公开(公告)号：US09337132B2

公开(公告)日：2016-05-10

申请号：US14052711

申请日：2013-10-12

申请人： Ming Sun ,  Kai Liu ,  Xiaotian Zhang ,  Yueh Se Ho ,  Leeshawn Luo

发明人： Ming Sun ,  Kai Liu ,  Xiaotian Zhang ,  Yueh Se Ho ,  Leeshawn Luo

IPC分类号： H01L23/495 ,  H01L29/78 ,  H01L23/00 ,  H01L29/66 ,  H01L23/492

CPC分类号： H01L23/49562 ,  H01L23/492 ,  H01L23/4928 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/97 ,  H01L29/66477 ,  H01L29/78 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/83895 ,  H01L2224/97 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/014

摘要： A power device package for containing, protecting and providing electrical contacts for a power transistor includes a top and bottom lead frames for directly no-bump attaching to the power transistor. The power transistor is attached to the bottom lead frame as a flip-chip with a source contact and a gate contact directly no-bumping attaching to the bottom lead frame. The power transistor has a bottom drain contact attaching to the top lead frame. The top lead frame further includes an extension for providing a bottom drain electrode substantially on a same side with the bottom lead frame. In a preferred embodiment, the power device package further includes a joint layer between device metal of source, gate or drain and top or bottom lead frame, through applying ultrasonic energy.

摘要翻译： 用于容纳，保护和提供用于功率晶体管的电触头的功率器件封装包括用于直接不连接到功率晶体管的顶部和底部引线框架。 功率晶体管作为具有源极接触的倒装芯片附接到底部引线框架，并且栅极接触件直接地不连接到底部引线框架上。 功率晶体管具有附接到顶部引线框架的底部漏极接触。 顶部引线框架还包括用于提供与底部引线框架基本上在同一侧上的底部漏极电极的延伸部分。 在优选实施例中，功率器件封装还包括通过施加超声波能量的源极，栅极或漏极以及顶部或底部引线框架的器件金属之间的接合层。

公开(公告)号：US20090233403A1

公开(公告)日：2009-09-17

申请号：US12474089

申请日：2009-05-28

申请人： Kai Liu ,  Xiaotian Zhang ,  Ming Sun ,  Leeshawn Luo

发明人： Kai Liu ,  Xiaotian Zhang ,  Ming Sun ,  Leeshawn Luo

IPC分类号： H01L21/60

CPC分类号： H01L24/48 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05555 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012

摘要： A DFN semiconductor package includes a leadframe having a die bonding pad formed integrally with a drain lead, a gate lead and a source lead, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead and a die gate bonding area coupled to the gate lead, and an encapsulant at least partially covering the die, drain lead, gate lead and source lead.

摘要翻译： DFN半导体封装包括引线框架，其具有与漏极引线，栅极引线和源极引线一体形成的管芯焊接焊盘，耦合到管芯焊接焊盘的管芯，耦合到源极引线的管芯源极接合区域和管芯栅极 键合区域，以及密封剂，其至少部分地覆盖晶片，漏极引线，栅极引线和源极引线。

公开(公告)号：US07511361B2

公开(公告)日：2009-03-31

申请号：US11150489

申请日：2005-06-10

申请人： Xiaotian Zhang ,  Kai Liu ,  Ming Sun

发明人： Xiaotian Zhang ,  Kai Liu ,  Ming Sun

IPC分类号： H01L23/495

CPC分类号： H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A DFN semiconductor package is disclosed. The package includes a leadframe having a die bonding pad formed integrally with a drain lead, a source lead bonding area and a gate lead bonding area, the source lead bonding area and the gate lead bonding area being of increased area, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead bonding area and a die gate bonding area coupled to the gate lead bonding area, and an encapsulant at least partially covering the die, drain lead, gate lead bonding area and source lead bonding area.

摘要翻译： 公开了一种DFN半导体封装。 封装包括引线框架，其具有与漏极引线，源极引线接合区域和栅极引线接合区域整体形成的管芯接合焊盘，源极引线接合区域和栅极引线接合区域具有增加的面积， 芯片接合焊盘，耦合到源引线接合区域的管芯源极接合区域和耦合到栅极引线接合区域的管芯栅极结合区域，以及至少部分地覆盖管芯，漏极引线，栅极引线接合区域和源极引线 粘合区域。

公开(公告)号：US20090057869A1

公开(公告)日：2009-03-05

申请号：US11849160

申请日：2007-08-31

申请人： Francois Hebert ,  Xiaotian Zhang ,  Kai Liu ,  Ming Sun ,  Anup Bhalla

发明人： Francois Hebert ,  Xiaotian Zhang ,  Kai Liu ,  Ming Sun ,  Anup Bhalla

IPC分类号： H01L23/52

CPC分类号： H01L24/41 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/91 ,  H01L25/072 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/49111 ,  H01L2224/49112 ,  H01L2224/49171 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01055 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/37099 ,  H01L2924/206

