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1.发明授权公开(公告)号：US09209106B2
公开(公告)日：2015-12-08
申请号：US13529720
申请日：2012-06-21
申请人： Xiao Ling Shi , Suming Hu , Liane Martinez , Roden Topacio , Terence Cheung
发明人： Xiao Ling Shi , Suming Hu , Liane Martinez , Roden Topacio , Terence Cheung
IPC分类号： H05K7/20 , H01L23/367 , H01L23/498 , H05K1/02 , H05K3/34
CPC分类号： H01L23/3677 , H01L23/49833 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/15311 , H05K1/0206 , H05K3/3436 , H05K2201/10416 , Y10T29/49139
摘要： A method of assembling a semiconductor chip device is provided. The method includes providing a first circuit board that has a plurality of thermally conductive vias. A second circuit board is mounted on the first circuit board over and in thermal contact with the thermally conductive vias. The second circuit board includes first side facing the first circuit board and a second and opposite side.
摘要翻译： 提供了组装半导体芯片器件的方法。 该方法包括提供具有多个导热通孔的第一电路板。 第二电路板安装在第一电路板上并与导热通孔热接触。 第二电路板包括面向第一电路板的第一面和第二相对侧。
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公开(公告)号：US20130343000A1
公开(公告)日：2013-12-26
申请号：US13529720
申请日：2012-06-21
申请人： Xiao Ling Shi , Suming Hu , Liane Martinez , Roden Topacio , Terence Cheung
发明人： Xiao Ling Shi , Suming Hu , Liane Martinez , Roden Topacio , Terence Cheung
CPC分类号： H01L23/3677 , H01L23/49833 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/15311 , H05K1/0206 , H05K3/3436 , H05K2201/10416 , Y10T29/49139
摘要： A method of assembling a semiconductor chip device is provided. The method includes providing a first circuit board that has a plurality of thermally conductive vias. A second circuit board is mounted on the first circuit board over and in thermal contact with the thermally conductive vias. The second circuit board includes first side facing the first circuit board and a second and opposite side.
摘要翻译： 提供了组装半导体芯片器件的方法。 该方法包括提供具有多个导热通孔的第一电路板。 第二电路板安装在第一电路板上并与导热通孔热接触。 第二电路板包括面向第一电路板的第一面和第二相对侧。
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公开(公告)号：US08564122B2
公开(公告)日：2013-10-22
申请号：US13316040
申请日：2011-12-09
申请人： Neil R. McLellan , Liane Martinez , Yip Seng Low , Suming Hu
发明人： Neil R. McLellan , Liane Martinez , Yip Seng Low , Suming Hu
IPC分类号： H01L23/10
CPC分类号： H01L23/3675 , H01L21/4853 , H01L21/563 , H01L23/16 , H01L23/36 , H01L23/373 , H01L23/42 , H01L23/433 , H01L23/467 , H01L23/49816 , H01L23/562 , H01L23/642 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/16227 , H01L2224/26175 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83192 , H01L2224/83194 , H01L2224/83815 , H01L2224/92225 , H01L2224/97 , H01L2924/00011 , H01L2924/00013 , H01L2924/01322 , H01L2924/15311 , H01L2924/19105 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2224/05599 , H01L2924/00 , H01L2224/81805
摘要： Various circuit boards and methods of fabricating the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an electrically non-functional component to a surface of a first circuit board. The electrically non-functional component has a first elevation. The surface of the circuit board is adapted to have a semiconductor chip mounted thereon. An electrically functional component is mounted to the surface inward from the electrically non-functional component. The electrically functional component has a second elevation less than the first elevation.
摘要翻译： 公开了各种电路板及其制造方法。 在一个方面，提供了一种制造方法，其包括将电非功能部件耦合到第一电路板的表面。 电非功能部件具有第一高度。 电路板的表面适于安装有半导体芯片。 电功能部件从电气非功能部件向内安装到表面。 电功能部件具有小于第一高度的第二仰角。
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公开(公告)号：US20130147012A1
公开(公告)日：2013-06-13
申请号：US13316040
申请日：2011-12-09
申请人： Neil R. McLellan , Liane Martinez , Yip Seng Low , Suming Hu
发明人： Neil R. McLellan , Liane Martinez , Yip Seng Low , Suming Hu
CPC分类号： H01L23/3675 , H01L21/4853 , H01L21/563 , H01L23/16 , H01L23/36 , H01L23/373 , H01L23/42 , H01L23/433 , H01L23/467 , H01L23/49816 , H01L23/562 , H01L23/642 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/16227 , H01L2224/26175 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/83192 , H01L2224/83194 , H01L2224/83815 , H01L2224/92225 , H01L2224/97 , H01L2924/00011 , H01L2924/00013 , H01L2924/01322 , H01L2924/15311 , H01L2924/19105 , H01L2224/83 , H01L2224/13099 , H01L2224/05099 , H01L2224/05599 , H01L2924/00 , H01L2224/81805
摘要： Various circuit boards and methods of fabricating the same are disclosed. In one aspect, a method of manufacturing is provided that includes coupling an electrically non-functional component to a surface of a first circuit board. The electrically non-functional component has a first elevation. The surface of the circuit board is adapted to have a semiconductor chip mounted thereon. An electrically functional component is mounted to the surface inward from the electrically non-functional component. The electrically functional component has a second elevation less than the first elevation.
