公开(公告)号：US07002249B2

公开(公告)日：2006-02-21

申请号：US10294423

申请日：2002-11-12

申请人： Thomas P. Duffy ,  John Ryan Goodfellow ,  Robert T. Carroll ,  Kevin J. Cote ,  Sampath K. V. Karikalan ,  Suresh Golwalkar

发明人： Thomas P. Duffy ,  John Ryan Goodfellow ,  Robert T. Carroll ,  Kevin J. Cote ,  Sampath K. V. Karikalan ,  Suresh Golwalkar

IPC分类号： H01L23/495 ,  H01L27/02 ,  H01L23/48

CPC分类号： H01L24/85 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49575 ,  H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/48799 ,  H01L2224/49052 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/4912 ,  H01L2224/49171 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49431 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01079 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/351 ,  Y10S257/916 ,  H01L2924/01004 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45147 ,  H01L2924/0132 ,  H01L2924/2075 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00011

摘要： A semiconductor device package is disclosed which includes inter-digitated input and output bond wires configured to increase the negative mutual inductive coupling between the wires, thus reducing the overall parasitic inductance of the device. In one embodiment, the microelectronic component includes a semiconductor device coupled to a substrate, such as a lead frame, a first set of bond wires connected to the semiconductor device for providing current flow into the semiconductor device, and a second set of bond wires that are in a current loop with the first set of bond wires and are connected to the semiconductor device for providing current flow out of the semiconductor device, wherein the first and second set of bond wires are configured in an inter-digitated pattern to increase the magnitude of mutual inductive coupling between the first and second set of bond wires. In one embodiment, the semiconductor device comprises a single semiconductor chip and the lead frame comprises a Quad Flat No-Lead (QFN) lead frame. Other embodiments include multiple chips and/or multiple lead frames.

摘要翻译： 公开了一种半导体器件封装，其包括配置为增加导线之间的负互感耦合的数字化输入和输出接合线，从而减小器件的总体寄生电感。 在一个实施例中，微电子部件包括耦合到诸如引线框架的基板的半导体器件，连接到半导体器件的用于提供电流流入半导体器件的第一组接合线，以及第二组接合线， 与第一组接合线处于电流回路中并且连接到半导体器件，用于提供从半导体器件流出的电流，其中第一组和第二组接合线被配置为数字化的图案以增加幅度 的第一组和第二组接合线之间的互感耦合。 在一个实施例中，半导体器件包括单个半导体芯片，并且引线框架包括四边形扁平无引线（QFN）引线框架。 其他实施例包括多个芯片和/或多个引线框架。

公开(公告)号：US06960031B2

公开(公告)日：2005-11-01

申请号：US10325259

申请日：2002-12-19

申请人： Jonathan McFarland ,  Suresh Golwalkar ,  Sampath K. V. Karikalan ,  Kevin J. Cote ,  Wu Chun Chou

发明人： Jonathan McFarland ,  Suresh Golwalkar ,  Sampath K. V. Karikalan ,  Kevin J. Cote ,  Wu Chun Chou

IPC分类号： G02B6/42 ,  G02B6/38 ,  G02B6/36

CPC分类号： G02B6/4292 ,  G02B6/4249

摘要： An optical coupler for forming an optical connection between one or more two dimensional photonic array devices and an optical fiber and for forming an electrical connection between the two dimensional photonic array devices and a substrate, a system including the optical coupler and materials, and methods of forming the optical coupler and system are disclosed. The optical coupler includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes alignment guides configured to receive guide pins from a fiber optic connector, such that when the fiber optic connector is attached to the optical coupler, fibers of the ribbon align with the two dimensional photonic array device(s) via the light transmission medium.

摘要翻译： 一种用于在一个或多个二维光子阵列器件和光纤之间形成光连接并用于形成二维光子阵列器件和衬底之间的电连接的光耦合器，包括光耦合器和材料的系统，以及 公开了形成光耦合器和系统。 光耦合器包括光传输介质和至少部分封装的电连接器。 另外，该装置包括对准引导件，其被配置为从光纤连接器接收引导销，使得当光纤连接器附接到光耦合器时，带的光纤经由二维光子阵列器件经由 光传输介质。

公开(公告)号：US07476037B2

公开(公告)日：2009-01-13

申请号：US11461656

申请日：2006-08-01

申请人： Suresh Golwalkar ,  Noah Davis ,  John Burns ,  Kannan Raj ,  Phil McClay ,  Wuchun Chou ,  Jonathan McFarland

发明人： Suresh Golwalkar ,  Noah Davis ,  John Burns ,  Kannan Raj ,  Phil McClay ,  Wuchun Chou ,  Jonathan McFarland

IPC分类号： G02B6/36 ,  H01R33/945 ,  B29D11/00

CPC分类号： G02B6/4231 ,  G02B6/3817 ,  G02B6/4201 ,  G02B6/4212 ,  G02B6/4249 ,  G02B6/4284 ,  G02B6/4292

摘要： A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

公开(公告)号：US06850658B2

公开(公告)日：2005-02-01

申请号：US10056757

申请日：2002-01-23

申请人： Suresh Golwalkar ,  Noah Davis ,  John Burns ,  Jonathan McFarland ,  Kevin Cote

