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14 条记录 (耗时 0.019 秒)

    Method of manufacturing a printed circuit board with an embedded electronic component
    2.
    发明授权
    Method of manufacturing a printed circuit board with an embedded electronic component 有权
    制造具有嵌入式电子部件的印刷电路板的方法

    公开(公告)号：US08266792B2

    公开(公告)日：2012-09-18

    申请号：US13362619

    申请日：2012-01-31

    申请人： Woon-Chun Kim ,  Soon-Gyu Yim

    发明人： Woon-Chun Kim ,  Soon-Gyu Yim

    IPC分类号： H05K3/20

    CPC分类号： H05K1/186 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K3/061 ,  H05K3/323 ,  H05K3/4652 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

    摘要翻译： 公开了一种具有电子部件嵌入式印刷电路板的印刷电路板及其制造方法。 根据本发明的实施例，制造具有在其一个表面上形成有凹槽的嵌入式电子部件和形成在凹槽内的电极的印刷电路板的制造方法包括：在第一电极的一个表面上形成第一电路图案 金属层 将第一金属层压在第一绝缘体上; 通过选择性地蚀刻第一金属层的另一个表面来形成第一导电突起; 以及通过设置导电粘合剂层来安装第一电子部件，使得第一电子部件的电极和第一导电突起彼此电连接。 因此，可以容易且可靠地安装不具有向外突出的电极的电子部件，并且可以缩短制造时间。

    Electronic component embedded printed circuit board and manufacturing method thereof
    4.
    发明授权
    Electronic component embedded printed circuit board and manufacturing method thereof 有权
    电子元件嵌入式印刷电路板及其制造方法

    公开(公告)号：US08130508B2

    公开(公告)日：2012-03-06

    申请号：US12416472

    申请日：2009-04-01

    申请人： Woon-Chun Kim ,  Soon-Gyu Yim

    发明人： Woon-Chun Kim ,  Soon-Gyu Yim

    IPC分类号： H05K1/14

    CPC分类号： H05K1/186 ,  H01L24/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H05K3/061 ,  H05K3/323 ,  H05K3/4652 ,  H05K2201/0367 ,  H05K2201/10674 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A printed circuit board with an electronic component embedded printed circuit board and a manufacturing method thereof are disclosed. According to an embodiment of the present invention, the method of manufacturing a printed circuit board with an embedded electronic component having a groove formed on one surface thereof and an electrode formed inside the groove includes: forming a first circuit pattern on one surface of a first metal layer; pressing the first metal layer against a first insulator; forming a first conductive protrusion by selectively etching the other surface of the first metal layer; and mounting a first electronic component by disposing a conductive adhesive layer such that an electrode of the first electronic component and the first conductive protrusion are electrically connected to each other. Thus, an electronic component without its electrode protruded outward can be mounted easily and reliably and the manufacturing time can be shortened.

    摘要翻译： 公开了具有电子部件嵌入式印刷电路板的印刷电路板及其制造方法。 根据本发明的实施例，制造具有在其一个表面上形成有凹槽的嵌入式电子部件和形成在凹槽内的电极的印刷电路板的制造方法包括：在第一电极的一个表面上形成第一电路图案 金属层 将第一金属层压在第一绝缘体上; 通过选择性地蚀刻第一金属层的另一个表面来形成第一导电突起; 以及通过设置导电粘合剂层来安装第一电子部件，使得第一电子部件的电极和第一导电突起彼此电连接。 因此，可以容易且可靠地安装不具有向外突出的电极的电子部件，并且可以缩短制造时间。

    MOBILE PHONE
    6.
    发明申请
    MOBILE PHONE 审中-公开
    移动电话

    公开(公告)号：US20110124382A1

    公开(公告)日：2011-05-26

    申请号：US12755764

    申请日：2010-04-07

    申请人： Woon-Chun Kim ,  Soon-Gyu Yim ,  Won-Tae Choi

    发明人： Woon-Chun Kim ,  Soon-Gyu Yim ,  Won-Tae Choi

    IPC分类号： H04B1/38 ,  H01L31/00

    CPC分类号： H04M19/08 ,  G06F1/1656 ,  G06F1/181 ,  H01G9/2031 ,  H01G9/2059 ,  H01G9/2068 ,  H04B1/3833 ,  Y02E10/542 ,  Y02P70/521

    摘要： Disclosed is a mobile phone that includes a body having a base layer formed on one surface thereof and a dye-sensitized solar cell mounted on one surface of the body to face the base layer and providing electricity to the body. The dye-sensitized solar cell includes a first transparent substrate, a first electrode, a second electrode, a light absorption layer, a catalytic layer, an electrolyte and a second substrate, and the base layer forms a background against a pattern formed by a dye such that the pattern can be identified when viewed from the outside.

