.

摘要翻译： 本发明涉及介导在能够表达包含与感兴趣的基因有效结合的一种或多种翻译调控元件的构建体的宿主内产生的蛋白质的量的翻译调控元件。 这些翻译调控元件来自T1275（tCUP），并且与RENT家族的重复元件的成员呈现高程度的相似性。 公开了翻译调控元件，即增加或减少宿主生物体内产生的蛋白质的量。 这些翻译元件在广泛的宿主中可操作，包括植物，动物，酵母，真菌和细菌。 还公开了这些翻译元件的类似物，衍生物和片段。

公开(公告)号：US07303873B2

公开(公告)日：2007-12-04

申请号：US10437261

申请日：2003-05-13

申请人： Brian Miki ,  Thérèse Ouellet ,  Jiro Hattori ,  Elizabeth Foster ,  Hélène Labbé ,  Teresa Martin-Heller ,  Lining Tian ,  Daniel Charles William Brown ,  Peijun Zhang ,  Keqiang Wu

发明人： Brian Miki ,  Thérèse Ouellet ,  Jiro Hattori ,  Elizabeth Foster ,  Hélène Labbé ,  Teresa Martin-Heller ,  Lining Tian ,  Daniel Charles William Brown ,  Peijun Zhang ,  Keqiang Wu

IPC分类号： C12Q1/68 ,  C12N15/63 ,  C12N15/82 ,  C07H21/02 ,  C12N5/04

CPC分类号： C07K14/415 ,  C12N15/8216 ,  C12N15/8222 ,  C12N15/8234

摘要： T-DNA tagging with a promoterless β-glucuronidase (GUS) gene generated transgenic Nicotiana tabacum plants that expressed GUS activity either only in developing seed coats, or constitutively. Cloning and deletion analysis of the GUS fusion revealed that the promoter responsible for seed coat specificity was located in the plant DNA proximal to the GUS gene. Analysis of the region demonstrated that the seed coat-specificity of GUS expression in this transgenic plant resulted from T-DNA insertion next to a cryptic promoter. This promoter is useful in controlling the expression of genes to the developing seed coat in plant seeds. Similarly, cloning and characterization of the cryptic constitutive promoter revealed the occurrence of several cryptic regulatory regions. These regions include promoter, negative regulatory elements, transcriptional enhancers, core promoter regions, and translational enhancers and other regulatory elements.

摘要翻译： 用无启动子β-葡糖醛酸糖苷酶（GUS）基因的T-DNA标签产生转基因烟草植物，其仅在开发种皮或组成型中表达GUS活性。 GUS融合物的克隆和缺失分析表明，负责种衣特异性的启动子位于植物DNA接近GUS基因的位置。 该区域的分析表明，该转基因植物中GUS表达的种皮特异性是由隐匿启动子旁边的T-DNA插入产生的。 该启动子可用于控制植物种子中发育中的种皮的基因表达。 类似地，隐匿性组成型启动子的克隆和表征揭示了几个隐蔽调节区的发生。 这些区域包括启动子，负调控元件，转录增强子，核心启动子区和翻译增强子等调控元件。

公开(公告)号：US20050055742A1

公开(公告)日：2005-03-10

申请号：US10866529

申请日：2004-06-10

申请人： Brian Miki ,  Jiro Hattori ,  Teresa Martin-Heller ,  Helene Labbe ,  Kamal Malik ,  Elizabeth Foster ,  Keqiang Wu ,  Daniel Brown ,  Lining Tian ,  Therese Ouellet ,  Peijun Zhang ,  Elizabeth James ,  Pierre Fobert ,  Venkatram Iyer

发明人： Brian Miki ,  Jiro Hattori ,  Teresa Martin-Heller ,  Helene Labbe ,  Kamal Malik ,  Elizabeth Foster ,  Keqiang Wu ,  Daniel Brown ,  Lining Tian ,  Therese Ouellet ,  Peijun Zhang ,  Elizabeth James ,  Pierre Fobert ,  Venkatram Iyer