摘要翻译： 公开了各种电路板及其制造方法。 在一个方面，提供了一种制造方法，其包括将电非功能部件耦合到第一电路板的表面。 电非功能部件具有第一高度。 电路板的表面适于安装有半导体芯片。 电功能部件从电气非功能部件向内安装到表面。 电功能部件具有小于第一高度的第二仰角。
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公开(公告)号：US20170110428A1
公开(公告)日：2017-04-20
申请号：US15395859
申请日：2016-12-30
申请人： Roden R. Topacio , Suming Hu , Yip Seng Low
发明人： Roden R. Topacio , Suming Hu , Yip Seng Low
IPC分类号： H01L23/00
CPC分类号： H01L24/16 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/81 , H01L2224/02166 , H01L2224/0345 , H01L2224/0346 , H01L2224/03464 , H01L2224/0348 , H01L2224/03831 , H01L2224/03903 , H01L2224/0401 , H01L2224/05012 , H01L2224/05017 , H01L2224/05019 , H01L2224/05027 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05564 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05672 , H01L2224/05681 , H01L2224/085 , H01L2224/10126 , H01L2224/1146 , H01L2224/1148 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/14131 , H01L2224/16057 , H01L2224/16104 , H01L2224/16221 , H01L2224/16227 , H01L2224/165 , H01L2224/17104 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2924/12042 , H05K3/3436 , H05K3/4629 , H05K3/4644 , H05K3/4682 , H05K2201/10674 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/01074 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
摘要： Various semiconductor chip solder bump and underbump metallization (UBM) structures and methods of making the same are disclosed. In one aspect, a method is provided that includes forming a first underbump metallization layer on a semiconductor chip is provided. The first underbump metallization layer has a hub, a first portion extending laterally from the hub, and a spoke connecting the hub to the first portion. A polymer layer is applied to the first underbump metallization layer. The polymer layer includes a first opening in alignment with the hub and a second opening in alignment with the spoke. A portion of the spoke is removed via the second opening to sever the connection between the hub and the first portion.
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6.发明申请公开(公告)号：US20150279794A1
公开(公告)日：2015-10-01
申请号：US14242008
申请日：2014-04-01
申请人： Roden R. Topacio , Suming Hu , Yip Seng Low
发明人： Roden R. Topacio , Suming Hu , Yip Seng Low
IPC分类号： H01L23/00
CPC分类号： H01L24/16 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/81 , H01L2224/02166 , H01L2224/0345 , H01L2224/0346 , H01L2224/03464 , H01L2224/0348 , H01L2224/03831 , H01L2224/03903 , H01L2224/0401 , H01L2224/05012 , H01L2224/05017 , H01L2224/05019 , H01L2224/05027 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05564 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05672 , H01L2224/05681 , H01L2224/085 , H01L2224/10126 , H01L2224/1146 , H01L2224/1148 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/14131 , H01L2224/16057 , H01L2224/16104 , H01L2224/16221 , H01L2224/16227 , H01L2224/165 , H01L2224/17104 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2924/12042 , H05K3/3436 , H05K3/4629 , H05K3/4644 , H05K3/4682 , H05K2201/10674 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/01074 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
摘要： Various semiconductor chip solder bump and underbump metallization (UBM) structures and methods of making the same are disclosed. In one aspect, a method is provided that includes forming a first underbump metallization layer on a semiconductor chip is provided. The first underbump metallization layer has a hub, a first portion extending laterally from the hub, and a spoke connecting the hub to the first portion. A polymer layer is applied to the first underbump metallization layer. The polymer layer includes a first opening in alignment with the hub and a second opening in alignment with the spoke. A portion of the spoke is removed via the second opening to sever the connection between the hub and the first portion.
摘要翻译： 公开了各种半导体芯片焊料凸块和底部金属化（UBM）结构及其制造方法。 一方面，提供了一种方法，其包括在半导体芯片上形成第一底部金属化层。 第一底部浸渍金属化层具有毂，从轮毂横向延伸的第一部分和将轮毂连接到第一部分的辐条。 将聚合物层施加到第一底部金属化层。 聚合物层包括与轮毂对准的第一开口和与轮辐对准的第二开口。 轮辐的一部分经由第二开口移除以切断轮毂与第一部分之间的连接。
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公开(公告)号：US09867282B2
公开(公告)日：2018-01-09
申请号：US14451757
申请日：2014-08-05
申请人： Suming Hu , Neil McLellan , Andrew K W Leung , Jianguo Li
发明人： Suming Hu , Neil McLellan , Andrew K W Leung , Jianguo Li
CPC分类号： H05K1/0271 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L2924/0002 , H01L2924/14 , H01L2924/3511 , H05K3/0052 , H05K3/3442 , H05K2201/09027 , H05K2201/09154 , H05K2201/2009 , H05K2201/2018 , H05K2203/0228 , H05K2203/0746 , H05K2203/107 , Y10T29/49155 , H01L2924/00
摘要： A method of manufacturing is provided that includes singulating a circuit board from a substrate of plural of the circuit boards, wherein the circuit board is shaped to have four corner hollows. The corner hollows may be various shapes.
