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公开(公告)号：US20150340817A1
公开(公告)日：2015-11-26
申请号：US14286494
申请日：2014-05-23
申请人： Xiang Li , Hao-Han Hsu , Yun Ling , Gong Ouyang , Kai Xiao , Jiangqi He , Lu-Vong T. Phan , Wei Xu
发明人： Xiang Li , Hao-Han Hsu , Yun Ling , Gong Ouyang , Kai Xiao , Jiangqi He , Lu-Vong T. Phan , Wei Xu
IPC分类号： H01R13/6598 , H01R43/18 , H05K3/36 , H01R12/72 , H05K3/28
CPC分类号： H01R13/6598 , H01R12/712 , H01R12/721 , H01R12/724 , H01R13/658 , H01R43/18 , H05K3/284 , H05K3/36 , Y10T29/49128
摘要： In an embodiment, a connector such as an edge connector includes a connector housing, a first set of pins configured within the housing and having first ends to couple to corresponding signal lines of a first circuit board and second ends to couple to corresponding signal lines of a mating connector of a second circuit board, and a conductive material adapted to the housing to reduce interference caused by one or more sources of interference. Other embodiments are described and claimed.
摘要翻译： 在一个实施例中，诸如边缘连接器的连接器包括连接器壳体，构造在壳体内的第一组引脚，并且具有耦合到第一电路板的相应信号线的第一端和第二端耦合到相应的信号线 第二电路板的配合连接器以及适于壳体的导电材料，以减少由一个或多个干扰源造成的干扰。 描述和要求保护其他实施例。
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公开(公告)号：US20150280343A1
公开(公告)日：2015-10-01
申请号：US14227009
申请日：2014-03-27
申请人： Hao-Han Hsu , Yun Ling , Xiang Li
发明人： Hao-Han Hsu , Yun Ling , Xiang Li
IPC分类号： H01R13/24 , H01R43/16 , H01R13/6581
CPC分类号： H01R13/2421 , H01R12/724 , H01R13/4538 , H01R13/6583 , H01R2201/06 , Y10T29/49222
摘要： In accordance with some embodiments, a high speed connection may be implemented using pogo-pins. The use of pogo-pins may be advantageous because accurate alignment is not required, connection force is generally lower than with other connections and appearance is often highly advantageous. Through the use of a moveable metal shield, an advantageous high speed connection for high speed signaling may be implemented between the two devices.
摘要翻译： 根据一些实施例，可以使用弹簧针来实现高速连接。 使用弹簧销可能是有利的，因为不需要精确对准，连接力通常低于与其它连接件的连接力，并且外观通常是非常有利的。 通过使用可移动金属屏蔽，可以在两个装置之间实现用于高速信号的有利的高速连接。
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公开(公告)号：US20170093059A1
公开(公告)日：2017-03-30
申请号：US14866610
申请日：2015-09-25
申请人： Kuan-yu Chen , Hao-han Hsu , Jingbo Li , Xiang Li
发明人： Kuan-yu Chen , Hao-han Hsu , Jingbo Li , Xiang Li
CPC分类号： H01R12/594 , H01R12/79 , H01R12/87 , H01R43/205 , H05K1/0215 , H05K1/0216 , H05K1/0219 , H05K1/14 , H05K1/147 , H05K2201/10189
摘要： Techniques and mechanisms for providing a reference potential with a flexible circuit device. In an embodiment, the flexible circuit device includes a first interconnect to exchange a signal and a second interconnect to exchange a reference potential that facilitates shielding of the signal. The first and second interconnects are variously coupled to a printed circuit board (PCB) via a first contact and a second contact of a hardware interface. During such coupling, a maximum height of the second interconnect from a side of the PCB at the hardware interface is greater than a maximum height of the first interconnect from the side of the PCB at the hardware interface. In another embodiment, a distance of the first contact from an end of the flexible circuit device is different than a distance of the second contact from the end of the flexible circuit device.