IPC分类号： C07K14/415 ,  C12N15/82 ,  C12Q1/68 ,  A01H1/00 ,  C07H21/04 ,  C12N5/04

CPC分类号： C07K14/415 ,  C12N15/8216

摘要： An nucleotide sequence and that exhibits regulatory element activity is disclosed. The nucleotide sequence may be defined by SEQ ID NO:22, a nucleotide sequence that hybridizes to the nucleic acid sequence of SEQ ID NO:22, or a compliment thereof. Also disclosed is a chimeric construct comprising the nucleotide sequence operatively linked with a coding region of interest. A method of expressing a coding region of interest within a plant by introducing the chimeric construct described above, into the plant, and expressing the coding region of interest is also provided. Also disclosed are plants, seed, or plant cells comprising the chimeric construct as defined above.

摘要翻译： 公开了核苷酸序列并表现出调节元件活性。 核苷酸序列可以由SEQ ID NO：22定义，与SEQ ID NO：22的核酸序列杂交的核苷酸序列或其补体。 还公开了包含与感兴趣的编码区可操作地连接的核苷酸序列的嵌合构建体。 还提供了通过将上述嵌合构建体引入植物并表达感兴趣的编码区而在植物内表达感兴趣的编码区的方法。 还公开了包含如上定义的嵌合构建体的植物，种子或植物细胞。

公开(公告)号：US07063762B2

公开(公告)日：2006-06-20

申请号：US10643909

申请日：2003-08-20

申请人： Elizabeth Foster ,  Gregory Kevern ,  Anita Sargent

发明人： Elizabeth Foster ,  Gregory Kevern ,  Anita Sargent

IPC分类号： H05K3/38

CPC分类号： H01L23/49894 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/034 ,  H05K3/181 ,  H05K3/188 ,  H05K2201/015 ,  H05K2201/0329 ,  Y10S428/901 ,  Y10T428/24917 ,  H01L2924/00

摘要： A method of making a circuitized substrate such as a laminate chip carrier in which a polymer, e.g., Teflon, is used as a dielectric layer and a promotion adhesion layer of a polymer is used to securely adhere a conductive layer thereto which is deposited by plating. The resulting product is thus able to provide extremely narrow conductive circuitry for subsequent connections, e.g., to a semiconductor chip. Electroless plating is the preferred plating method with the dielectric immersed in a solution of conductive monomers, e.g., pyrrole monomer, the solution also possibly containing a seed material such as palladium-tin.

公开(公告)号：US06835533B2

公开(公告)日：2004-12-28

申请号：US10781073

申请日：2004-02-18

申请人： Elizabeth Foster ,  Gary A. Johansson ,  Heike Marcello ,  David J. Russell

发明人： Elizabeth Foster ,  Gary A. Johansson ,  Heike Marcello ,  David J. Russell

IPC分类号： G03F7038

CPC分类号： G03F7/0385 ,  G03F7/038 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4676 ,  Y10T428/24851

摘要： A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0% to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

摘要翻译： 一种制造电路化基板的方法，其减少短路，并且不需要烘烤和得到的膜。 该方法使用溶剂含量小于约5％的光致成像电介质膜，当固化时玻璃化转变温度大于约110℃。提供具有约95％至约100的光致成像电介质膜 ％固体，并且包含：0％至约30％的固体，颗粒状流变改性剂; 约70％至约100％的环氧树脂体系的固体（20℃的液体），包含：约85％至约99.9％的环氧树脂; 和约0.1至15份的总树脂重量，阳离子光引发剂; 0％至约5％的溶剂; 将光致成像电介质膜施加到电路化基板上; 并将膜暴露于光化辐射。

