公开(公告)号：US06462425B1

公开(公告)日：2002-10-08

申请号：US09429635

申请日：1999-10-29

申请人： Toshihiro Iwasaki ,  Masatoshi Yasunaga ,  Satoshi Yamada ,  Kozo Harada ,  Michitaka Kimura

发明人： Toshihiro Iwasaki ,  Masatoshi Yasunaga ,  Satoshi Yamada ,  Kozo Harada ,  Michitaka Kimura

IPC分类号： H01L2940

CPC分类号： H01L21/563 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/051 ,  H01L2224/05572 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/1312 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2224/13099 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device allowing a mounting of a semiconductor substrate with narrow electrode pad interval on an insulated circuit board while securing a favorable insulation characteristic and a manufacturing method thereof are obtained. The semiconductor device includes an electrode pad formed on a semiconductor substrate; a connecting underlying metal film connected to the electrode pad; a connecting conductor establishing electrical conduction between the connecting underlying metal film and a terminal electrode on an insulated circuit board; and non-conductive resin surrounding the connecting conductor and filling a gap between the substrate and the insulated circuit board. Here, the connecting underlying metal film is not covered by the connecting conductor at least in a peripheral region including an outer peripheral portion thereof

摘要翻译： 获得能够在确保良好的绝缘特性的同时将具有窄电极焊盘间隔的半导体衬底安装在绝缘电路板上的半导体器件及其制造方法。 半导体器件包括形成在半导体衬底上的电极焊盘; 连接到电极焊盘的连接底层金属膜; 连接导体，其在连接的底层金属膜和绝缘电路板上的端子电极之间建立导电; 以及围绕连接导体的非导电树脂，并填充衬底和绝缘电路板之间的间隙。 这里，至少在包括其外周部分的周边区域中，连接基底金属膜不被连接导体覆盖

公开(公告)号：US20060134832A1

公开(公告)日：2006-06-22

申请号：US11241986

申请日：2005-10-04

申请人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

发明人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

IPC分类号： H01L21/78

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81013 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00014

摘要： The manufacturing method of the semiconductor device of the present invention has a step forming solder balls on the circuit face of a mother chip, a step making flip chip bonding of the daughter chip after the step forming solder balls on the circuit face of the mother chip, and a step making flip chip bonding of the mother chip on a circuit board using the solder balls.

摘要翻译： 本发明的半导体器件的制造方法具有在母芯片的电路面上形成焊球的步骤，在母芯片的电路面上形成焊球后的子芯片的倒装芯片接合工序 以及使用焊料球将母芯片在电路板上进行倒装芯片接合的步骤。

公开(公告)号：US07443036B2

公开(公告)日：2008-10-28

申请号：US11241986

申请日：2005-10-04

申请人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

发明人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

IPC分类号： H01L23/48

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81013 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00014

摘要： The manufacturing method of the semiconductor device of the present invention has a step forming solder balls on the circuit face of a mother chip, a step making flip chip bonding of the daughter chip after the step forming solder balls on the circuit face of the mother chip, and a step making flip chip bonding of the mother chip on a circuit board using the solder balls.

摘要翻译： 本发明的半导体器件的制造方法具有在母芯片的电路面上形成焊球的步骤，在母芯片的电路面上形成焊球后的子芯片的倒装芯片接合工序 以及使用焊料球将母芯片在电路板上进行倒装芯片接合的步骤。

公开(公告)号：US07745258B2

公开(公告)日：2010-06-29

申请号：US12172812

申请日：2008-07-14

申请人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

发明人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

IPC分类号： H01L21/44

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81013 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00014

摘要： A manufacturing method of the semiconductor device including a step of forming solder balls on the circuit face of a mother chip, a step of making flip chip bonding of the daughter chip after the step of forming solder balls on the circuit face of the mother chip, and a step of making flip chip bonding of the mother chip on a circuit board using the solder balls.

摘要翻译： 一种半导体器件的制造方法，包括在母芯片的电路面上形成焊球的工序，在母芯片的电路面上形成焊球的步骤之后，对子芯片进行倒装芯片接合的工序， 以及使用焊料球将母芯片在电路板上进行倒装芯片接合的步骤。

公开(公告)号：US20080274590A1

公开(公告)日：2008-11-06

申请号：US12172812

申请日：2008-07-14

申请人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

发明人： Toshihiro Iwasaki ,  Michitaka Kimura ,  Kozo Harada

IPC分类号： H01L21/60

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/73203 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/81013 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15151 ,  H01L2924/15159 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/00014

摘要： A manufacturing method of the semiconductor device including a step of forming solder balls on the circuit face of a mother chip, a step of making flip chip bonding of the daughter chip after the step of forming solder balls on the circuit face of the mother chip, and a step of making flip chip bonding of the mother chip on a circuit board using the solder balls.

