Substrate processing system, control method for substrate processing apparatus and program stored on medium
    1.
    发明授权
    Substrate processing system, control method for substrate processing apparatus and program stored on medium 有权
    基板处理系统,基板处理装置的控制方法和存储在介质上的程序

    公开(公告)号:US07953512B2

    公开(公告)日:2011-05-31

    申请号:US12230788

    申请日:2008-09-04

    IPC分类号: G06F19/00 B05C11/00

    CPC分类号: H01L21/67276

    摘要: The present invention provides a substrate processing system, a control method for a substrate processing apparatus, and a program for the system and/or method, each of which is intended to achieve effective control for a film-forming amount on processed substrates. The substrate processing system includes a substrate processing unit adapted for forming a film on each of the plurality of substrates; a pattern obtaining unit adapted for obtaining information about an arrangement pattern concerning arrangement of unprocessed substrates and processed substrates among the plurality of substrates; and a memory unit adapted for storing therein an arrangement/film-forming-amount model indicative of influence exerted on the film-forming amount on the substrates by the arrangement of the unprocessed substrates and processed substrates among the plurality of substrates. A calculation unit calculates an estimated film-forming amount on the substrates, in the case of the arrangement pattern, based on the arrangement/film-forming-amount model. Then, a determination unit determines whether or not the estimated film-forming amount calculated by the calculation unit is within a predetermined range. If the estimated film-forming amount calculated by the calculation unit is determined to be within the predetermined range, a control unit will control and drive the substrate processing unit to process the substrates.

    摘要翻译: 本发明提供了一种基板处理系统,用于基板处理装置的控制方法和用于该系统和/或方法的程序,其中每一个旨在实现对经处理的基板上的成膜量的有效控制。 基板处理系统包括适于在多个基板中的每一个上形成薄膜的基板处理单元; 图案获取单元,用于获得关于所述多个基板中未处理的基板和处理的基板的布置的布置图案的信息; 以及存储单元,其适于在其中存储表示通过未处理的基板和处理的基板在多个基板之间的布置来指示对基板上的成膜量的影响的布置/成膜量模型。 计算单元根据布置/成膜量模型,在布置图案的情况下,计算基板上的估计成膜量。 然后,确定单元确定由计算单元计算的估计成膜量是否在预定范围内。 如果将由计算单元计算的估计成膜量确定为在预定范围内,则控制单元将控制和驱动基板处理单元来处理基板。

    Substrate processing system, control method for substrate processing apparatus and program
    2.
    发明申请
    Substrate processing system, control method for substrate processing apparatus and program 有权
    基板处理系统,基板处理装置和程序的控制方法

    公开(公告)号:US20090078197A1

    公开(公告)日:2009-03-26

    申请号:US12230788

    申请日:2008-09-04

    IPC分类号: B05C11/00 G06F19/00

    CPC分类号: H01L21/67276

    摘要: The present invention provides a substrate processing system, a control method for a substrate processing apparatus, and a program for the system and/or method, each of which is intended to achieve effective control for a film-forming amount on processed substrates. The substrate processing system includes a substrate processing unit adapted for forming a film on each of the plurality of substrates; a pattern obtaining unit adapted for obtaining information about an arrangement pattern concerning arrangement of unprocessed substrates and processed substrates among the plurality of substrates; and a memory unit adapted for storing therein an arrangement/film-forming-amount model indicative of influence exerted on the film-forming amount on the substrates by the arrangement of the unprocessed substrates and processed substrates among the plurality of substrates. A calculation unit calculates an estimated film-forming amount on the substrates, in the case of the arrangement pattern, based on the arrangement/film-forming-amount model. Then, a determination unit determines whether or not the estimated film-forming amount calculated by the calculation unit is within a predetermined range. If the estimated film-forming amount calculated by the calculation unit is determined to be within the predetermined range, a control unit will control and drive the substrate processing unit to process the substrates.

    摘要翻译: 本发明提供了一种基板处理系统,用于基板处理装置的控制方法和用于该系统和/或方法的程序,其中每一个旨在实现对经处理的基板上的成膜量的有效控制。 基板处理系统包括适于在多个基板中的每一个上形成薄膜的基板处理单元; 图案获取单元,用于获得关于所述多个基板中未处理的基板和处理的基板的布置的布置图案的信息; 以及存储单元,其适于在其中存储表示通过未处理的基板和处理的基板在多个基板之间的布置来指示对基板上的成膜量的影响的布置/成膜量模型。 计算单元根据布置/成膜量模型,在布置图案的情况下,计算基板上的估计成膜量。 然后,确定单元确定由计算单元计算的估计成膜量是否在预定范围内。 如果将由计算单元计算的估计成膜量确定为在预定范围内,则控制单元将控制和驱动基板处理单元来处理基板。

