公开(公告)号：US5783865A

公开(公告)日：1998-07-21

申请号：US602423

申请日：1996-02-16

申请人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Makoto Totani ,  Yasuhiro Teshima ,  Hiroshi Iimura

发明人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Makoto Totani ,  Yasuhiro Teshima ,  Hiroshi Iimura

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/13 ,  H01L23/498 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/97 ,  H05K1/112 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/75251 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2224/97 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2203/0455 ,  H05K3/3431 ,  H05K3/42

摘要： A wiring substrate has a semiconductor device mounted thereonto, the semiconductor device having ball-shaped externally connecting parts. The wiring substrate includes through holes at positions corresponding to the ball-shaped externally connecting parts and electric conductors provided inside and around the through holes. Land portions of the electric conductors, at which the electric conductors are engaged with the externally connecting parts, includes sectional tapering portions, respectively. Further, the through holes have sectional tapering portions at edge portions in proximity to the land portions, respectively. The ball-shaped externally connecting parts of the semiconductor device are engaged with the land portions provided around the through holes of the wiring substrate and having the sectional tapering portions, respectively.

摘要翻译： 布线基板具有安装在其上的半导体器件，该半导体器件具有球形的外部连接部分。 布线基板在对应于球形外部连接部分的位置和设置在通孔内部和周围的电导体之间包括通孔。 电导体与外部连接部分接合的电导体的陆部分别包括截面渐缩部分。 此外，通孔分别在接合部分的边缘部分具有截面渐缩部分。 半导体器件的球形外部连接部分分别与设置在布线基板的通孔周围的接合部分接合并具有截面锥形部分。

公开(公告)号：US6038135A

公开(公告)日：2000-03-14

申请号：US591119

申请日：1996-01-25

申请人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Makoto Totani ,  Yasuhiro Teshima

发明人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Makoto Totani ,  Yasuhiro Teshima

IPC分类号： H01L23/32 ,  H01L23/538 ,  H05K1/11 ,  H05K1/14 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36 ,  H05K1/18

CPC分类号： H05K1/112 ,  H05K1/141 ,  H05K3/225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K2201/049 ,  H05K2201/10287 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/0455 ,  H05K3/3405 ,  H05K3/3431 ,  H05K3/3436 ,  H05K3/368

摘要： A wiring board to be provided between a packaged electronic component having an integrated circuit and a mother board on which the packaged electronic component should be mounted, includes a base made of an insulating material, a first circuit pattern which is provided on a first surface of the base and has terminals connectable to terminals of the packaged electronic component for external connections, and a second circuit pattern which is provided on a second surface of the base opposite to the first surface thereof and has terminals connectable to terminals provided on the mother board.

摘要翻译： 在具有集成电路的封装的电子部件和其上安装有封装的电子部件的母板之间提供的布线板包括由绝缘材料制成的基座，第一电路图案设置在第一表面上 底座并具有可连接到用于外部连接的封装电子部件的端子的端子，以及设置在与其第一表面相对的基座的第二表面上并且具有可连接到设置在母板上的端子的端子的第二电路图案。

公开(公告)号：US5760469A

公开(公告)日：1998-06-02

申请号：US602421

申请日：1996-02-16

申请人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Toshio Kumai ,  Ryoichi Ochiai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Hideaki Tamura ,  Hiroshi Iimura ,  Seishi Chiba ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

发明人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Toshio Kumai ,  Ryoichi Ochiai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Hideaki Tamura ,  Hiroshi Iimura ,  Seishi Chiba ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

IPC分类号： H01L23/12 ,  H01L23/057 ,  H01L23/31 ,  H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K3/34 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3436 ,  H01L23/057 ,  H01L23/3107 ,  H01L23/49816 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/0271 ,  H05K2201/068 ,  H05K2201/09036 ,  H05K2201/10477 ,  H05K2201/10568 ,  H05K2201/10666 ,  H05K3/3431 ,  Y02P70/613

摘要： A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.

