公开(公告)号：US06518652B2

公开(公告)日：2003-02-11

申请号：US09808151

申请日：2001-03-15

申请人： Yasuki Takata ,  Hiroshi Horibe ,  Kazunari Michii

发明人： Yasuki Takata ,  Hiroshi Horibe ,  Kazunari Michii

IPC分类号： H01L23495

CPC分类号： H01L23/4951 ,  H01L23/49503 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85447 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package includes a semiconductor chip, a die pad, an adhesive, metal wires, LOC inner leads, and standard inner leads sealed within a sealing resin. The LOC inner leads and the standard inner leads are arranged in the same plane and both are arranged along one side of the semiconductor chip. Clearance between the inner leads and the die pad larger than the total thickness of the semiconductor chip and the bonding material. Thus, a semiconductor chip having electrode pads broadly distributed can be employed and the section modulus of the semiconductor package can be increased.

摘要翻译： 半导体封装包括半导体芯片，芯片焊盘，粘合剂，金属线，LOC内引线和密封在密封树脂内的标准内引线。 LOC内引线和标准内引线布置在同一平面中，并且都沿着半导体芯片的一侧布置。 内引线和芯片焊盘之间的间隙大于半导体芯片和接合材料的总厚度。 因此，可以采用具有广泛分布的电极焊盘的半导体芯片，并且可以增加半导体封装的截面模数。

公开(公告)号：US09230937B2

公开(公告)日：2016-01-05

申请号：US13468139

申请日：2012-05-10

申请人： Kaori Sumitomo ,  Hideyuki Arakawa ,  Hiroshi Horibe ,  Yasuki Takata

发明人： Kaori Sumitomo ,  Hideyuki Arakawa ,  Hiroshi Horibe ,  Yasuki Takata

IPC分类号： H01L21/44 ,  H01L23/00

CPC分类号： H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0508 ,  H01L2224/05186 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78304 ,  H01L2224/78343 ,  H01L2224/81193 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/20755 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/207

摘要： There is provided a technology capable of suppressing the damage applied to a pad. When the divergence angle of an inner chamfer part is smaller than 90 degrees, the ultrasonic conversion load in a direction perpendicular to the surface of the pad is very small in magnitude. In other words, the ultrasonic conversion load in a direction perpendicular to the surface of the pad is sufficiently smaller in magnitude than the ultrasonic conversion load in a direction in parallel with the surface of the pad. Consequently, when the divergence angle of the inner chamfer part is smaller than 90 degrees, the ultrasonic conversion load in a direction perpendicular to the surface of the pad can be sufficiently reduced in magnitude, which can prevent pad peeling.

摘要翻译： 提供了能够抑制施加到垫的损伤的技术。 当内倒角部分的发散角小于90度时，垂直于焊盘表面的方向的超声波转换载荷的大小非常小。 换句话说，垂直于焊盘表面的方向上的超声波转换负载在与焊盘表面平行的方向上的超声波转换载荷的幅度上足够小。 因此，当内倒角部分的发散角小于90度时，可以在与焊盘表面垂直的方向上的超声波转换载荷大大降低，从而可以防止焊盘剥离。

公开(公告)号：US20120286427A1

公开(公告)日：2012-11-15

申请号：US13468139

申请日：2012-05-10

申请人： Kaori Sumitomo ,  Hideyuki Arakawa ,  Hiroshi Horibe ,  Yasuki Takata

发明人： Kaori Sumitomo ,  Hideyuki Arakawa ,  Hiroshi Horibe ,  Yasuki Takata

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0508 ,  H01L2224/05186 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/1134 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48451 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/78304 ,  H01L2224/78343 ,  H01L2224/81193 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/05442 ,  H01L2924/20755 ,  H01L2924/00015 ,  H01L2924/2075 ,  H01L2924/20754 ,  H01L2924/207

摘要： There is provided a technology capable of suppressing the damage applied to a pad. When the divergence angle of an inner chamfer part is smaller than 90 degrees, the ultrasonic conversion load in a direction perpendicular to the surface of the pad is very small in magnitude. In other words, the ultrasonic conversion load in a direction perpendicular to the surface of the pad is sufficiently smaller in magnitude than the ultrasonic conversion load in a direction in parallel with the surface of the pad. Consequently, when the divergence angle of the inner chamfer part is smaller than 90 degrees, the ultrasonic conversion load in a direction perpendicular to the surface of the pad can be sufficiently reduced in magnitude, which can prevent pad peeling.