公开(公告)号：US06706464B2

公开(公告)日：2004-03-16

申请号：US10345561

申请日：2003-01-16

申请人： Elizabeth Foster ,  Gary A. Johansson ,  Heike Marcello ,  David J. Russell

发明人： Elizabeth Foster ,  Gary A. Johansson ,  Heike Marcello ,  David J. Russell

IPC分类号： G03F740

CPC分类号： G03F7/0385 ,  G03F7/038 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4676 ,  Y10T428/24851

摘要： A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film, is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier, from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C. comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0 to about 5% solvent, applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

摘要翻译： 一种制造电路化基板的方法，其减少短路，并且不需要烘烤和得到的膜。 该方法采用溶剂含量小于约5％的光致成像电介质膜，当固化时玻璃化转变温度大于约110℃。提供了可见光电介质膜，其具有约95％至约 100％固体，并且包含：固体的0％至约30％的颗粒状流变改性剂，约70％至约100％的环氧树脂体系的固体（液体在20℃，包括：来自 约85％至约99.9％的环氧树脂;和约0.1至15份的总树脂重量，阳离子光引发剂; 0至约5％的溶剂，将可光成像的电介质膜施加到电路化基板;以及将膜暴露于 光化辐射。

公开(公告)号：US08838543B2

公开(公告)日：2014-09-16

申请号：US12927693

申请日：2010-11-19

申请人： Gabrielle Sarah Phyo ,  Nickola John Vidovich ,  Elizabeth Foster

发明人： Gabrielle Sarah Phyo ,  Nickola John Vidovich ,  Elizabeth Foster

IPC分类号： G06F17/00 ,  G06Q10/00 ,  G06F17/30

CPC分类号： G06F17/30011 ,  G06Q10/00

摘要： An archiving system for enabling searching for collections of items is disclosed. A processing unit displays an archived items collection management template in respect of a particular collection of items and prompts a user to complete the template fields with data obtained by the user from manually reviewing that collection of items to capture information relevant to each of the template fields. An archiving controller stores, in pre-determined data fields of a storage area of a data store corresponding to said collection of items, the data from the completed template fields. A document search controller may search the pre-determined data fields of the storage areas of the data store corresponding to each of the collections of items to identify ones of the collection of items which match search criteria.

摘要翻译： 公开了一种用于搜索项目集合的归档系统。 处理单元针对特定的项目集合显示归档项集合管理模板，并且提示用户使用用户获得的数据来完成模板字段，从而手动查看项目集合以捕获与每个模板字段相关的信息 。 存档控制器在对应于所述项目集合的数据存储的存储区域的预定数据字段中存储来自完成的模板字段的数据。 文档搜索控制器可以搜索与每个项目集合相对应的数据存储区域的存储区域的预定数据字段，以识别符合搜索条件的项目集合中的那些。

公开(公告)号：US07084509B2

公开(公告)日：2006-08-01

申请号：US10263909

申请日：2002-10-03

申请人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  Voya R. Markovich ,  Manh-Quan Tam Nguyen

发明人： Frank D. Egitto ,  Elizabeth Foster ,  Raymond T. Galasco ,  Voya R. Markovich ,  Manh-Quan Tam Nguyen

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K1/115 ,  H01L21/486 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/096 ,  H05K2203/0733 ,  H01L2924/00

摘要： The density of electronic packaging and the electrical reliability of the sub-assemblies utilizing stacked blind vias are improved by providing a blind, landless via in a first dielectric layer laminated to a conductive metal core serving as a ground plane or a power plane. A hole is provided through the dielectric layer extending to the core. A metal, such as copper, is deposited electrolytically using the metal core as the cathode, or electrolessly without seeding into the hole. The metal is deposited on the core and progressively builds in the hole to the depth required for the via. A second dielectric layer is laminated to the first, and is provided with a second layer blind via aligned with the first via. This second via may be formed by conventional plating techniques. Multiple dielectric layers with stacked blind vias can be assembled in this manner.

