摘要:
The disclosure relates to a photoconductive ignition system including a photoconductor configured to contact an oxidant-fuel gas mixture, and a light source providing irradiating light to a surface of the photoconductor. The photoconductor absorbs at least some of the light from the light source, which causes a variation in electrical potential at the surface of the photoconductor, thereby igniting the oxidant-fuel gas mixture. The disclosure further relates to a method of activating an oxidant-fuel gas mixture by exposing a photoconductor surface to the gas mixture and irradiating the surface with a light source emitting light at a wavelength corresponding to an energy level greater than a band gap energy level of the photoconductor, thereby activating the gas mixture in a combustion reaction.
摘要:
A semiconductor device includes a semiconductor substrate as a drain region. A metal source region is located on a first surface of the substrate. The metal and the substrate constitute a Schottky junction. An insulated gate, including a gate electrode and an insulating film surrounding the gate electrode, is adjacent to the Schottky junction, such that angle formed by the Schottky junction and the insulated gate in the substrate is an acute angle. A part of the Schottky metal can be buried in the form of a pillar in the substrate, and a channel region of the Schottky junction can be formed on the pillar near the insulated gate.
摘要:
A lateral double-diffused MOSFET has a semiconductor substrate, a drain region formed on the substrate, a gate insulation film formed on the drain region, a gate electrode formed on the gate insulation film, source and drain openings formed through the gate electrode, a first conductive region formed under the drain region, a source electrode formed on the source openings, a drain electrode formed on the drain openings, and second conductive regions for connecting the drain electrode to the first conductive region. The source and drain openings are cyclically arranged so that at least two rows of source openings are arranged between adjacent drain openings, to reduce the ON resistance of the MOSFET.
摘要:
A method of manufacturing semiconductor devices by forming a U-shaped insulated gate on a substrate, etching the substrate to expose a sidewall of the U-shaped insulated gate, covering the exposed part with a masking material, forming the sidewall of the masking material only adjoining to the exposed U-shaped insulated gate, etching the substrate vertically to form a groove, forming a semiconductor region on the groove and burying a metal into the groove.
摘要:
A vertical MOSFET device has a first conductivity type substrate layer serving as a drain, a second conductivity type channel region extending into said substrate layer from a top surface, and a first conductivity type source region extending into the channel region from the top surface. The channel region has a peripheral subregion extending deeply into the substrate layer from the top surface under an insulated gate electrode, and a shallow central subregion shallower than the peripheral subregion. There is further provided a second conductivity type underlying layer formed under the shallow central subregion so as to form a voltage regulating diode with the channel region at a position shallower than the bottom of the peripheral subregion.
摘要:
A power MOSFET is provided with a protective circuit including a monitor MOSFET whose drain is connected with the drain of the power MOSFET, a monitor resistor connected betwen the sources of the power and monitor MOSFETs, and a monitor transistor for decreasing a gate voltage of the power MOSFET when a voltage across the monitor resistor exceeds a predetermined level representing a dangerous condition of the device.
摘要:
Vertical MOS and another component such as CMOS are made in a single semiconductor substrate having a highly doped underlying layer and a lightly doped epitaxial surface layer of a first conductivity type. The vertical MOS includes a channel region of a second conductivity type, formed in the surface layer, and a source region of the first conductivity type, formed in the channel region. The channel region is made deep and joined with the highly doped underlying layer to form a first Zener diode for regulating a drain-source voltage. A drain electrode is formed on the bottom surface of the substrate and connected to a power supply, and a topside source electrode is connected to a load. The vertical MOS is surrounded, and separated from the CMOS, by a grounded guard ring region of the second conductivity type, formed in the surface layer. The guard ring region is also made deep and joined with the underlying layer.
摘要:
A pressure sensor having a silicon diaphragm whose opposite surfaces are subjected to fluid pressures for measurement. The diaphragm includes a diffused resistor as a pressure-sensitive element on a silicon base, a protective layer composed of a silicon epitaxial layer opposite in conductive type to the resistor and formed on the diffused resistor in order to prevent the resistor from being exposed to a corresponding fluid pressure, and an electrically insulating layer formed on an outer surface of the protective layer.
摘要:
A semiconductor structure having a plurality of drivers in and on the same semiconductor substrate is arranged to increase the density of integrated components and reduce the on resistance. The semiconductor structure employs a double layer interconnection structure having source and drain electrodes at two different levels, and an insulated gate electrode in a groove formed the semiconductor substrate. Each drain lead region having a low resistivity material extends from the upper surface of the substrate to a low resistivity buried layer. Each drain opening is surrounded by a source zone formed with a series of source holes or a long and narrow source slot, and this basic pattern is regularly repeated in a plane.
摘要:
A CMOS device having an nMOS formed in a p-type substrate region, and a pMOS formed in an n-type substrate region is provided with a Schottky barrier junction for collecting holes injected into the n-type substrate region, to prevent latch-up. The Schottky barrier junction is formed by a metal electrode and the n-type substrate region, and is located between the pMOS and the nMOS.