摘要:
Coding transmission equipment wherein an plurality of adaptive coding units having different processing characteristics are provided, and the adaptive coding unit having the optimum processing characteristic for a current input signal is selected from among the plurality of adaptive coding units, and an output signal from the optimum adaptive coding unit and the unit number thereof are transmitted to the receiver side. At the receiver side, the processing characteristic of a decoder is changed to become the optimum processing characteristic indicated by the received unit number, whereby a high quality recovered signal is realized.
摘要:
A variable rate coder for transforming an input signal into a low bit rate digital signal, comprising: a plurality of coding units each comprising an output quantizer having a different number of output bits, and each independently transforming the input signal into a respective compressed digital signal. A plurality of bit rate determined circuits are provided to determine an output of one of the plurality of coding units as a candidate output of the coder by a respective individual determining method, in which method, the quality of the signal which is regenerated from the output of each coding unit is compared with an individual predetermined quality evaluating standard, and then the candidate output of the coding unit having the smallest number of output bits, among the candidate outputs of coding units satisfying each standard, is determined as the actual output of the coder. One candidate output, among the plurality of the determined candidate outputs and, which is further determined by a most suitable determining method relative to the level of the input signal, thus is selected as the actual output of the coder. Further, when the number of the output bits in each of the coding units can be variably set, the most suitable number of output bits for the actual output of the coder is calculated based on prediction gains of the coding units, a required signal-to-noise ratio of the coder, and an ADC signal-to-noise ratio at the analog to digital converter, and the number of the output bits in each of the coding units is set based on the above calculated value, before the above operation by the bit rate determining circuits.
摘要:
Speech presence versus silence is decided by a discriminator which can use a certain combination of parameter values: signal power, prediction error power, prediction error power deviation, and zero crossings.
摘要:
A fluid applicator configured to apply a fluid to at least one substrate feature. The includes compressible reticulated media including an input interface configured for coupling with a fluid reservoir, and a substrate interface having an applicator profile corresponding to a feature profile of the at least one substrate feature. Reticulations extend from the input interface to the substrate interface, and the reticulations are distributed across the applicator profile. The compressible reticulated media includes filling and dispensing configurations. In the dispensing configuration the substrate interface is configured for engagement with the at least one substrate feature, the compressible reticulated media is compressed, and according to the compression the fluid is applied across the feature profile. In the filling configuration the compressible reticulated media is configured for expansion relative to the dispensing configuration, and the fluid infiltrates the reticulations according to the expansion.
摘要:
A method of fabricating an electronic package. The method includes filling a mold with an electric conductor to form a number of electrical interconnects within the mold. The mold includes openings that are filled with several electric conductors to form a number of electrical interconnects. The method of fabricating an electronic package further includes attaching the mold to a substrate such that the electrical interconnects engage electrical contacts on the substrate. The method of fabricating an electronic package may further include forming conductive pads on the electrical insulator that engage the electrical interconnects and attaching a die to the substrate such that the die is electrically connected to at least some of the electrical interconnects.
摘要:
An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.
摘要:
In one embodiment, a method includes forming a plurality of vias partially through a body, the vias including sidewalls defined by the body. An electrically insulating layer is formed on the sidewalls and on an upper surface of the body. An electrically conductive layer is formed on the insulating layer in the vias and on the upper surface, the electrically conductive layer defining first metal pads on the upper surface and second metal pads in contact with the first metal pads, the second metal pads having a denser pitch than the first metal pads. A dielectric layer is formed between adjacent first metal pads and between adjacent second metal pads. The body is thinned through a lower surface and the electrically insulating layer in the vias is exposed. After the thinning, a portion of the electrically insulating layer in the, vias is removed. The body is coupled to a substrate.
摘要:
A mounting substrate for a processor includes a die side and a land side with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor interconnect and a microelectronic die is embedded in the mounting substrate. The microelectronic die is coupled to the processor interconnect and communication between a processor to be installed on the processor footprint is in a rate between 10 Gb/s and 1 Tb/s.
摘要:
An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.
摘要:
A semiconductor device includes a first semiconductor chip 1, a second semiconductor chip 4, a first lead frame 3 including a first die pad 9 on which the first semiconductor chip 1 is mounted, and a second lead frame 5 including a second die pad 11 on which the second semiconductor chip 4 is mounted. A sealing structure 6 covers the first semiconductor chip 1 and the second semiconductor chip 4. A noise shield 7 is disposed between the first semiconductor chip 1 and the second semiconductor chip 4.