公开(公告)号：US20230274920A1

公开(公告)日：2023-08-31

申请号：US18110269

申请日：2023-02-15

申请人： INTEVAC, INC.

发明人： Terry Bluck ,  Samuel D. Harkness, IV ,  Tom Nolan

IPC分类号： H01J37/34 ,  H01J37/32

CPC分类号： H01J37/3405 ,  H01J37/3452 ,  H01J37/32761 ,  H01J37/3244 ,  H01J37/32623

摘要： A linear processing system having an entry loadlock, a first multi-pass processing chamber coupled to the entry loadlock, the first multi-pass processing chamber having a sputtering magnetron arrangement and configured to house a single substrate carrier for performing a multi-pass processing; a single-pass chamber coupled to the first multi-pass processing chamber and having a plurality of magnetron arrangements arranged along a carrier travel direction, the single-pass chamber configured to house multiple carriers arranged serially in a row and configured for a single-pass processing; a second multi-pass processing chamber coupled to the single-pass processing chamber, the second multi-pass processing chamber having a sputtering magnetron arrangement and configured to house a single substrate carrier for performing a multi-pass processing; and an exit loadlock chamber coupled to the second multi-pass processing chamber.

公开(公告)号：US11414748B2

公开(公告)日：2022-08-16

申请号：US16583165

申请日：2019-09-25

申请人： Intevac, Inc.

发明人： Terry Bluck

IPC分类号： H01L21/677 ,  C23C14/56 ,  C23C14/34 ,  C23C14/50 ,  H01L21/67

摘要： A processing system is provided, including a vacuum enclosure having a plurality of process windows and a continuous track positioned therein; a plurality of processing chambers attached sidewalls of the vacuum enclosures, each processing chamber about one of the process windows; a loadlock attached at one end of the vacuum enclosure and having a loading track positioned therein; at least one gate valve separating the loadlock from the vacuum enclosure; a plurality of substrate carriers configured to travel on the continuous track and the loading track; at least one track exchanger positioned within the vacuum enclosure, the track exchangers movable between a first position, wherein substrate carriers are made to continuously move on the continuous track, and a second position wherein the substrate carriers are made to transfer between the continuous track and the loading track.

公开(公告)号：US10115617B2

公开(公告)日：2018-10-30

申请号：US15284450

申请日：2016-10-03

申请人： Intevac, Inc.

发明人： Terry Bluck ,  Vinay Shah ,  Alexandru Riposan

IPC分类号： H01L21/677 ,  H01L21/67 ,  H01L21/687

摘要： A system for processing substrates in plasma chambers, such that all substrates transport and loading/unloading operations are performed in atmospheric environment, but processing is performed in vacuum environment. The substrates are transported throughout the system on carriers. The system's chambers are arranged linearly, such that carriers move from one chamber directly to the next. A conveyor, placed above or below the system's chambers, returns the carriers to the system's entry area after processing is completed. Loading and unloading of substrates may be performed at one side of the system, or loading can be done at the entry side and unloading at the exit side.

公开(公告)号：US09633880B2

公开(公告)日：2017-04-25

申请号：US14477783

申请日：2014-09-04

申请人： Intevac, Inc.

发明人： Stuart Scollay

IPC分类号： H01L21/677 ,  G11B5/84 ,  H01L21/673

CPC分类号： H01L21/67742 ,  G11B5/8404 ,  H01L21/67346 ,  H01L21/67709 ,  H01L21/67748 ,  H01L21/67751 ,  H01L2221/67 ,  Y10S414/139

摘要： Disclosed is a substrate processing system with a magnetic conduit configuration to improve the movement of a substrate carrier within the system. The configuration specifically provides for safe, secure movement of a carrier between multiple levels of a substrate processing system by using magnetic conduits to redirect magnetic forces created by a linear motor, permitting the linear motor to be positioned outside of the system and in a location that will not interfere with the movement of the carrier.

公开(公告)号：US09583661B2

公开(公告)日：2017-02-28

申请号：US15073427

申请日：2016-03-17

申请人： Intevac, Inc.