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8.发明授权公开(公告)号：US09576923B2
公开(公告)日：2017-02-21
申请号：US14242008
申请日：2014-04-01
申请人： Roden R. Topacio , Suming Hu , Yip Seng Low
发明人： Roden R. Topacio , Suming Hu , Yip Seng Low
CPC分类号： H01L24/16 , H01L24/03 , H01L24/05 , H01L24/08 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/81 , H01L2224/02166 , H01L2224/0345 , H01L2224/0346 , H01L2224/03464 , H01L2224/0348 , H01L2224/03831 , H01L2224/03903 , H01L2224/0401 , H01L2224/05012 , H01L2224/05017 , H01L2224/05019 , H01L2224/05027 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05166 , H01L2224/05564 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05672 , H01L2224/05681 , H01L2224/085 , H01L2224/10126 , H01L2224/1146 , H01L2224/1148 , H01L2224/11849 , H01L2224/131 , H01L2224/13111 , H01L2224/14131 , H01L2224/16057 , H01L2224/16104 , H01L2224/16221 , H01L2224/16227 , H01L2224/165 , H01L2224/17104 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2924/12042 , H05K3/3436 , H05K3/4629 , H05K3/4644 , H05K3/4682 , H05K2201/10674 , H01L2924/00 , H01L2924/00014 , H01L2924/014 , H01L2924/01074 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/00012
摘要： Various semiconductor chip solder bump and underbump metallization (UBM) structures and methods of making the same are disclosed. In one aspect, a method is provided that includes forming a first underbump metallization layer on a semiconductor chip is provided. The first underbump metallization layer has a hub, a first portion extending laterally from the hub, and a spoke connecting the hub to the first portion. A polymer layer is applied to the first underbump metallization layer. The polymer layer includes a first opening in alignment with the hub and a second opening in alignment with the spoke. A portion of the spoke is removed via the second opening to sever the connection between the hub and the first portion.
摘要翻译： 公开了各种半导体芯片焊料凸块和底部金属化（UBM）结构及其制造方法。 一方面，提供了一种方法，其包括在半导体芯片上形成第一底部金属化层。 第一底部浸渍金属化层具有毂，从轮毂横向延伸的第一部分和将轮毂连接到第一部分的辐条。 将聚合物层施加到第一底部金属化层。 聚合物层包括与轮毂对准的第一开口和与轮辐对准的第二开口。 轮辐的一部分经由第二开口移除以切断轮毂与第一部分之间的连接。
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公开(公告)号：US20160073493A1
公开(公告)日：2016-03-10
申请号：US14478561
申请日：2014-09-05
申请人： Andrew KW Leung , Suming Hu , Jianguo Li
发明人： Andrew KW Leung , Suming Hu , Jianguo Li
CPC分类号： H05K1/0271 , H01L23/4334 , H01L23/49816 , H01L2924/0002 , H05K1/181 , H05K2201/09136 , H05K2201/10424 , H01L2924/00
摘要： Various stiffener rings and circuit boards are disclosed. In one aspect, an apparatus is provided that includes a stiffener ring that has a first flange to engage a first principal side of a circuit board and a peripheral wall to engage an external peripheral wall of the circuit board.
摘要翻译： 公开了各种加强环和电路板。 一方面，提供了一种装置，其包括加强环，该加强环具有第一凸缘以接合电路板的第一主侧和外围壁以接合电路板的外周壁。
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公开(公告)号：US20150049441A1
公开(公告)日：2015-02-19
申请号：US14451757
申请日：2014-08-05
申请人： Suming Hu , Neil McLellan , Andrew K.W. Leung , Jianguo Li
发明人： Suming Hu , Neil McLellan , Andrew K.W. Leung , Jianguo Li
CPC分类号： H05K1/0271 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L2924/0002 , H01L2924/14 , H01L2924/3511 , H05K3/0052 , H05K3/3442 , H05K2201/09027 , H05K2201/09154 , H05K2201/2009 , H05K2201/2018 , H05K2203/0228 , H05K2203/0746 , H05K2203/107 , Y10T29/49155 , H01L2924/00
摘要： A method of manufacturing is provided that includes singulating a circuit board from a substrate of plural of the circuit boards, wherein the circuit board is shaped to have four corner hollows. The corner hollows may be various shapes.
摘要翻译： 提供了一种制造方法，其包括从多个电路板的衬底中分离电路板，其中电路板被成形为具有四个拐角中空部。 角隅可以是各种形状。
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