    摘要翻译： 公开了一种移动电话，其包括具有在其一个表面上形成的基底层的主体和安装在主体的一个表面上以面向基底层并且向身体提供电力的染料敏化太阳能电池。 染料敏化太阳能电池包括第一透明基板，第一电极，第二电极，光吸收层，催化层，电解质和第二基板，并且基层与由染料形成的图案形成背景 使得当从外部观察时可以识别图案。

    Capacitor and manufacturing method thereof
    7.
    发明授权
    Capacitor and manufacturing method thereof 有权
    电容器及其制造方法

    公开(公告)号：US08199456B2

    公开(公告)日：2012-06-12

    申请号：US12078648

    申请日：2008-04-02

    申请人： Sung-Taek Lim ,  Yul-Kyo Chung ,  Woon-Chun Kim

    发明人： Sung-Taek Lim ,  Yul-Kyo Chung ,  Woon-Chun Kim

    IPC分类号： H01G4/06

    CPC分类号： H01G4/33 ,  H01G2/06 ,  H01G4/10 ,  H05K1/162 ,  H05K3/048 ,  H05K3/244 ,  H05K2201/0175 ,  H05K2201/0179 ,  H05K2203/0315 ,  Y10T29/435

    摘要： A capacitor and a method of manufacturing the capacitor are disclosed. The capacitor may include a board, a polymer layer formed on one side of the board, a circuit pattern selectively formed over the polymer layer, and a titania nanosheet corresponding with the circuit pattern. Embodiments of the invention can provide flatness in the board, and allows the copper of the board to maintain its functionality as an electrode while increasing the adhesion to the titania nanosheet. The titania nanosheet may thus be implemented on a patterned board in a desired shape, number of layers, and thickness.

    摘要翻译： 公开了电容器和制造该电容器的方法。 电容器可以包括板，形成在板的一侧上的聚合物层，选择性地形成在聚合物层上的电路图案，以及与电路图案对应的二氧化钛纳米片。 本发明的实施例可以提供板中的平坦度，并且允许板的铜保持其作为电极的功能，同时增加与二氧化钛纳米片的粘合性。 因此，二氧化钛纳米片可以在图案化的板上实现所需的形状，层数和厚度。

    Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof
    9.
    发明申请
    Substrate for capacitor-embedded printed circuit board, capacitor-embedded printed circuit board and manufacturing method thereof 审中-公开
    用于电容器嵌入式印刷电路板的基板，电容器嵌入式印刷电路板及其制造方法

    公开(公告)号：US20090244864A1

    公开(公告)日：2009-10-01

    申请号：US12320794

    申请日：2009-02-04

    申请人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Sang-Chul Lee ,  Jong-Woo Han ,  Young-Do Kweon

    发明人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Sang-Chul Lee ,  Jong-Woo Han ,  Young-Do Kweon

    IPC分类号： H05K1/18 ,  B32B7/00 ,  B32B37/02

    CPC分类号： H05K1/162 ,  H05K3/108 ,  H05K3/386 ,  H05K3/387 ,  H05K3/4602 ,  H05K3/4626 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09672 ,  Y10T428/24355

    摘要： Disclosed are a substrate for a capacitor-embedded printed circuit board, a capacitor-embedded printed circuit board, and a manufacturing method thereof. The capacitor-embedded printed circuit board can include a core board, an insulation resin layer, which is stacked on the core board, a first electrode and a first circuit pattern, which are buried in the insulation resin layer, a dielectric layer, which is stacked on a surface of the insulation resin layer, a first adhesive resin layer, which is stacked on the dielectric layer, and a second electrode and a second circuit pattern, which are formed on a surface of the first adhesive resin layer to correspond with the first electrode. With the present invention, the manufacturing process can be simplified and the reliability of products can be improved by reducing the variation of the capacitor (C).

    摘要翻译： 公开了用于电容器嵌入式印刷电路板的基板，电容器嵌入式印刷电路板及其制造方法。 电容器嵌入式印刷电路板可以包括堆叠在芯板上的芯板，绝缘树脂层，埋在绝缘树脂层中的第一电极和第一电路图案，介电层，其是 堆叠在绝缘树脂层的表面上，堆叠在电介质层上的第一粘合树脂层和形成在第一粘合树脂层的表面上的第二电极和第二电路图案，以对应于 第一电极。 利用本发明，可以简化制造工艺，并且可以通过减小电容器（C）的变化来提高产品的可靠性。