公开(公告)号：US5783865A

公开(公告)日：1998-07-21

申请号：US602423

申请日：1996-02-16

申请人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Makoto Totani ,  Yasuhiro Teshima ,  Hiroshi Iimura

发明人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Makoto Totani ,  Yasuhiro Teshima ,  Hiroshi Iimura

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/13 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/97 ,  H05K1/112 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/75251 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2203/0455 ,  H05K3/3431 ,  H05K3/42

摘要： A wiring substrate has a semiconductor device mounted thereonto, the semiconductor device having ball-shaped externally connecting parts. The wiring substrate includes through holes at positions corresponding to the ball-shaped externally connecting parts and electric conductors provided inside and around the through holes. Land portions of the electric conductors, at which the electric conductors are engaged with the externally connecting parts, includes sectional tapering portions, respectively. Further, the through holes have sectional tapering portions at edge portions in proximity to the land portions, respectively. The ball-shaped externally connecting parts of the semiconductor device are engaged with the land portions provided around the through holes of the wiring substrate and having the sectional tapering portions, respectively.

摘要翻译： 布线基板具有安装在其上的半导体器件，该半导体器件具有球形的外部连接部分。 布线基板在对应于球形外部连接部分的位置和设置在通孔内部和周围的电导体之间包括通孔。 电导体与外部连接部分接合的电导体的陆部分别包括截面渐缩部分。 此外，通孔分别在接合部分的边缘部分具有截面渐缩部分。 半导体器件的球形外部连接部分分别与设置在布线基板的通孔周围的接合部分接合并具有截面锥形部分。

公开(公告)号：US5760469A

公开(公告)日：1998-06-02

申请号：US602421

申请日：1996-02-16

申请人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Toshio Kumai ,  Ryoichi Ochiai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Hideaki Tamura ,  Hiroshi Iimura ,  Seishi Chiba ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

发明人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Toshio Kumai ,  Ryoichi Ochiai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Hideaki Tamura ,  Hiroshi Iimura ,  Seishi Chiba ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

IPC分类号： H01L23/12 ,  H01L23/057 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K3/34 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3436 ,  H01L23/057 ,  H01L23/3107 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/0271 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10477 ,  H05K2201/10568 ,  H05K2201/10666 ,  H05K3/3431 ,  Y02P70/613

摘要： A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.

摘要翻译： 半导体器件包括具有相对表面的封装，用于由所述封装支撑的外部连接的第一端子和由所述封装支撑的电子部件，并且封装的相对表面具有狭缝，使得封装的形状可以在 安装状态。 因此，施加到第一端子和第二端子的焊接接头的应力减小。

公开(公告)号：US06498307B2

公开(公告)日：2002-12-24

申请号：US09124509

申请日：1998-07-29

申请人： Yasuhiro Ichihara ,  Seiji Kogure ,  Hiroshi Iimura ,  Fumio Arase

发明人： Yasuhiro Ichihara ,  Seiji Kogure ,  Hiroshi Iimura ,  Fumio Arase

IPC分类号： H05K116

CPC分类号： H01L23/49838 ,  H01L23/49816 ,  H01L2224/16 ,  H05K3/3436 ,  H05K2201/09781 ,  H05K2201/10969 ,  H05K2201/2018 ,  Y02P70/613

摘要： A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package e.g. when a printed circuit board having the BGA package mounted thereon is carelessly dropped during the manufacturing work, at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.

摘要翻译： 一种球栅阵列（BGA）电子部件封装，具有能够提高安装效率的结构，并且防止在电子部件封装的电路连接部分处的占用空间。 BGA封装具有形成在布置常规电路连接凸块的预定区域外侧的区域中的增强凸块。 因此，即使对BGA封装施加冲击也是如此。 当在制造工作期间安装其上具有BGA封装的印刷电路板时，在对这种冲击最敏感的BGA封装的外部或周边部分处，不小心掉落了冲击，该冲击被加强凸块和加强脚印吸收 它们与电子部件封装的电路没有电连接。 因此，可以防止形成在BGA封装的安装部分上的印迹和形成在印刷电路板上的印迹破碎或破裂。

公开(公告)号：US06727718B2

公开(公告)日：2004-04-27

申请号：US10298640

申请日：2002-11-19

申请人： Yasuhiro Ichihara ,  Seiji Kogure ,  Hiroshi Iimura ,  Fumio Arase

发明人： Yasuhiro Ichihara ,  Seiji Kogure ,  Hiroshi Iimura ,  Fumio Arase

IPC分类号： G01R3126

CPC分类号： H01L23/49838 ,  H01L23/49816 ,  H01L2224/16 ,  H05K3/3436 ,  H05K2201/09781 ,  H05K2201/10969 ,  H05K2201/2018 ,  Y02P70/613

摘要： A ball grid array (BGA) electronic component package having a configuration which is capable of improving mounting efficiency as well as preventing footprints from breaking away at circuit-connecting portions of the electronic component package. The BGA package has reinforcing bumps formed in an area located outward of a predetermined area in which conventional circuit-connecting bumps are arranged. Therefore, even if a shock is applied to the BGA package at the outer or peripheral portion of the BGA package, which is most sensitive to such a shock, the shock is absorbed by the reinforcing bumps and reinforcing footprints which have no electrical connection with the circuitry of the electronic component package. Thus, the footprints formed on a mounting portion of the BGA package and those formed on the printed circuit board can be prevented from breaking away or being cracked.

摘要翻译： 一种球栅阵列（BGA）电子部件封装，其具有能够提高安装效率以及防止在电子部件封装的电路连接部分处的占用空隙的构造。 BGA封装具有形成在布置常规电路连接凸块的预定区域外侧的区域中的增强凸块。 因此，即使在BGA封装的外部或周边部分对BGA封装施加冲击，对于这种冲击最为敏感，冲击也被不受电连接的加强凸起和加强覆盖物吸收 电子部件封装的电路。 因此，可以防止形成在BGA封装的安装部分上的印迹和形成在印刷电路板上的印迹破碎或破裂。