发明人： Suresh Golwalkar ,  Noah Davis ,  John Burns ,  Jonathan McFarland ,  Kevin Cote

IPC分类号： G02B6/38 ,  G02B6/42 ,  G02B6/26 ,  G02B6/24

CPC分类号： G02B6/4231 ,  G02B6/3817 ,  G02B6/4201 ,  G02B6/4212 ,  G02B6/4249 ,  G02B6/4284 ,  G02B6/4292

摘要： A device for forming an optical connection between an optoelectronic device and an optical fiber, forming an electrical connection between the optoelectronic device and an integrated circuit, and a forming an electrical connection between the microelectronic device and a substrate, a system including the device, and a method of forming the device and system are disclosed. The device for forming an optical connection includes a light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector portion of a fiber ribbon cable assembly, such that when the fiber ribbon connector is attached to the device, the transmission medium provides an optical path between the optoelectronic device and the fiber.

摘要翻译： 一种用于在光电子器件和光纤之间形成光学连接的装置，在光电器件与集成电路之间形成电连接，以及在微电子器件与衬底之间形成电连接，包括该器件的系统和 公开了一种形成装置和系统的方法。 用于形成光学连接的装置包括至少部分封装的光传输介质和电连接器。 另外，该装置包括引导槽，该引导槽被配置为从光纤带状电缆组件的光纤带连接器部分接收引导销，使得当光纤带状连接器附接到该设备时，传输介质提供光电器件 和纤维。

公开(公告)号：US07101091B2

公开(公告)日：2006-09-05

申请号：US09911918

申请日：2001-07-24

申请人： Suresh Golwalkar ,  Noah Davis ,  John Burns ,  Kannan Raj ,  Phil McClay ,  Wuchun Chou ,  Jonathan McFarland

发明人： Suresh Golwalkar ,  Noah Davis ,  John Burns ,  Kannan Raj ,  Phil McClay ,  Wuchun Chou ,  Jonathan McFarland

IPC分类号： G02B6/36 ,  B29D11/00

CPC分类号： G02B6/4231 ,  G02B6/3817 ,  G02B6/4201 ,  G02B6/4212 ,  G02B6/4249 ,  G02B6/4284 ,  G02B6/4292

摘要： A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoelectronic device via the light transmission medium.

公开(公告)号：US20070053637A1

公开(公告)日：2007-03-08

申请号：US11461656

申请日：2006-08-01

申请人： Suresh Golwalkar ,  Noah Davis ,  John Burns ,  Kannan Raj ,  Phil McClay ,  Wuchun Chou ,  Jonathan McFarland

发明人： Suresh Golwalkar ,  Noah Davis ,  John Burns ,  Kannan Raj ,  Phil McClay ,  Wuchun Chou ,  Jonathan McFarland

IPC分类号： G02B6/36

CPC分类号： G02B6/4231 ,  G02B6/3817 ,  G02B6/4201 ,  G02B6/4212 ,  G02B6/4249 ,  G02B6/4284 ,  G02B6/4292

摘要： A device for forming an optical connection between an optoelectronic device and an optical fiber and for forming an electrical connection between the optoelectronic device and a substrate, a system including the device and materials, and methods of forming the device and system are disclosed. The device for forming an optical connection includes a—light transmission medium and electrical connectors, which are at least partially encapsulated. In addition, the device includes guide grooves configured to receive guide pins from a fiber ribbon connector, such that when the fiber ribbon connector is attached to the device, fibers of the ribbon align with the optoclectronic device via the light transmission medium.

摘要翻译： 公开了一种用于在光电子器件和光纤之间形成光连接并用于形成光电器件与衬底之间的电连接的装置，包括该器件和材料的系统以及形成器件和系统的方法。 用于形成光学连接的装置包括至少部分封装的光传输介质和电连接器。 另外，该装置包括构造成从光纤带连接器接收引导销的引导槽，使得当光纤带连接器附接到该装置时，带的光纤经由光传输介质与光电装置对准。

公开(公告)号：US06786651B2

公开(公告)日：2004-09-07

申请号：US10104942

申请日：2002-03-22

申请人： Kannan Raj ,  Wuchun Chou ,  C. Phillip McClay ,  Robert Carroll ,  Suresh Golwalkar ,  Noah Davis ,  John Burns

发明人： Kannan Raj ,  Wuchun Chou ,  C. Phillip McClay ,  Robert Carroll ,  Suresh Golwalkar ,  Noah Davis ,  John Burns

IPC分类号： G02B636

CPC分类号： G02B6/43 ,  G02B6/4214 ,  G02B6/424 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4257 ,  G02B6/4269 ,  G02B6/4274

摘要： A system for coupling optoelectronic devices, associated electrical components, and optical fibers is described. The system includes a substrate to which optoelectronic devices and at least some of the associated electronic components are formed on or formed using the substrate material. The substrate is further configured to receive and attach to one or more optical fibers. The system can be used to form transceivers for multiplexing and/or demultiplexing electronic information.

摘要翻译： 描述了用于耦合光电子器件，相关电子部件和光纤的系统。 该系统包括基板，光电子器件和至少一些相关联的电子元件在基底上形成，或者使用基板材料形成。 衬底还被配置为接收并附接到一个或多个光纤。 该系统可用于形成用于复用和/或解复用电子信息的收发器。