发明人： Vinay Prabhakar ,  Babak Adibi

IPC分类号： H01L21/425 ,  C23C16/00 ,  H01L31/05 ,  H01L21/266 ,  H01L31/18 ,  H01L31/068 ,  H01L21/426 ,  H01J37/32

CPC分类号： H01L31/0516 ,  H01J37/32412 ,  H01J37/32422 ,  H01J37/32623 ,  H01J2237/20 ,  H01J2237/3365 ,  H01L21/266 ,  H01L21/426 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/188 ,  Y02E10/50 ,  Y02E10/547 ,  Y02P70/521

摘要： A grid for minimizing effects of ion divergence in plasma ion implant. The plasma grid is made of a flat plate having a plurality of holes, wherein the holes are arranged in a plurality of rows and a plurality of columns thereby forming beamlets of ions that diverge in one direction. A mask is used to form the implanted shapes on the wafer, wherein the holes in the mask are oriented orthogonally to the direction of beamlet divergence.

摘要翻译： 用于最小化离子发散在等离子体离子注入中的网格。 等离子体格栅由具有多个孔的平板制成，其中孔布置成多行和多个列，从而形成沿一个方向发散的离子束。 掩模用于在晶片上形成植入的形状，其中掩模中的孔与子束发散的方向垂直。

公开(公告)号：US09543114B2

公开(公告)日：2017-01-10

申请号：US14819402

申请日：2015-08-05

申请人： Intevac, Inc.

发明人： Babak Adibi ,  Vinay Prabhakar ,  Terry Bluck

IPC分类号： G01N23/00 ,  H01J37/20 ,  H01J37/18 ,  H01J37/317

CPC分类号： H01J37/20 ,  H01J37/185 ,  H01J37/3045 ,  H01J37/3171 ,  H01J2237/2007 ,  H01J2237/202 ,  H01J2237/204 ,  H01J2237/31701 ,  H01J2237/31711

摘要： System and method to align a substrate under a shadow mask. A substrate holder has alignment mechanism, such as rollers, that is made to abut against an alignment straight edge. The substrate is then aligned with respect to the straight edge and is chucked to the substrate holder. The substrate holder is then transported into a vacuum processing chamber, wherein it is made to abut against a mask straight edge to which the shadow mask is attached and aligned to. Since the substrate was aligned to an alignment straight edge, and since the mask is aligned to the mask straight edge that is precisely aligned to the alignment straight edge, the substrate is perfectly aligned to the mask.

摘要翻译： 将底物对准荫罩的系统和方法。 衬底保持器具有对准机构，例如辊，其抵靠对准直边缘。 然后将衬底相对于直边对准，并被夹持到衬底保持器。 然后将衬底保持器输送到真空处理室中，其中它与邻接荫罩直线边缘抵接，荫罩直线边缘与阴罩对准。 由于衬底与对准直边对准，并且由于掩模与精确地对准直线对准的掩模直边对准，所以基板与掩模完全对准。

公开(公告)号：US09303314B2

公开(公告)日：2016-04-05

申请号：US14510109

申请日：2014-10-08

申请人： Intevac, Inc.

发明人： Babak Adibi ,  Moon Chun

IPC分类号： H01L31/18 ,  C23C14/48 ,  C23C14/04 ,  H01J37/32 ,  H01L21/223 ,  H01J37/18 ,  H01J37/317 ,  H01L31/068

CPC分类号： H01L31/1876 ,  C23C14/042 ,  C23C14/48 ,  H01J37/185 ,  H01J37/3171 ,  H01J37/32412 ,  H01J37/32422 ,  H01J2237/0437 ,  H01J2237/184 ,  H01J2237/201 ,  H01J2237/327 ,  H01J2237/3365 ,  H01L21/2236 ,  H01L31/068 ,  H01L31/0682 ,  H01L31/1804 ,  H01L31/1864 ,  Y02E10/547 ,  Y02P70/521

摘要： An ion implantation system having a grid assembly. The system includes a plasma source configured to provide plasma in a plasma region; a first grid plate having a plurality of apertures configured to allow ions from the plasma region to pass therethrough, wherein the first grid plate is configured to be biased by a power supply; a second grid plate having a plurality of apertures configured to allow the ions to pass therethrough subsequent to the ions passing through the first grid plate, wherein the second grid plate is configured to be biased by a power supply; and a substrate holder configured to support a substrate in a position where the substrate is implanted with the ions subsequent to the ions passing through the second grid plate.