摘要翻译： 半导体器件包括具有相对表面的封装，用于由所述封装支撑的外部连接的第一端子和由所述封装支撑的电子部件，并且封装的相对表面具有狭缝，使得封装的形状可以在 安装状态。 因此，施加到第一端子和第二端子的焊接接头的应力减小。

公开(公告)号：US6023098A

公开(公告)日：2000-02-08

申请号：US591732

申请日：1996-01-25

申请人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Toshio Kumai ,  Ryoichi Ochiai ,  Makoto Totani

发明人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Toshio Kumai ,  Ryoichi Ochiai ,  Makoto Totani

IPC分类号： H01L23/12 ,  H01L23/13 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/498

CPC分类号： H01L23/13 ,  H01L23/3677 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8547 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181

摘要： A semiconductor device includes a wiring board, an electronic component supported by the wiring board, a heat conduction layer provided in the wiring board so as to be in contact with the electronic component, and terminals provided on the wiring board and thermally connected to the heat conduction layer through thermal vias provided in the wiring board. Heat generated by the electronic component conducts to the terminals through the heat conduction layer and then conducts to a circuit board on which the semiconductor device is placed.

摘要翻译： 半导体器件包括布线板，由布线板支撑的电子部件，设置在布线板中以与电子部件接触的导热层，以及设置在布线板上并与热量热连接的端子 导电层通过布线板上设置的热通孔。 由电子部件产生的热量通过导热层导通到端子，然后导通到其上放置半导体器件的电路板。

公开(公告)号：US5828128A

公开(公告)日：1998-10-27

申请号：US604429

申请日：1996-02-21

申请人： Yutaka Higashiguchi ,  Toshio Kumai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

发明人： Yutaka Higashiguchi ,  Toshio Kumai ,  Yasuhiro Teshima ,  Mamoru Niishiro ,  Yasushi Kobayashi ,  Yukio Sekiya ,  Shuzo Igarashi ,  Yasuhiro Ichihara

IPC分类号： H01L23/12 ,  G01R31/04 ,  H01L21/60 ,  H01L21/66 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H05K3/3436 ,  H01L23/49816 ,  G01R31/046 ,  H01L22/12 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1403 ,  H01L2924/01322 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/116 ,  H05K2201/0367 ,  H05K2201/094 ,  H05K2201/09745 ,  H05K2201/10666 ,  H05K2203/0455 ,  H05K2203/0465 ,  H05K2203/162 ,  H05K3/3431 ,  Y02P70/613

摘要： A BGA-type semiconductor device has a soldering bump a soldered state of which can be easily checked by visual inspection. A package has a bottom surface which faces the wiring board when the semiconductor device is mounted on the wiring board. A plurality of soldering bumps are provided on the bottom surface of the package. The soldering bumps are in a plurality of different sizes, and are located in positions where the soldering bumps are observable from outside of the package when the semiconductor device is mounted on the wiring board.

摘要翻译： BGA型半导体器件具有焊接凸块，其焊接状态可以通过目视检查容易地检查。 当半导体器件安装在布线板上时，封装具有面向布线板的底表面。 多个焊接凸块设置在封装的底表面上。 焊接凸块具有多个不同的尺寸，并且当将半导体器件安装在布线板上时，位于从封装外部观察焊接凸块的位置。

公开(公告)号：US5631660A

公开(公告)日：1997-05-20

申请号：US590470

申请日：1995-11-07

申请人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Takeyasu Maeda ,  Kazuyoshi Aoki ,  Kohichi Kamei ,  Toshiaki Amano

发明人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Takeyasu Maeda ,  Kazuyoshi Aoki ,  Kohichi Kamei ,  Toshiaki Amano

IPC分类号： H01Q1/24 ,  H01Q1/38 ,  H01Q5/00 ,  H01Q9/04 ,  H01Q9/40

CPC分类号： H01Q1/38 ,  H01Q5/40 ,  H01Q9/0442 ,  H01Q9/0471

摘要： An antenna module capable of finely adjusting the resonant frequency and having an antenna element exclusively used for radio transmission and reception to provide a broad frequency band characteristic. This antenna module is composed of a dielectric substrate molded in a predetermined shape, a grounding conductor in the form of sheet provided on one surface of the dielectric substrate, and antenna element conductor in the form of sheet provided on the opposite surface to the above one surface and having end portion being almost V-shaped end folded, and an adjusting member inserted into the almost V-shaped folded end portion.