    Photovoltaic device and manufacturing method thereof
    4.
    发明授权
    Photovoltaic device and manufacturing method thereof 有权
    光伏器件及其制造方法

    公开(公告)号:US08012787B2

    公开(公告)日:2011-09-06

    申请号:US12989098

    申请日:2008-04-30

    IPC分类号: H01L21/00

    摘要: The manufacturing method includes: forming a P-type silicon substrate and a high-concentration N-type diffusion layer, in which an N-type impurity is diffused in a first concentration, on an entire surface at a light-incident surface side; forming an etching resistance film on the high-concentration N-type diffusion layer and forming fine pores at a predetermined position within a recess forming regions on the etching resistance film; forming recesses by etching the silicon substrate around a forming position of the fine pores, so as not to leave the high-concentration N-type diffusion layer within the recess forming region; forming the low-concentration N-type diffusion layer, in which an N-type impurity is diffused in a second concentration that is lower than the first concentration, on a surface on which the recesses are formed; and forming a grid electrode in an electrode forming region at a light-incident surface side of the silicon substrate.

    摘要翻译: 该制造方法包括:在光入射表面侧的整个表面上形成P型硅衬底和其中N型杂质以第一浓度扩散的高浓度N型扩散层; 在高浓度N型扩散层上形成耐腐蚀性膜,在蚀刻电阻膜的凹部形成区域内的规定位置形成细孔; 通过在所述细孔的形成位置周围蚀刻所述硅基板而形成凹部,以便不将所述高浓度N型扩散层留在所述凹部形成区域内; 在其上形成凹部的表面上形成其中N型杂质以低于第一浓度的第二浓度扩散的低浓度N型扩散层; 以及在所述硅衬底的光入射表面侧的电极形成区域中形成栅电极。

    Conveyor device and film formation apparatus for a flexible substrate
    6.
    发明授权
    Conveyor device and film formation apparatus for a flexible substrate 有权
    用于柔性基底的输送装置和成膜装置

    公开(公告)号:US06827787B2

    公开(公告)日:2004-12-07

    申请号:US09777280

    申请日:2001-02-05

    IPC分类号: C23C1600

    CPC分类号: C23C16/545

    摘要: With a conventional cylindrical can method, a region used as a film formation ground electrode is a portion of the cylindrical can, and an apparatus becomes larger in size in proportion to the surface area of the electrode. A conveyor device and a film formation apparatus having the conveyor device are provided, which have a unit for continuously conveying a flexible substrate from one end to the other end, and which are characterized in that a plurality of cylindrical rollers are provided between the one end and the other end along an arc with a radius R, the cylindrical rollers being arranged such that their center axes run parallel to each other, and that a mechanism for conveying the flexible substrate while the substrate is in contact with each of the plurality of cylindrical rollers is provided.

    摘要翻译: 采用常规的圆筒罐法,用作成膜接地电极的区域是圆筒形罐的一部分,并且设备的尺寸与电极的表面积成比例变大。 本发明提供一种具有输送装置的输送装置和成膜装置,其具有从一端向另一端连续输送柔性基板的单元,其特征在于,在一端 并且另一端沿着具有半径R的圆弧,所述圆柱滚子被布置成使得它们的中心轴彼此平行地延伸;以及用于在所述基板与所述多个圆柱体中的每一个接触的同时传送所述柔性基板的机构 提供滚筒。

    Method of manufacturing a semiconductor device

    公开(公告)号:US06825492B2

    公开(公告)日:2004-11-30

    申请号:US10775128

    申请日:2004-02-11

    IPC分类号: H01H2904

    摘要: The number of masks is reduced in a method of manufacturing a semiconductor device that has a transistor and a photoelectric conversion element on an insulating surface. In a manufacturing method of the present invention, semiconductor layers functioning as a source region, a drain region, and a channel formation region of a transistor are formed at the same time an n type semiconductor layer and p type semiconductor layer of a photoelectric conversion element are formed. Connection wiring lines to be electrically connected to the n type semiconductor layer and p type semiconductor layer of the photoelectric conversion element are formed at the same time a source wiring line and a drain wiring line of a transistor are formed. In a doping step using an impurity element that gives one conductivity type, a semiconductor layer of an n-channel transistor and the n type semiconductor layer of the photoelectric conversion element are simultaneously doped with the impurity element and a semiconductor layer of a p-channel transistor and the p type semiconductor layer of the photoelectric conversion element are simultaneously doped with the impurity element.