摘要:
A coaxial conductor interconnection wiring board characterized by having at least one inner wall metallized conductive hole for connecting a conductive shield of coaxial conductor to a ground layer, or having connection metal layers for connecting ground layers or connecting the conductive shield to a ground layer, and an inner wall metallized conductive hole for connecting a central signal conductor of coaxial conductor to other circuits, is excellent in preventing crosstalk noise and shielding effect.
摘要:
A coaxial conductor interconnection wiring board includes at least one coaxial conductor and at least one conductive hole having an inner wall covered with a metal film connected to a central signal conductor of the coaxial conductor. The conductive shield of the coaxial conductor is connected to the ground layer by connection metal layers. A conductor insulating layer surrounds the metallized conductor hole and the connection metal layers surround a part of the additional conductor insulating layer. Thus, the conductive hole, insulating layer, and connection metal layers function as a coaxial conductor.
摘要:
An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy-modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple-wire wiring boards having good heat resistance, solvent resistance and wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.
摘要:
An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.
摘要:
An adhesive comprising (a) solid epoxy resin having a molecular weight of 5000 or more, (b) a polyfunctional epoxy resin having at least three epoxy groups, (c) an intramolecular epoxy modified polybutadiene having at least three epoxy groups, (d) a cationic photoinitiator, and (e) a tin compound in special weight ratios, is effective for producing multiple wire wiring boards having good heat resistance, solvent resistance wherein the adhesive layer has no voids and prevents shift of insulated encapsulated wires.
摘要:
An adhesive composition for producing printed wiring boards comprising (A) acrylonitrile-butadiene rubber having carboxyl groups in the molecule and containing 20 ppm or less of metal ionic impurities, (B) an alkyl phenol resin, (C) an epoxy resin, (D) a catalyst for electroless plating, and (E) a coupling agent having an ethylene or vinyl group, is useful in a so-called additive process.
摘要:
A method of improving adhesion between the surface of a substrate and a metal deposit electrolessly plated thereon by forming a novel adhesive material layer comprising (A) a rubber material and (B) a thermosetting resin which is present in a proportion defined by the formula 20.ltoreq.(B)/(A)+(B).ltoreq.85 volume %. In the adhesive layer the thermosetting resin is dispersed, in the form of substantially spherical particles of 0.5 to 15.mu., in the continuous phase of the rubber material. The method is useful for producing printed circuit boards having a high precision and high accuracy pattern circuit. Further, the method is extremely advantageous when it is applied to the so-called photo-forming process since disappearance of the catalyst nuclei on the circuit pattern image can be eliminated.
摘要:
An optical imaging apparatus includes an optical probe and an apparatus main body which controls and drives the optical probe via a connecting cable. The optical probe includes a low-coherence light source, a half mirror, an XY reflecting mirror scan, an objective optical system, a reflecting mirror, a modulating mirror, and a photo detector. In the optical probe, the modulating mirror and the objective optical system, as optical path length interlockingly adjusting elements, are integrally arranged to an optical path length interlockingly adjusting base, together with a reflecting-side lens. The optical probe has an advancing and regressing driving unit which advances and regresses the optical path length interlockingly adjusting base in the optical axis direction (Z direction).
摘要:
An electroless copper plating solution comprising cupric ions, a complexing agent, a reducing agent, a pH adjuster, a perfluoropolyether, a cyanide and/or .alpha.,.alpha.'-dipyridyl and/or 1,10-phenanthroline or a derivative thereof is capable of forming a deposited film with high elongation.
摘要:
A dispersion element includes a prism having a first transmission surface and an oppositely disposed second transmission surface, and an optical element having a third transmission surface and an oppositely disposed diffraction optical surface on which a diffraction grating is arranged. The prism and the optical element are integrated into one body by cementing the first transmission surface to the third transmission surface. The third transmission surface and the diffraction optical surface are non-parallel to each other in a plane perpendicular to grooves of the diffraction grating.