摘要翻译： 一种能够精细调节谐振频率并具有专用于无线电发射和接收的天线元件以提供宽频带特性的天线模块。 该天线模块由模制成预定形状的电介质基片，设置在电介质基片的一个表面上的片状接地导体和设置在与上述相反的表面上的片状导体 表面并且具有大致V形端部折叠的端部，以及插入到大致V形折叠端部的调节构件。

公开(公告)号：US5455596A

公开(公告)日：1995-10-03

申请号：US165119

申请日：1993-12-10

申请人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Hajime Mochizuki ,  Noriyuki Kohma ,  Yoshikazu Kamei ,  Toshiaki Amano

发明人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Hajime Mochizuki ,  Noriyuki Kohma ,  Yoshikazu Kamei ,  Toshiaki Amano

IPC分类号： H01Q1/38 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q13/08

CPC分类号： H01Q1/243 ,  H01Q9/0421

摘要： An antenna module suitable for a reduction in size and weight of equipment and improved in manufacturability. The antenna module includes a ground element formed from a planar conductor, an antenna element formed from a planar conductor and arranged in parallel to the ground element, and a loop element formed from a tubular conductor and arranged between the ground element and the antenna element in predetermined positional relationship with both elements so as to be connected with the antenna element. The loop element has a first hollow portion passing therethrough in a given direction. The antenna module further includes an element support formed from an insulator and arranged so as to fill a space between the ground element and the antenna element and substantially fully cover an outer surface of the loop element. The element support is formed with a second hollow portion passing therethrough in the same direction as that of the first hollow portion of the loop element.

摘要翻译： 适合于减小设备尺寸和重量并提高可制造性的天线模块。 天线模块包括由平面导体形成的接地元件，由平面导体形成并且平行于接地元件布置的天线元件，以及由管状导体形成并设置在接地元件和天线元件之间的环形元件 与两个元件预定的位置关系，以便与天线元件连接。 环形元件具有沿给定方向穿过其中的第一中空部分。 天线模块还包括由绝缘体形成并且被布置成填充接地元件和天线元件之间的空间并且基本上完全覆盖环形元件的外表面的元件支撑件。 所述元件支撑件形成有与所述环形元件的第一中空部分相同的方向穿过其中的第二中空部分。

公开(公告)号：US5361488A

公开(公告)日：1994-11-08

申请号：US165120

申请日：1993-12-10

申请人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Hidenori Tanizawa ,  Takeyasu Maeda ,  Noriyuki Kohma ,  Hajime Mochizuki ,  Kouroh Mekata ,  Toshiaki Amano ,  Yoshikazu Kamei

发明人： Yutaka Higashiguchi ,  Mitsuo Inagaki ,  Hidenori Tanizawa ,  Takeyasu Maeda ,  Noriyuki Kohma ,  Hajime Mochizuki ,  Kouroh Mekata ,  Toshiaki Amano ,  Yoshikazu Kamei

IPC分类号： H01Q1/38 ,  H01Q1/48 ,  H01Q7/00 ,  H01Q21/00 ,  H01Q1/12

CPC分类号： H01Q7/00 ,  H01Q21/0087 ,  Y10T29/49016 ,  Y10T29/49787 ,  Y10T29/49798

摘要： A manufacturing method for plural antenna modules which is suitable for mass production. Each antenna module includes a ground element, an antenna element, a loop element, and an element support. The manufacturing method for the antenna modules includes a first step of setting in a mold a first conductive base material including a plurality of the ground elements integrally connected together, a second conductive base material including a plurality of the antenna elements integrally connected together, and a third conductive base material including a plurality of the loop elements integrally connected together; a second step of filling a cavity defined in the mold with a curing fluid and then curing the curing fluid to thereby form an element support base material including a plurality of the element supports integrally connected together; and a third step of cutting the element support base material together with the first, second and third conductive base materials to thereby obtain a plurality of the antenna modules.

