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    Method of forming a packaged semiconductor device
    6.
    发明授权
    Method of forming a packaged semiconductor device 有权
    形成封装半导体器件的方法

    公开(公告)号：US08216918B2

    公开(公告)日：2012-07-10

    申请号：US12842562

    申请日：2010-07-23

    申请人： Zhiwei Gong ,  Scott M. Hayes ,  George R. Leal ,  Douglas G. Mitchell ,  Jason R. Wright ,  Jianwen Xu

    发明人： Zhiwei Gong ,  Scott M. Hayes ,  George R. Leal ,  Douglas G. Mitchell ,  Jason R. Wright ,  Jianwen Xu

    IPC分类号： H01L21/00 ,  H01L21/322

    CPC分类号： H01L21/6835 ,  H01L24/19 ,  H01L2221/68345 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2225/1035 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3511 ,  H05K1/185 ,  H05K2203/1469

    摘要： A method is used to form a packaged semiconductor device. A semiconductor device, which has an active surface, is placed in an opening of a circuit board. The circuit board has a first major surface and a second major surface having the opening, first vias that extend between the first major surface and the second major surface, first contact pads terminating the vias at the first major surface, and second contact pads terminating the vias at the second major surface. A dielectric layer is applied over the semiconductor device and the second major surface of the circuit board. An interconnect layer is formed over the dielectric layer. The interconnect layer has second vias electrically connected to the second contact pads, third vias that are electrically connected to the active surface of the semiconductor device, an exposed surface, and third contact pads at the exposed surface.

    摘要翻译： 使用一种方法来形成封装的半导体器件。 具有活性表面的半导体器件被放置在电路板的开口中。 电路板具有第一主表面和具有开口的第二主表面，在第一主表面和第二主表面之间延伸的第一通孔，第一接触垫在第一主表面处终止通孔，第二接触垫终止 第二个主要表面的通孔。 电介质层被施加在半导体器件和电路板的第二主表面上。 在电介质层上形成互连层。 互连层具有电连接到第二接触焊盘的第二通孔，电连接到半导体器件的有源表面的第三通孔，暴露表面和暴露表面处的第三接触焊盘。

    SEMICONDUCTOR DEVICE PACKAGING USING ENCAPSULATED CONDUCTIVE BALLS FOR PACKAGE-ON-PACKAGE BACK SIDE COUPLING
    7.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGING USING ENCAPSULATED CONDUCTIVE BALLS FOR PACKAGE-ON-PACKAGE BACK SIDE COUPLING 审中-公开
    半导体器件封装使用封装导电棒包装封装背面耦合

    公开(公告)号：US20130154091A1

    公开(公告)日：2013-06-20

    申请号：US13325092

    申请日：2011-12-14

    申请人： Jason R. Wright ,  Zhiwei Gong ,  Scott M. Hayes ,  Douglas G. Mitchell

    发明人： Jason R. Wright ,  Zhiwei Gong ,  Scott M. Hayes ,  Douglas G. Mitchell

    IPC分类号： H01L23/498 ,  H01L21/50

    CPC分类号： H01L23/49816 ,  H01L21/568 ,  H01L23/4985 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L2224/12105 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00

    摘要： A semiconductor device package having an embedded three-dimensional interconnect structure and a process for making such a package is provided. One or more ball conductors are attached to a major surface of a substrate that provides at least an electrical conduit from the ball conductor to an opposite major surface of the substrate. The substrate can also provide an interconnect between solder balls. The combination of solder balls and substrate is encapsulated in the semiconductor device package. The ends of the signal conduits are exposed on one major surface of the device package, while a portion of the ball conductors is exposed on the opposite major surface of the device package. The ball conductors and signal conduits provide signal-bearing pathways between the major surfaces of the package. Contacts created by the back grinded ball conductors are used to form a package-on-package structure by coupling with contacts from another package.

    摘要翻译： 提供具有嵌入式三维互连结构的半导体器件封装以及制造这种封装的工艺。 一个或多个球导体附接到基底的主表面，其提供至少一个从球形导体到基底的相对主表面的电导管。 衬底还可以提供焊球之间的互连。 焊球和衬底的组合被封装在半导体器件封装中。 信号导管的端部暴露在器件封装的一个主表面上，而一部分球形导体暴露在器件封装的相对主表面上。 球导体和信号导管在包装的主表面之间提供信号承载通路。 由背面研磨的球形导体产生的触点用于通过与另一个封装的触点耦合而形成封装封装结构。

    METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE
    8.
    发明申请
    METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE 有权
    形成包装半导体器件的方法

    公开(公告)号：US20120021565A1

    公开(公告)日：2012-01-26

    申请号：US12842562

    申请日：2010-07-23

    申请人： Zhiwei Gong ,  Scott M. Hayes ,  George R. Leal ,  Douglas G. Mitchell ,  Jason R. Wright ,  Jianwen Xu

    发明人： Zhiwei Gong ,  Scott M. Hayes ,  George R. Leal ,  Douglas G. Mitchell ,  Jason R. Wright ,  Jianwen Xu

    IPC分类号： H01L21/58

    CPC分类号： H01L21/6835 ,  H01L24/19 ,  H01L2221/68345 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2225/1035 ,  H01L2924/01029 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3511 ,  H05K1/185 ,  H05K2203/1469

    摘要： A method is used to form a packaged semiconductor device. A semiconductor device, which has an active surface, is placed in an opening of a circuit board. The circuit board has a first major surface and a second major surface having the opening, first vias that extend between the first major surface and the second major surface, first contact pads terminating the vias at the first major surface, and second contact pads terminating the vias at the second major surface. A dielectric layer is applied over the semiconductor device and the second major surface of the circuit board. An interconnect layer is formed over the dielectric layer. The interconnect layer has second vias electrically connected to the second contact pads, third vias that are electrically connected to the active surface of the semiconductor device, an exposed surface, and third contact pads at the exposed surface.

    摘要翻译： 使用一种方法来形成封装的半导体器件。 具有活性表面的半导体器件被放置在电路板的开口中。 电路板具有第一主表面和具有开口的第二主表面，在第一主表面和第二主表面之间延伸的第一通孔，第一接触垫在第一主表面处终止通孔，第二接触垫终止 第二个主要表面的通孔。 电介质层被施加在半导体器件和电路板的第二主表面上。 在电介质层上形成互连层。 互连层具有电连接到第二接触焊盘的第二通孔，电连接到半导体器件的有源表面的第三通孔，暴露表面和暴露表面处的第三接触焊盘。