公开(公告)号：US20060134832A1

公开(公告)日：2006-06-22

申请号：US11241986

申请日：2005-10-04

申请人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

发明人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

IPC分类号： H01L21/78

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81013 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00014

摘要： The manufacturing method of the semiconductor device of the present invention has a step forming solder balls on the circuit face of a mother chip, a step making flip chip bonding of the daughter chip after the step forming solder balls on the circuit face of the mother chip, and a step making flip chip bonding of the mother chip on a circuit board using the solder balls.

摘要翻译： 本发明的半导体器件的制造方法具有在母芯片的电路面上形成焊球的步骤，在母芯片的电路面上形成焊球后的子芯片的倒装芯片接合工序 以及使用焊料球将母芯片在电路板上进行倒装芯片接合的步骤。

公开(公告)号：US07745258B2

公开(公告)日：2010-06-29

申请号：US12172812

申请日：2008-07-14

申请人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

发明人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

IPC分类号： H01L21/44

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81013 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00014

摘要： A manufacturing method of the semiconductor device including a step of forming solder balls on the circuit face of a mother chip, a step of making flip chip bonding of the daughter chip after the step of forming solder balls on the circuit face of the mother chip, and a step of making flip chip bonding of the mother chip on a circuit board using the solder balls.

摘要翻译： 一种半导体器件的制造方法，包括在母芯片的电路面上形成焊球的工序，在母芯片的电路面上形成焊球的步骤之后，对子芯片进行倒装芯片接合的工序， 以及使用焊料球将母芯片在电路板上进行倒装芯片接合的步骤。

公开(公告)号：US20080274590A1

公开(公告)日：2008-11-06

申请号：US12172812

申请日：2008-07-14

申请人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

发明人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

IPC分类号： H01L21/60

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81013 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00014

摘要： A manufacturing method of the semiconductor device including a step of forming solder balls on the circuit face of a mother chip, a step of making flip chip bonding of the daughter chip after the step of forming solder balls on the circuit face of the mother chip, and a step of making flip chip bonding of the mother chip on a circuit board using the solder balls.

摘要翻译： 一种半导体器件的制造方法，包括在母芯片的电路面上形成焊球的工序，在母芯片的电路面上形成焊球的步骤之后，对子芯片进行倒装芯片接合的工序， 以及使用焊料球将母芯片在电路板上进行倒装芯片接合的步骤。

公开(公告)号：US06462425B1

公开(公告)日：2002-10-08

申请号：US09429635

申请日：1999-10-29

申请人： Toshihiro Iwasaki ,  Masatoshi Yasunaga ,  Satoshi Yamada ,  Kozo Harada ,  Michitaka Kimura

发明人： Toshihiro Iwasaki ,  Masatoshi Yasunaga ,  Satoshi Yamada ,  Kozo Harada ,  Michitaka Kimura

IPC分类号： H01L2940

CPC分类号： H01L21/563 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device allowing a mounting of a semiconductor substrate with narrow electrode pad interval on an insulated circuit board while securing a favorable insulation characteristic and a manufacturing method thereof are obtained. The semiconductor device includes an electrode pad formed on a semiconductor substrate; a connecting underlying metal film connected to the electrode pad; a connecting conductor establishing electrical conduction between the connecting underlying metal film and a terminal electrode on an insulated circuit board; and non-conductive resin surrounding the connecting conductor and filling a gap between the substrate and the insulated circuit board. Here, the connecting underlying metal film is not covered by the connecting conductor at least in a peripheral region including an outer peripheral portion thereof

摘要翻译： 获得能够在确保良好的绝缘特性的同时将具有窄电极焊盘间隔的半导体衬底安装在绝缘电路板上的半导体器件及其制造方法。 半导体器件包括形成在半导体衬底上的电极焊盘; 连接到电极焊盘的连接底层金属膜; 连接导体，其在连接的底层金属膜和绝缘电路板上的端子电极之间建立导电; 以及围绕连接导体的非导电树脂，并填充衬底和绝缘电路板之间的间隙。 这里，至少在包括其外周部分的周边区域中，连接基底金属膜不被连接导体覆盖