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公开(公告)号：US20230046581A1
公开(公告)日：2023-02-16
申请号：US17728099
申请日：2022-04-25
申请人： Xiang Li , Shaohua Li , Landon Hanks , Kai Xiao , Mo Liu , Jingbo Li
发明人： Xiang Li , Shaohua Li , Landon Hanks , Kai Xiao , Mo Liu , Jingbo Li
摘要： An apparatus and method for reducing differential cross-talk in a pin arrangement of a socket are described. Socket pins within a differential pair use a modified shape to tighten the intra-pair pin coupling to reduce the crosstalk without changing the pin map. The middle vertical segment of one pin of a diagonally adjacent differential pin pair is modified to be closer to the other pin than other corresponding locations of the pins. The spring beam that extends from the middle vertical segment of the one pin is modified to accommodate the package landing pad that the spring beam contacts to maintain a uniform pitch.
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公开(公告)号：US09787028B2
公开(公告)日：2017-10-10
申请号：US13997893
申请日：2012-03-31
申请人： Raul Enriquez-Shibayama , Kai Xiao , Xiang Li
发明人： Raul Enriquez-Shibayama , Kai Xiao , Xiang Li
IPC分类号： H01R13/6461 , H01R12/73 , H01R13/6471
CPC分类号： H01R13/6461 , H01R12/737 , H01R13/6471 , H01R2201/06
摘要： Apparatus and methods of arranging ground pins and signal pins in a card connector includes arranging a signal pins and ground pins in a card connector into at least six (6) columns divided between a primary side and a secondary side of the connector.
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公开(公告)号：US20140162498A1
公开(公告)日：2014-06-12
申请号：US13997893
申请日：2012-03-31
申请人： Raul Enriquez-Shibayama , Kai Xiao , Xiang Li
发明人： Raul Enriquez-Shibayama , Kai Xiao , Xiang Li
IPC分类号： H01R13/6461
CPC分类号： H01R13/6461 , H01R12/737 , H01R13/6471 , H01R2201/06
摘要： Apparatus and methods of arranging ground pins and signal pins in a card connector includes arranging a signal pins and ground pins in a card connector into at least six (6) columns divided between a primary side and a secondary side of the connector.
摘要翻译： 将接地引脚和信号引脚布置在卡连接器中的装置和方法包括将卡连接器中的信号引脚和接地引脚布置成分开在连接器的初级侧和次级侧之间的至少六（6）列。
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公开(公告)号：US20150171535A1
公开(公告)日：2015-06-18
申请号：US13994023
申请日：2011-12-28
申请人： Xiang Li , Chong J. Zhao , Jefferey L. Krieger , Dan Willis , John M. Lynch , Yun Ling
发明人： Xiang Li , Chong J. Zhao , Jefferey L. Krieger , Dan Willis , John M. Lynch , Yun Ling
CPC分类号： H01R12/732 , H01R12/721 , H01R12/83 , H05K1/181 , H05K2201/10159
摘要： According to some embodiments, a SODIMM memory connector comprises a first socket to electrically couple a first SODIMM, and a second socket to electrically couple a second SODIMM, where the first socket is disposed vertically adjacent to the second socket.
摘要翻译： 根据一些实施例，SODIMM存储器连接器包括用于电耦合第一SODIMM的第一插座和用于电耦合第二SODIMM的第二插座，其中第一插座垂直地邻近第二插座设置。
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公开(公告)号：US20140377968A1
公开(公告)日：2014-12-25
申请号：US13996004
申请日：2011-12-23
申请人： Michael Leddige , Yun Ling , Kuan-Yu Chen , Kai Wang , Xiang Li , Howard Heck
发明人： Michael Leddige , Yun Ling , Kuan-Yu Chen , Kai Wang , Xiang Li , Howard Heck
CPC分类号： H01R4/48 , H01R12/71 , H01R12/716 , H01R12/721 , H01R13/24 , H01R13/6658 , H01R43/18 , Y10T29/49208
摘要： Methods and systems to support input output (IO) communications may include an IO connector having a housing with surfaces defining a paddle card region, and a set of compressible contacts extending vertically through the housing into the paddle card region. In addition, an IO interconnect can include a cable portion and at least one end portion coupled to the cable portion. The end portion may include a paddle card having a circuit board with a set of contacts disposed on a bottom surface of the circuit board. The end portion can also include an asymmetric metal shell having a configuration that encloses at least a portion of the paddle card and exposes the set of contacts.