摘要翻译： 提供了能够抑制施加到垫的损伤的技术。 当内倒角部分的发散角小于90度时，垂直于焊盘表面的方向的超声波转换载荷的大小非常小。 换句话说，垂直于焊盘表面的方向上的超声波转换负载在与焊盘表面平行的方向上的超声波转换载荷的幅度上足够小。 因此，当内倒角部分的发散角小于90度时，可以在与焊盘表面垂直的方向上的超声波转换载荷大大降低，从而可以防止焊盘剥离。

公开(公告)号：US08415245B2

公开(公告)日：2013-04-09

申请号：US12878228

申请日：2010-09-09

申请人： Yasuki Takata ,  Kaori Sumitomo ,  Hiroshi Horibe ,  Hideyuki Arakawa

发明人： Yasuki Takata ,  Kaori Sumitomo ,  Hiroshi Horibe ,  Hideyuki Arakawa

IPC分类号： H01L21/44

CPC分类号： H01L23/4952 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48455 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/48664 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/78268 ,  H01L2224/78302 ,  H01L2224/85045 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85464 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/20753 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/92247

摘要： Height control of a capillary is performed in a stitch bonding (2nd bond) in a wire bonding, so that a thickness of a stitch portion can be controlled, thereby ensuring a bonding strength at the stitch portion and achieving an improvement in a bonding reliability. Also, the stitch portion has a thick portion, and a wire and a part (α portion) of a bonding region of an inner lead is formed to a lower portion of the thick portion, thereby sufficiently ensuring a thickness of the stitch portion and a bonding region.

摘要翻译： 毛线管的高度控制在线接合中的线圈接合（第二接合）中进行，从而可以控制线圈部分的厚度，从而确保线圈部分的接合强度并且提高接合可靠性。 此外，线圈部分具有厚的部分，并且线材和内部引线的接合区域的一部分（α部分）形成在厚部分的下部，从而充分地确保了线圈部分的厚度和 接合区域。

公开(公告)号：US07763966B2

公开(公告)日：2010-07-27

申请号：US12073384

申请日：2008-03-05

申请人： Kazuyuki Misumi ,  Kazushi Hatauchi ,  Yasuki Takata ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Katsuyuki Fukudome

发明人： Kazuyuki Misumi ,  Kazushi Hatauchi ,  Yasuki Takata ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Katsuyuki Fukudome

IPC分类号： H01L23/495 ,  H01L23/12 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49541 ,  H01L23/49558 ,  H01L23/60 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6638 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00

摘要： A plurality of inner leads 14 are provided around a die pad 13. A grounded GND lead 16 is provided in a region between the die pad 13 and the plurality of inner leads 14. A semiconductor chip 17 and the plurality of inner leads 14 are connected to each other by a plurality of wires 21. The semiconductor chip 17 and the GND lead 16 are connected to each other by GND wires 22. The GND wires 22 are disposed between a plurality of wires 21. The distance between ends of each adjacent pair of the inner leads 14 is 0.2 mm or less.

摘要翻译： 多个内引线14设置在管芯焊盘13周围。接地GND引线16设置在管芯焊盘13和多个内引线14之间的区域中。半导体芯片17和多个内引线14被连接 通过多个导线21彼此连接。半导体芯片17和GND引线16通过GND线22彼此连接。GND线22设置在多条导线21之间。每个相邻对的端部之间的距离 的内引线14为0.2mm以下。

公开(公告)号：US20080217750A1

公开(公告)日：2008-09-11

申请号：US12073384

申请日：2008-03-05

申请人： Kazuyuki Misumi ,  Kazushi Hatauchi ,  Yasuki Takata ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Katsuyuki Fukudome

发明人： Kazuyuki Misumi ,  Kazushi Hatauchi ,  Yasuki Takata ,  Naoya Yasuda ,  Hideyuki Arakawa ,  Katsuyuki Fukudome

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/49558 ,  H01L23/60 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6638 ,  H01L2224/05553 ,  H01L2224/05599 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/49171 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00

摘要： A plurality of inner leads 14 are provided around a die pad 13. A grounded GND lead 16 is provided in a region between the die pad 13 and the plurality of inner leads 14. A semiconductor chip 17 and the plurality of inner leads 14 are connected to each other by a plurality of wires 21. The semiconductor chip 17 and the GND lead 16 are connected to each other by GND wires 22. The GND wires 22 are disposed between a plurality of wires 21. The distance between ends of each adjacent pair of the inner leads 14 is 0.2 mm or less.

摘要翻译： 多个内引线14设置在管芯焊盘13周围。 接地GND引线16设置在管芯焊盘13和多个内引线14之间的区域中。 半导体芯片17和多个内部引线14通过多个导线21彼此连接。 半导体芯片17和GND引线16通过GND线22彼此连接。 GND布线22设置在多个布线21之间。 每个相邻的一对内引线14的端部之间的距离为0.2mm以下。

公开(公告)号：US20050212103A1

公开(公告)日：2005-09-29

申请号：US11079333

申请日：2005-03-15

申请人： Yasuki Takata

发明人： Yasuki Takata

IPC分类号： H01L21/60 ,  H01L21/48 ,  H01L21/607 ,  H01L23/52

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2224/45099

摘要： A semiconductor device includes a semiconductor chip, an inner lead and a wire interconnecting a pad of the semiconductor chip with the inner lead. The wire is formed such that the eigenfrequency of the loop is outside a predetermined range of an ultrasonic vibration frequency used to form the loop. Accordingly, a rupture or break of a wire due to the resonance of a loop can be prevented.

摘要翻译： 半导体器件包括半导体芯片，内引线和将​​半导体芯片的焊盘与内引线互连的导线。 导线形成为使得环路的本征频率在用于形成环路的超声波振动频率的预定范围之外。 因此，可以防止由于环路的共振引起的导线的破裂或破裂。