摘要:
A semiconductor device includes: a SOI substrate; a semiconductor element having first and second impurity layers disposed in an active layer of the SOI substrate, the second impurity layer surrounding the first impurity layer; and multiple first and second conductive type regions disposed in a part of the active layer adjacent to an embedded insulation film of the SOI substrate. The first and second conductive type regions are alternately arranged. The first and second conductive type regions have a layout, which corresponds to the semiconductor element.
摘要:
A semiconductor device includes: a semiconductor substrate with a principal plane; a base region disposed on the principal plane; a source region disposed on the principal plane in the base region to be shallower than the base region; a drain region disposed on the principal plane, and spaced to the base region; a trench disposed on the principal plane; a trench gate electrode disposed in the trench through a trench gate insulation film; a planer gate electrode disposed on the principal plane of the semiconductor substrate through a planer gate insulation film; and an impurity diffusion region having high concentration of impurities and disposed in a portion of the base region to be a channel region facing the planer gate electrode.
摘要:
A wire (12) is formed on an insulating film (10) on a semiconductor substrate (1). The wire (12) is covered by silicon nitride film (14), inorganic SOG film (20) and TEOS film (21). A thin film resistance element (30) of chromium silicon (CrSi) is formed on the upper surface of the TEOS film (21). The acute angle (taper angle) at which a line connecting the local maximum and minimum points of a step on the upper surface of the TEOS film (21) beneath the area where the thin film resistance element (30) is formed intersects to the surface of the substrate (1) is set to 10° or less.
摘要:
A semiconductor device including a reduced surface field strength type LDMOS transistor which can prevent the breakdown of elements at channel formation portions when a reverse voltage is applied to its drain. A P well and an N well are formed in an N-type substrate to produce a double-well structure, with a source electrode being set to be equal in electric potential to the N-type substrate. The drift region of the N well has a dopant concentration to satisfy the so-called RESURF condition, which can provide a high breakdown voltage a low ON resistance. When a reverse voltage is applied to a drain electrode, a parasitic bipolar transistor comprising the N well, the P well and the N-type substrate develops to form a current-carrying path toward a substrate, so that the element breakdown at the channel formation portions is avoidable at the application of the reverse voltage.
摘要:
The present invention relates to a polypropylene three-dimensional plexifilamentary fiber, a method of manufacturing same, and a nonwoven fabric composed of the above fiber.The plexifilamentary fiber in accordance with the present invention has a three-dimensional plexifilamentary structure, and is characterized in that the fiber has a microwave birefringence of 0.07 or more. As a result, a dimensional stability under heating of the plexifilamentary fiber in accordance with the present invention is extremely high. Moreover, it is possible to obtain a plexifilamentary fiber having a high spreadability by adding a spreading agent to the plexifilamentary fiber. A nonwoven fabric made of such plexifilamentary fiber has a high thermal dimensional stability, and as a result, the nonwoven fabric in accordance with the present can be usefully used in a wrapping material having a heat resistance and air permeability, apparel having heat resistance and moisture permeability, a heat resistance paper, and engineering and building materials or the like.
摘要:
A polypropylene three-dimensional plexifilamentary fiber having a microwave birefringence of 0.07 or more and an Mw/Mn of 4.3 or less. Although a spreading agent is not included in this fiber, the fiber has a superior fiber spreadability and dimensional stability. The fiber in accordance with the present invention can be spun from a dope composed of an isotactic polypropylene having an Mw/Mn of 4.3 or less and an MFR of 20 or less, and a halogenated hydrocarbon, by a flash spinning technique. Further, the present invention provides a spinning dope and a method of manufacturing the fiber which effectively prevent ozone layer destruction by using a 2,2-dichloro-1,1,1-trifluoroethane, a 1,2-dichlorotrifluoroethane or a solvent blended a dichloromethane with either of the above two solvents as the halogenated hydrocarbon.
摘要:
This invention concerns a hybrid printed circuit board which permits easy and reliable connection between small-current circuit conductors and large-current circuit conductors. The hybrid printed circuit board of this invention comprises: an insulating substrate of synthetic resin having fixing bosses erected thereon; a flexible printed circuit sheet having small-current circuit conductors; and busbars as large-current circuit conductors; wherein the flexible printed circuit sheet is stacked and arranged on the insulating substrate so that the fixing bosses erected on the insulating substrate pass through and above the flexible printed circuit sheet, the busbars as large-current circuit conductors are put in contact with the small-current circuit conductors, and the fixing bosses are heated and deformed to fix the busbars in place.
摘要:
An automatic white balance adjusting system for a color video camera employs a high luminance part of the luminance signal to control automatic gain controllers for the red and blue components of the signals.
摘要:
A semiconductor device comprising: an element portion having a heat generation portion; a control circuit portion having a control circuit for controlling the element portion; and a metal member. The element portion and the control circuit portion are adjacently disposed oh a surface portion of a semiconductor substrate. The metal member as an external electrode for the element portion is disposed directly on the element portion through an interlayer insulation film. The metal member is also disposed directly on the control circuit portion through the interlayer insulation film.