公开(公告)号：US07443036B2

公开(公告)日：2008-10-28

申请号：US11241986

申请日：2005-10-04

申请人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

发明人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81013 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00014

摘要： The manufacturing method of the semiconductor device of the present invention has a step forming solder balls on the circuit face of a mother chip, a step making flip chip bonding of the daughter chip after the step forming solder balls on the circuit face of the mother chip, and a step making flip chip bonding of the mother chip on a circuit board using the solder balls.

摘要翻译： 本发明的半导体器件的制造方法具有在母芯片的电路面上形成焊球的步骤，在母芯片的电路面上形成焊球后的子芯片的倒装芯片接合工序 以及使用焊料球将母芯片在电路板上进行倒装芯片接合的步骤。

公开(公告)号：US20050082663A1

公开(公告)日：2005-04-21

申请号：US10963530

申请日：2004-10-14

申请人： Satoru Wakiyama ,  Kozo Harada ,  Michitaka Kimura

发明人： Satoru Wakiyama ,  Kozo Harada ,  Michitaka Kimura

IPC分类号： H01L23/473 ,  H01L23/467 ,  H01L23/538 ,  H01L25/065 ,  H05K1/18 ,  H01L23/34

CPC分类号： H01L23/5387 ,  H01L23/467 ,  H01L25/065 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K1/189

摘要： A semiconductor device includes a flexible printed circuit board which is formed into a cylindrical shape so that a heat releasing space is formed therein, a plurality of semiconductor elements which are mounted on the inner surface of the flexible printed circuit board via inner bumps, and an external electrode (external terminal) which is provided on the flexible printed circuit board and which connects a wire on the flexible printed circuit board to an external wire on a mounting board. Herein, the heat releasing space is provided with a cooler for cooling the space.

摘要翻译： 半导体器件包括形成为圆筒形状以便形成放热空间的柔性印刷电路板，多个半导体元件，其通过内部凸块安装在柔性印刷电路板的内表面上， 外部电极（外部端子），其设置在柔性印刷电路板上并将柔性印刷电路板上的导线连接到安装板上的外部电线。 这里，放热空间设置有用于冷却空间的冷却器。

公开(公告)号：US06677677B2

公开(公告)日：2004-01-13

申请号：US10106198

申请日：2002-03-27

申请人： Michitaka Kimura ,  Toshihiro Iwasaki ,  Yasumichi Hatanaka ,  Keiichiro Wakamiya

发明人： Michitaka Kimura ,  Toshihiro Iwasaki ,  Yasumichi Hatanaka ,  Keiichiro Wakamiya

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L23/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/14 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/17517 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81141 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H01L2924/00

摘要： The semiconductor device has a flip chip structure. The chip is electrically connected to the chip mounting member via function bumps provided on the chip. Dummy bumps acting against a local bending force of the chip are interposed between the chip and the chip mounting member.

摘要翻译： 半导体器件具有倒装芯片结构。 芯片通过设置在芯片上的功能凸块与芯片安装部件电连接。 作用在芯片的局部弯曲力的虚拟凸起插入在芯片和芯片安装部件之间。

公开(公告)号：US06756686B2

公开(公告)日：2004-06-29

申请号：US10224342

申请日：2002-08-21

申请人： Toshihiro Iwasaki ,  Keiichiro Wakamiya ,  Michitaka Kimura ,  Yasumichi Hatanaka

发明人： Toshihiro Iwasaki ,  Keiichiro Wakamiya ,  Michitaka Kimura ,  Yasumichi Hatanaka

IPC分类号： H01L2348

CPC分类号： H01L23/49838 ,  H01L23/16 ,  H01L24/81 ,  H01L2224/05026 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/81136 ,  H01L2224/81206 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00014

摘要： A semiconductor device includes a first substrate, a second substrate, a plurality of conductors, and supporting members. The first substrate has a plurality of electrode portions disposed on one side thereof. The second substrate has a plurality of electrode portions disposed on one side thereof. The conductors are for connecting the plurality of electrode portions of the first substrate to the plurality of electrode portions of the second substrate. The supporting members supporting the first substrate and the second substrate are disposed on a location where resonance caused by ultrasonic oscillation externally supplied is restrained in the state where the first substrate is connected to the second substrate. The supporting members prevent irregular oscillation and resonance caused by the ultrasonic oscillation.