摘要翻译： 通过在层叠到用作接地平面或电源平面的导电金属芯的第一介电层中提供盲目的无地通孔来改善电子封装的密度和利用堆叠盲孔的子组件的电可靠性。 通过延伸到芯的电介质层提供孔。 使用金属芯作为阴极电解沉积诸如铜的金属，或者无电渗入孔中。 金属沉积在芯上并逐渐建立在孔中以达到通孔所需的深度。 第二电介质层被层压到第一电介质层，并且具有与第一通孔对准的第二层盲孔。 该第二通孔可以由常规电镀技术形成。 可以以这种方式组装具有堆叠的盲孔的多个电介质层。

公开(公告)号：US06829823B2

公开(公告)日：2004-12-14

申请号：US10067551

申请日：2002-02-05

申请人： Francis J. Downes, Jr. ,  Donald S. Farquhar ,  Elizabeth Foster ,  Robert M. Japp ,  Gerald W. Jones ,  John S. Kresge ,  Robert D. Sebesta ,  David B. Stone ,  James R. Wilcox

发明人： Francis J. Downes, Jr. ,  Donald S. Farquhar ,  Elizabeth Foster ,  Robert M. Japp ,  Gerald W. Jones ,  John S. Kresge ,  Robert D. Sebesta ,  David B. Stone ,  James R. Wilcox

IPC分类号： H01K310

CPC分类号： H05K3/4641 ,  H01L21/4853 ,  H01L23/3735 ,  H01L23/49822 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0191 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/0401

摘要： A method of making a multi-layered interconnect structure. First and second electrically conductive members are formed on the first and second dielectric layers, respectively. The dielectric layer are formed on opposing surfaces of a thermally conductive layer. A first and second electrically conductive layer is formed within the first dielectric layer. The second electrically conductive layer includes shielded signal conductors and is positioned between the first electrically conductive layer and the thermally conductive layer. A plated through hole (PTH) formed through the interconnect structure is electrically connected to one of the first and second electrically conductive members and to one of the shielded signal conductors. A third dielectric layer, formed on the first dielectric layer and on portions of the first electrically conductive members, substantially overlies the PTH and includes a high density interconnect layer for providing an electrical path from an electronic device to the shielded signal conductors.

摘要翻译： 一种制造多层互连结构的方法。 第一和第二导电构件分别形成在第一和第二电介质层上。 电介质层形成在导热层的相对表面上。 第一和第二导电层形成在第一介电层内。 第二导电层包括屏蔽信号导体并且位于第一导电层和导热层之间。 通过互连结构形成的电镀通孔（PTH）电连接到第一和第二导电构件中的一个和屏蔽信号导体之一。 形成在第一介电层上和第一导电构件的部分上的第三电介质层基本上覆盖在PTH上，并且包括用于提供从电子器件到屏蔽信号导体的电气路径的高密度互连层。

公开(公告)号：US06528218B1

公开(公告)日：2003-03-04

申请号：US09808334

申请日：2001-03-14

申请人： Elizabeth Foster ,  Gary A. Johansson ,  Heike Marcello ,  David J. Russell

发明人： Elizabeth Foster ,  Gary A. Johansson ,  Heike Marcello ,  David J. Russell

IPC分类号： G03F711

CPC分类号： G03F7/0385 ,  G03F7/038 ,  H05K3/0023 ,  H05K3/4644 ,  H05K3/4676 ,  Y10T428/24851

摘要： A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0 to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.

摘要翻译： 一种制造电路化基板的方法，其减少短路，并且不需要烘烤和得到的膜。 该方法使用溶剂含量小于约5％的光致成像电介质膜，当固化时玻璃化转变温度大于约110℃。提供具有约95％至约100的光致成像电介质膜 ％固体，并且包含：0％至约30％的固体，颗粒状流变改性剂; 约70％至约100％的环氧树脂体系的固体（20℃的液体），包含：约85％至约99.9％的环氧树脂; 和约0.1至15份的总树脂重量，阳离子光引发剂; 0至约5％的溶剂; 将光致成像电介质膜施加到电路化基板上; 并将膜暴露于光化辐射。