摘要翻译： 一种半导体器件的制造方法，包括在母芯片的电路面上形成焊球的工序，在母芯片的电路面上形成焊球的步骤之后，对子芯片进行倒装芯片接合的工序， 以及使用焊料球将母芯片在电路板上进行倒装芯片接合的步骤。

公开(公告)号：US20050082663A1

公开(公告)日：2005-04-21

申请号：US10963530

申请日：2004-10-14

申请人： Satoru Wakiyama ,  Kozo Harada ,  Michitaka Kimura

发明人： Satoru Wakiyama ,  Kozo Harada ,  Michitaka Kimura

IPC分类号： H01L23/473 ,  H01L23/467 ,  H01L23/538 ,  H01L25/065 ,  H05K1/18 ,  H01L23/34

CPC分类号： H01L23/5387 ,  H01L23/467 ,  H01L25/065 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K1/189

摘要： A semiconductor device includes a flexible printed circuit board which is formed into a cylindrical shape so that a heat releasing space is formed therein, a plurality of semiconductor elements which are mounted on the inner surface of the flexible printed circuit board via inner bumps, and an external electrode (external terminal) which is provided on the flexible printed circuit board and which connects a wire on the flexible printed circuit board to an external wire on a mounting board. Herein, the heat releasing space is provided with a cooler for cooling the space.

摘要翻译： 半导体器件包括形成为圆筒形状以便形成放热空间的柔性印刷电路板，多个半导体元件，其通过内部凸块安装在柔性印刷电路板的内表面上， 外部电极（外部端子），其设置在柔性印刷电路板上并将柔性印刷电路板上的导线连接到安装板上的外部电线。 这里，放热空间设置有用于冷却空间的冷却器。

公开(公告)号：US08018066B2

公开(公告)日：2011-09-13

申请号：US12753521

申请日：2010-04-02

申请人： Eiji Hayashi ,  Kyo Go ,  Kozo Harada ,  Shinji Baba

发明人： Eiji Hayashi ,  Kyo Go ,  Kozo Harada ,  Shinji Baba

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49827 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3142 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/373 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/81 ,  H01L2021/6015 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81909 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/0366 ,  H05K3/4602 ,  H05K2201/029 ,  H01L2924/0132 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2924/00014

摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

摘要翻译： 即使省略了加强件，也可以获得能够防止布线基板发生扭曲和变形的半导体装置。 对于具有布线基板的半导体器件，通过其与布线基板进行倒装芯片接合的半导体芯片和粘附到半导体芯片的背面的散热器，并且省略了用于加强布线的加强件 基板并且保持散热器的表面平滑度，布线基板具有分别形成直径不同的通孔的多个绝缘基板，并且每个绝缘基板包含玻璃布。

公开(公告)号：US07608156B2

公开(公告)日：2009-10-27

申请号：US10549164

申请日：2004-11-26

申请人： Yoshihiko Ono ,  Yasunobu Nagataki ,  Yasushi Tanaka ,  Kozo Harada ,  Hisanori Ando

发明人： Yoshihiko Ono ,  Yasunobu Nagataki ,  Yasushi Tanaka ,  Kozo Harada ,  Hisanori Ando

IPC分类号： C22C38/12 ,  C22C38/26 ,  C22C38/48 ,  C21D8/00

CPC分类号： C22C38/02 ,  C21D8/0236 ,  C21D8/0273 ,  C21D2211/005 ,  C22C38/04 ,  C22C38/06

摘要： This disclosure relates to a high strength cold rolled steel sheet composed of ferrite grains having an average grain diameter of 10 μm or less, in which the average number per unit area of Nb(C, N) precipitates having a diameter of 50 nm or more is 7.0×10−2/μm2 or less, and a zone having a width of 0.2 to 2.4 μm and an average area density of NbC precipitates of 60% or less of that of the central portion of the ferrite grains is formed along grain boundaries of the ferrite grains, for example, the steel sheet consisting of 0.004 to 0.02% of C, 1.5% or less of Si, 3% or less of Mn, 0.15% or less of P, 0.02% or less of S, 0.1 to 1.5% of sol.Al, 0.001 to 0.007% of N, 0.03 to 0.2% of Nb, by mass, and the balance of Fe and inevitable impurities. The steel sheet is most preferably used for automobile panel parts since it has the TS of 340 MPa or more and the superior surface strain resistance and press formability.