摘要翻译： 适用于批量生产的多个天线模块的制造方法。 每个天线模块包括接地元件，天线元件，环形元件和元件支撑件。 天线模块的制造方法包括：第一步骤，在模具中设置包括整体连接在一起的多个接地元件的第一导电基材，包括整体连接在一起的多个天线元件的第二导电基材，以及 第三导电基材，包括整体连接在一起的多个环形元件; 第二步骤，用固化流体填充模具中限定的空腔，然后固化固化流体，从而形成包括整体连接在一起的多个元件支撑件的元件支撑基材; 以及第三步骤，与第一，第二和第三导电基材一起切割元件支撑基材，从而获得多个天线模块。

公开(公告)号：US5268702A

公开(公告)日：1993-12-07

申请号：US858209

申请日：1992-03-26

申请人： Toshiaki Amano ,  Hirokazu Shiroishi ,  Kenichi Fuse ,  Yutaka Higashiguchi ,  Hirotaka Kashiwabara ,  Mitsuo Inagaki ,  Hidehiro Mishiro

发明人： Toshiaki Amano ,  Hirokazu Shiroishi ,  Kenichi Fuse ,  Yutaka Higashiguchi ,  Hirotaka Kashiwabara ,  Mitsuo Inagaki ,  Hidehiro Mishiro

IPC分类号： H01Q1/24 ,  H01Q9/04 ,  H01Q13/08 ,  H01Q1/48

CPC分类号： H01Q1/243 ,  H01Q9/0407

摘要： A ground conducting layer and an antenna element conducting layer are set at a predetermined position in a cavity of a molding die, and molten resin is injected into the cavity, thereby molding a resin-formed member in which said ground conducting layer and said antenna element conducting layer are integrated. As a result of this, there can provided an antenna module comprising a resin member formed by molding to be a predetermined shape, a sheet-like ground conducting layer adhered to one surface of the resin member, a sheet-like antenna element conducting layer adhered to another surface opposing to the one surface of said resin member, and a feeder for feeding electricity to the antenna element conducting layer.

摘要翻译： 将接地导电层和天线元件导电层设置在成型模具的空腔中的预定位置，并将熔融树脂注入空腔中，从而模制树脂成形构件，其中所述接地导电层和所述天线元件 导电层集成。 作为其结果，可以提供一种天线模块，其包括通过模制成为预定形状的树脂构件，粘附到树脂构件的一个表面上的片状接地导电层，粘附到片状天线元件导电层 到与所述树脂构件的一个表面相对的另一表面，以及用于向天线元件导电层供电的馈电器。

公开(公告)号：US07835159B2

公开(公告)日：2010-11-16

申请号：US11892930

申请日：2007-08-28

申请人： Kinuko Mishiro ,  Yutaka Higashiguchi ,  Masahiko Yamashita

发明人： Kinuko Mishiro ,  Yutaka Higashiguchi ,  Masahiko Yamashita

IPC分类号： H05K1/11 ,  H05K1/14

CPC分类号： H05K3/361 ,  H05K1/0269 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/166 ,  Y10T29/49126

摘要： A second member is superposed on a first member. A first recognition mark is described on the surface of the first member. A second recognition mark is described on the surface of the second members. The first recognition mark is fragmented along the edge of the second member when the second member is superposed on the first member. The second recognition mark ends at the edge of the second member. The second recognition mark cooperates with the first recognition mark for establishment of a predetermined geometric pattern. The relative positions of the first and second recognition marks can be adjusted based on an irregular or unshaped geometric pattern. The second member can thus reliably be superposed on the surface of the first member at the correct position.

摘要翻译： 第二构件叠置在第一构件上。 在第一构件的表面上描述第一识别标记。 在第二构件的表面上描述第二识别标记。 当第二构件叠置在第一构件上时，第一识别标记沿第二构件的边缘分段。 第二识别标记在第二构件的边缘处结束。 第二识别标记与用于建立预定几何图案的第一识别标记协作。 第一和第二识别标记的相对位置可以基于不规则或未成形的几何图案来调整。 因此，第二构件能够可靠地以正确的位置重叠在第一构件的表面上。