摘要翻译： 半导体器件包括第一衬底，第二衬底，多个导体和支撑构件。 第一基板具有设置在其一侧的多个电极部。 第二基板具有设置在其一侧的多个电极部。 导体用于将第一基板的多个电极部分连接到第二基板的多个电极部分。 支撑第一基板和第二基板的支撑构件设置在在第一基板连接到第二基板的状态下被限制在由外部提供的超声波振荡引起的共振的位置。 支撑构件防止超声波振荡引起的不规则振荡和共振。

公开(公告)号：US06777814B2

公开(公告)日：2004-08-17

申请号：US10170588

申请日：2002-06-14

申请人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Keiichiro Wakamiya ,  Yasumichi Hatanaka

发明人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Keiichiro Wakamiya ,  Yasumichi Hatanaka

IPC分类号： H01L2348

CPC分类号： H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H03H3/08

摘要： A semiconductor device includes a semiconductor chip, and a circuit substrate disposed such that the circuit substrate faces the semiconductor chip and is electrically connected to the semiconductor chip through a connection conductor. A pad electrode and a terminal electrode are formed on a surface of the semiconductor chip and a surface of the circuit substrate, respectively. The connection conductor is connected between the pad electrode and the terminal electrode. The surface of the semiconductor and the surface of the circuit substrate face each other. A conductive dummy pattern is formed on the facing surface of the semiconductor chip or the circuit substrate. A space between the facing surfaces is filled with nonconductive resin. With this arrangement, it is possible to make uniform the temperature distribution between the facing surfaces, thereby making the temperature and the viscosity of the nonconductive resin uniform to reduce attenuation of ultrasonic waves.

摘要翻译： 半导体器件包括半导体芯片和电路基板，电路基板设置成电路基板面向半导体芯片，并通过连接导体电连接到半导体芯片。 在半导体芯片的表面和电路基板的表面上分别形成焊盘电极和端子电极。 连接导体连接在焊盘电极和端子电极之间。 半导体的表面和电路基板的表面彼此面对。 在半导体芯片或电路基板的相对表面上形成导电虚设图形。 面对表面之间的空间填充有非导电树脂。 通过这种布置，可以使相对表面之间的温度分布均匀，从而使非导电树脂的温度和粘度均匀，以减少超声波的衰减。

公开(公告)号：US06476502B2

公开(公告)日：2002-11-05

申请号：US09517050

申请日：2000-03-02

申请人： Satoshi Yamada ,  Michitaka Kimura ,  Masatoshi Yasunaga

发明人： Satoshi Yamada ,  Michitaka Kimura ,  Masatoshi Yasunaga

IPC分类号： H01L2348

CPC分类号： H01L25/0657 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05552

摘要： An insulating resin sheet made from a thermosetting resin is provided on an insulating substrate in such a manner as to cover bonding pads provided on the insulating substrate. A lower chip is set on the insulating substrate in such a manner that bonding bumps connected to inner connection terminals of the lower chip break the insulating resin sheet 24 to be in contact with the bonding pads. The insulating resin sheet is thermally cured and subsequently the bonding bumps are melted.

摘要翻译： 在绝缘基板上设置由热固性树脂制成的绝缘树脂片，以覆盖设置在绝缘基板上的接合焊盘。 将下部芯片设置在绝缘基板上，使得与下部芯片的内部连接端子连接的接合凸块将绝缘树脂片材24与接合焊盘接触。 绝缘树脂板被热固化，随后粘合凸块熔化。