摘要： A circuit package assembly is disclosed. The assembly includes a conductive substrate; a high-side n-channel metal oxide semiconductor field effect transistor (NMOSFET) having a source on a side facing a surface of the conductive substrate and in electrical contact therewith and a low-side standard n-channel metal oxide semiconductor field effect transistor (NMOSFET) having a drain on a side facing the conductive substrate and in electrical contact therewith. Co-packaging of high-side and low-side NMOSFETs in this manner may reduce package size and parasitic inductance and capacitance compared to conventional packaging.

摘要翻译： 公开了电路封装组件。 组件包括导电基板; 具有在与导电基板的表面相对并与其电接触的一侧具有源极的高边n沟道金属氧化物半导体场效应晶体管（NMOSFET）和低侧标准n沟道金属氧化物半导体场效应晶体管（ NMOSFET），其在面向导电基板的一侧具有漏极并与其电接触。 与传统封装相比，以这种方式共同封装高边和低边NMOSFET可以减小封装尺寸和寄生电感和电容。

公开(公告)号：US20060145312A1

公开(公告)日：2006-07-06

申请号：US11029653

申请日：2005-01-05

申请人： Kai Liu ,  Xiaotian Zhang ,  Ming Sun ,  Leeshawn Luo

发明人： Kai Liu ,  Xiaotian Zhang ,  Ming Sun ,  Leeshawn Luo

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/85 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A DFN semiconductor package includes a leadframe having a die bonding pad formed integrally with a drain lead, a gate lead and a source lead, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead and a die gate bonding area coupled to the gate lead, and an encapsulant at least partially covering the die, drain lead, gate lead and source lead.

摘要翻译： DFN半导体封装包括引线框架，其具有与漏极引线，栅极引线和源极引线一体形成的管芯焊接焊盘，耦合到管芯焊接焊盘的管芯，耦合到源极引线的管芯源极接合区域和管芯栅极 键合区域，以及密封剂，其至少部分地覆盖晶片，漏极引线，栅极引线和源极引线。

公开(公告)号：US07781265B2

公开(公告)日：2010-08-24

申请号：US12384100

申请日：2009-03-30

申请人： Xiaotian Zhang ,  Kai Liu ,  Ming Sun

发明人： Xiaotian Zhang ,  Kai Liu ,  Ming Sun

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A dual flat non-leaded semiconductor package is disclosed. A method of making a dual flat non-leaded semiconductor package includes forming a leadframe having a die bonding area with an integral drain lead, a gate lead bonding area and a source lead bonding area, the gate lead bonding area and a source lead bonding area being of increased area; bonding a die to the die bonding area; coupling a die source bonding area to the source lead bonding area; coupling a die gate bonding area to the gate lead bonding area; and partially encapsulating the die, the drain lead, the gate lead and the source lead to form the dual flat non-leaded semiconductor package.

摘要翻译： 公开了一种双平面无铅半导体封装。 制造双平面非铅半导体封装的方法包括：形成具有集成漏极引线，栅极引线接合区域和源极引线接合区域的管芯接合区域的引线框架，栅极引线接合区域和源极引线接合区域 面积增加; 将管芯结合到管芯接合区域; 将管芯源极接合区域耦合到所述源极引线接合区域; 将栅极接合区域耦合到栅极引线接合区域; 并且部分地封装裸片，漏极引线，栅极引线和源极引线，以形成双平面非引线半导体封装。

公开(公告)号：US07951651B2

公开(公告)日：2011-05-31

申请号：US12474089

申请日：2009-05-28

申请人： Kai Liu ,  Xiaotian Zhang ,  Ming Sun ,  Leeshawn Luo

发明人： Kai Liu ,  Xiaotian Zhang ,  Ming Sun ,  Leeshawn Luo

IPC分类号： H01L21/00

CPC分类号： H01L24/48 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/45 ,  H01L24/49 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05555 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48799 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2924/00012

摘要： A DFN semiconductor package includes a leadframe having a die bonding pad formed integrally with a drain lead, a gate lead and a source lead, a die coupled to the die bonding pad, a die source bonding area coupled to the source lead and a die gate bonding area coupled to the gate lead, and an encapsulant at least partially covering the die, drain lead, gate lead and source lead.