摘要翻译： 本发明涉及由平均粒径为10μm以下的铁素体晶粒构成的高强度冷轧钢板，其中，直径为50nm以上的Nb（C，N）析出物的平均单位面积数 为7.0×10 -2 / m 2以下，宽度为0.2〜2.4μm的区域和NbC析出物的平均面积密度为铁素体晶粒中央部的平均面积密度的60％以下，沿着 铁素体晶粒例如由C：0.004〜0.02％，Si：1.5％以下，Mn：3％以下，P：0.15％以下，S：0.02％以下，S：0.1〜1.5 ％的溶胶A1，0.001〜0.007％的N，0.03〜0.2％的Nb，其余为Fe和不可避免的杂质。 钢板最好用于汽车面板部件，因为其具有340MPa以上的TS和优异的表面应变阻力和冲压成形性。

公开(公告)号：US20090086209A1

公开(公告)日：2009-04-02

申请号：US12228478

申请日：2008-08-13

申请人： Mitsuaki Uesugi ,  Shoji Yoshikawa ,  Masaichi Inomata ,  Tsutomu Kawamura ,  Takahiko Oshige ,  Hiroyuki Sugiura ,  Akira Kazama ,  Tsuneo Suyama ,  Yasuo Kushida ,  Shuichi Harada ,  Hajime Tanaka ,  Osamu Uehara ,  Shuji Kaneto ,  Masahiro Iwabuchi ,  Kozo Harada ,  Shinichi Tomonaga ,  Shigemi Fukuda

发明人： Mitsuaki Uesugi ,  Shoji Yoshikawa ,  Masaichi Inomata ,  Tsutomu Kawamura ,  Takahiko Oshige ,  Hiroyuki Sugiura ,  Akira Kazama ,  Tsuneo Suyama ,  Yasuo Kushida ,  Shuichi Harada ,  Hajime Tanaka ,  Osamu Uehara ,  Shuji Kaneto ,  Masahiro Iwabuchi ,  Kozo Harada ,  Shinichi Tomonaga ,  Shigemi Fukuda

IPC分类号： G01N21/89 ,  B05C1/06

CPC分类号： B21C51/005 ,  G01N21/89

摘要： A defect marking device includes a flaw inspection device which has a plurality of light-receiving parts that identify reflected lights coming from an inspection plane of a metal strip under two or more of optical conditions different from each other; a signal processing section that judges the presence/absence of surface flaw on the inspection plane based on a combination of reflected light components identified under these optical conditions different from each other; and a marking device which applies marking that indicates information relating to the flaw on the surface of the metal strip.

摘要翻译： 缺陷标记装置包括：瑕疵检查装置，其具有多个受光部，该多个受光部在两个以上的光学条件彼此不同的情况下识别来自金属条的检查平面的反射光; 信号处理部，其基于在这些彼此不同的光学条件下识别的反射光分量的组合来判断检查平面上的表面缺陷的存在/不存在; 以及标记装置，其在金属带的表面上施加指示与缺陷有关的信息的标记。

公开(公告)号：US4368572A

公开(公告)日：1983-01-18

申请号：US197197

申请日：1980-10-15

申请人： Hirotaka Kanazawa ,  Yoshikazu Yasuda ,  Kozo Harada ,  Susumu Yoshida

发明人： Hirotaka Kanazawa ,  Yoshikazu Yasuda ,  Kozo Harada ,  Susumu Yoshida

IPC分类号： B23P11/00 ,  B23P15/00 ,  F16C11/06

CPC分类号： B23P15/00 ,  B23P11/005 ,  F16C11/0609 ,  B23P2700/11 ,  F16H2059/0269 ,  Y10T29/49833 ,  Y10T29/49879 ,  Y10T29/49934 ,  Y10T403/4966

摘要： A shaft structure comprising a shaft and a hollow spherical shell having diametrically aligned holes which are of a diameter smaller than the outer diameter of the shaft. The shell is secured to the shaft at the aligned holes by radially deforming the shaft. The method for manufacturing the shaft structure includes steps of forming the shell from a tubular blank by swaging the blank so that the opposite ends of the blank bite into the shaft to secure it firmly to the shaft.

摘要翻译： 一种轴结构，包括轴和具有径向对准的孔的中空球壳，其直径小于轴的外径。 壳体通过使轴径向变形而固定在对准的孔处的轴上。 用于制造轴结构的方法包括以下步骤：通过对坯料进行锻造来形成来自管状坯料的壳体，使得坯料的相对端咬入轴中以将其牢固地固定到轴上。