摘要翻译： 支持输入输出（IO）通信的方法和系统可以包括具有壳体的IO连接器，所述壳体具有限定桨卡区域的表面，以及一组垂直延伸穿过壳体进入桨卡区域的可压缩触点。 此外，IO互连可以包括电缆部分和耦合到电缆部分的至少一个端部部分。 端部可以包括具有电路板的桨卡，该电路板具有布置在电路板的底表面上的一组触点。 端部部分还可以包括不对称的金属壳体，该壳体具有包围桨片的至少一部分并且暴露该组触点的构造。
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公开(公告)号：US09391378B2
公开(公告)日：2016-07-12
申请号：US13996004
申请日：2011-12-23
申请人： Michael Leddige , Yun Ling , Kuan-Yu Chen , Kai Wang , Xiang Li , Howard Heck
发明人： Michael Leddige , Yun Ling , Kuan-Yu Chen , Kai Wang , Xiang Li , Howard Heck
CPC分类号： H01R4/48 , H01R12/71 , H01R12/716 , H01R12/721 , H01R13/24 , H01R13/6658 , H01R43/18 , Y10T29/49208
摘要： Methods and systems to support input output (IO) communications may include an IO connector having a housing with surfaces defining a paddle card region, and a set of compressible contacts extending vertically through the housing into the paddle card region. In addition, an IO interconnect can include a cable portion and at least one end portion coupled to the cable portion. The end portion may include a paddle card having a circuit board with a set of contacts disposed on a bottom surface of the circuit board. The end portion can also include an asymmetric metal shell having a configuration that encloses at least a portion of the paddle card and exposes the set of contacts.
摘要翻译： 支持输入输出（IO）通信的方法和系统可以包括具有壳体的IO连接器，所述壳体具有限定桨卡区域的表面，以及一组垂直延伸穿过壳体进入桨卡区域的可压缩触点。 此外，IO互连可以包括电缆部分和耦合到电缆部分的至少一个端部部分。 端部可以包括具有电路板的桨卡，该电路板具有布置在电路板的底表面上的一组触点。 端部部分还可以包括不对称的金属壳体，该壳体具有包围桨片的至少一部分并且暴露该组触点的构造。
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公开(公告)号：US20160183374A1
公开(公告)日：2016-06-23
申请号：US14575775
申请日：2014-12-18
申请人： Mani Prakash , Thomas T. Holden , Jeffory L. Smalley , Ram S. Viswanath , Bassam N. Coury , Dimitrios Ziakas , Chong J. Zhao , Jonathan W. Thibado , Gregorio R. Murtagian , Kuang C. Liu , Rajasekaran Swaminathan , Zhichao Zhang , John M. Lynch , David J. Llapitan , Sanka Ganesan , Xiang Li , George Vergis
发明人： Mani Prakash , Thomas T. Holden , Jeffory L. Smalley , Ram S. Viswanath , Bassam N. Coury , Dimitrios Ziakas , Chong J. Zhao , Jonathan W. Thibado , Gregorio R. Murtagian , Kuang C. Liu , Rajasekaran Swaminathan , Zhichao Zhang , John M. Lynch , David J. Llapitan , Sanka Ganesan , Xiang Li , George Vergis
CPC分类号： H05K1/181 , H01L23/00 , H01L23/498 , H01L2224/16225 , H01L2924/15311 , H01R12/712 , H01R12/79 , H05K2201/10159 , H05K2201/10325 , Y02P70/611
摘要： Configurable central processing unit (CPU) package substrates are disclosed. A package substrate is described that includes a processing device interface. The package substrate also includes a memory device electrical interface disposed on the package substrate. The package substrate also includes a removable memory mechanical interface disposed proximately to the memory device electrical interface. The removable memory mechanical interface is to allow a memory device to be easily removed from the package substrate after attachment of the memory device to the package substrate.
摘要翻译： 公开了可配置的中央处理单元（CPU）封装基板。 描述了包括处理设备接口的封装衬底。 封装衬底还包括设置在封装衬底上的存储器件电接口。 封装衬底还包括靠近存储器件电接口设置的可移除存储器机械接口。 可移除存储器机械接口是允许在将存储器件附接到封装衬底之后容易地从封装衬底移除存储器件。
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