摘要翻译： DFN半导体封装包括引线框架，其具有与漏极引线，栅极引线和源极引线一体形成的管芯焊接焊盘，耦合到管芯焊接焊盘的管芯，耦合到源极引线的管芯源极接合区域和管芯栅极 键合区域，以及密封剂，其至少部分地覆盖晶片，漏极引线，栅极引线和源极引线。

公开(公告)号：US07612439B2

公开(公告)日：2009-11-03

申请号：US11316614

申请日：2005-12-22

申请人： Xiaotian Zhang ,  Argo Chang ,  James Lee ,  Ryan Huang ,  Kai Liu ,  Ming Sun

发明人： Xiaotian Zhang ,  Argo Chang ,  James Lee ,  Ryan Huang ,  Kai Liu ,  Ming Sun

IPC分类号： H01L23/495 ,  H01L23/48

CPC分类号： H01L23/49575 ,  H01L23/49562 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A composite semiconductor package is disclosed. The package includes a lead frame having first and second die bonding pads, the first and second die bonding pads having a large lateral separation therebetween, a first device bonded to the first die bonding pad, a second device bonded to the second die bonding pad, a plurality of first leads coupled to the first die bonding pad, a plurality of second leads coupled to the second die bonding pad, and an encapsulant covering the lead frame, the first and second devices and at least a portion of the first and second pluralities of leads. The package may be a TSSOP-8 composite package having a common drain MOSFET pair and an IC.

摘要翻译： 公开了一种复合半导体封装。 封装包括具有第一和第二裸片接合焊盘的引线框架，第一和第二管芯接合焊盘之间具有大的横向间隔，接合到第一管芯接合焊盘的第一器件，与第二管芯接合焊盘接合的第二器件， 耦合到第一裸片焊接焊盘的多个第一引线，耦合到第二管芯焊盘的多个第二引线以及覆盖引线框架的密封剂，第一和第二器件以及第一和第二多个元件的至少一部分 的领导。 该封装可以是具有公共漏极MOSFET对和IC的TSSOP-8复合封装。

公开(公告)号：US20090258458A1

公开(公告)日：2009-10-15

申请号：US12384100

申请日：2009-03-30

申请人： Xiaotian Zhang ,  Kai Liu ,  Ming Sun

发明人： Xiaotian Zhang ,  Kai Liu ,  Ming Sun

IPC分类号： H01L21/98 ,  H01L21/56

CPC分类号： H01L23/49562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A dual flat non-leaded semiconductor package is disclosed. A method of making a dual flat non-leaded semiconductor package includes forming a leadframe having a die bonding area with an integral drain lead, a gate lead bonding area and a source lead bonding area, the gate lead bonding area and a source lead bonding area being of increased area; bonding a die to the die bonding area; coupling a die source bonding area to the source lead bonding area; coupling a die gate bonding area to the gate lead bonding area; and partially encapsulating the die, the drain lead, the gate lead and the source lead to form the dual flat non-leaded semiconductor package.

摘要翻译： 公开了一种双平面无铅半导体封装。 制造双平面非铅半导体封装的方法包括：形成具有集成漏极引线，栅极引线接合区域和源极引线接合区域的管芯接合区域的引线框架，栅极引线接合区域和源极引线接合区域 面积增加; 将管芯结合到管芯接合区域; 将管芯源极接合区域耦合到所述源极引线接合区域; 将栅极接合区域耦合到栅极引线接合区域; 并且部分地封装裸片，漏极引线，栅极引线和源极引线，以形成双平面非引线半导体封装。

公开(公告)号：US20110068457A1

公开(公告)日：2011-03-24

申请号：US12586339

申请日：2009-09-21

申请人： Xiaotian Zhang ,  Jun Lu ,  Kai Liu

发明人： Xiaotian Zhang ,  Jun Lu ,  Kai Liu

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： H01L24/41 ,  H01L23/3107 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49562 ,  H01L24/05 ,  H01L24/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/371 ,  H01L2224/40245 ,  H01L2224/40247 ,  H01L2224/4103 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48599 ,  H01L2224/48639 ,  H01L2224/48699 ,  H01L2224/48739 ,  H01L2224/48799 ,  H01L2224/48839 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L2224/85439 ,  H01L2224/8585 ,  H01L2224/92 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45147 ,  H01L2924/01049 ,  H01L2924/206

摘要： This invention discloses a semiconductor package with adhesive material pre-printed on the lead frame and chip, and the manufacturing method. The adhesive material is applied onto the chip carrier and the pin of the lead frame and also on the front electrode of the semiconductor chip via pre-printing. The back of the semiconductor chip is adhered on the chip carrier, and the front electrode of the semiconductor chip and the pin are connected respectively with a metal connector. The size, shape and thickness of the adhesive material are applied according to different application requirements according to size and shapes of the contact zone of the semiconductor chip and the metal connector. Particularly, the adhesive zones are formed by pre-printing the adhesive material thus significantly enhance the quality and performance of semiconductor products, and improves the productivity.