公开(公告)号：US20140332376A1

公开(公告)日：2014-11-13

申请号：US14185867

申请日：2014-02-20

申请人： INTEVAC, INC.

发明人： Vinay Shah ,  Alex Riposan ,  Terry Bluck

IPC分类号： H01J37/34

CPC分类号： C23C14/351 ,  C23C14/35 ,  C23C14/56 ,  H01J37/32779 ,  H01J37/32899 ,  H01J37/3405 ,  H01J37/3417 ,  H01J37/3452 ,  H01J37/3455 ,  H01J2237/202 ,  H01J2237/3323

摘要： A system for depositing material from a target onto substrates, comprising a processing chamber; a sputtering target having length L and having sputtering material provided on front surface thereof; a magnet operable to reciprocally scan across the length L in close proximity to rear surface of the target; and a counterweight operable to reciprocally scan at same speed but opposite direction of the magnet.

摘要翻译： 一种用于将材料从靶材沉积到基材上的系统，包括处理室; 具有长度L并在其前表面上设置有溅射材料的溅射靶; 一个磁铁可操作以在紧邻目标的后表面的整个长度L上往复扫描; 以及配重可操作以在与磁体相同的速度但相反的方向上往复扫描。

公开(公告)号：US08795466B2

公开(公告)日：2014-08-05

申请号：US12495724

申请日：2009-06-30

申请人： Michael S. Barnes ,  Terry Bluck

发明人： Michael S. Barnes ,  Terry Bluck

IPC分类号： H01L21/306

CPC分类号： H01L21/67173 ,  H01L21/67069 ,  H01L21/67207 ,  H01L21/67346 ,  H01L21/67712 ,  H01L31/18 ,  H05K3/143

摘要： Apparatus and methods are provided that enable processing of patterned layers on substrates using a detachable mask. Unlike prior art where the mask is formed directly over the substrate, according to aspects of the invention the mask is made independently of the substrate. During use, the mask is positioned in close proximity or in contact with the substrate so as to expose only portions of the substrate to processing, e.g., sputtering or etch. Once the processing is completed, the mask is moved away from the substrate and may be used for another substrate. The substrate may be cycled for a given number of substrates and then be removed for cleaning or disposal.

摘要翻译： 提供了使用可拆卸掩模在基板上处理图案化层的装置和方法。 与掩模直接形成在衬底上的现有技术不同，根据本发明的方面，掩模独立于衬底制成。 在使用期间，掩模位于与衬底紧密接近或接触的位置，以便只暴露衬底的一部分以进行处理，例如溅射或蚀刻。 一旦处理完成，掩模就从衬底移开并可用于另一衬底。 衬底可以循环给定数量的衬底，然后被移除以进行清洁或处置。

公开(公告)号：US08677929B2

公开(公告)日：2014-03-25

申请号：US13338173

申请日：2011-12-27

申请人： Alexander J. Berger ,  Terry Bluck ,  Vinay Shah ,  Judy Huang ,  Karthik Janakiraman ,  Chau T. Nguyen ,  Greg Stumbo

发明人： Alexander J. Berger ,  Terry Bluck ,  Vinay Shah ,  Judy Huang ,  Karthik Janakiraman ,  Chau T. Nguyen ,  Greg Stumbo

IPC分类号： B05C3/00 ,  B05C19/02 ,  B65G37/00 ,  B65G47/12 ,  H01L21/00 ,  H01L25/00 ,  B05D1/18

CPC分类号： H01L31/1876 ,  B05D1/322 ,  B05D1/327 ,  C23C14/042 ,  C23C16/042 ,  Y02E10/50 ,  Y02P70/521

摘要： Disclosed are methods and apparatus for masking of substrates for deposition, and subsequent lifting of the mask with deposited material. Masking materials are utilized that can be used in high temperatures and vacuum environment. The masking material has minimal outgassing once inside a vacuum chamber and withstand the temperatures during deposition process. The mask is inkjeted over the wafers and, after deposition, removed using agitation, such as ultrasonic agitation, or using laser burn off.

摘要翻译： 公开了用于掩蔽用于沉积的基底的方法和装置，以及随后用沉积材料提起掩模。 使用可在高温和真空环境中使用的遮蔽材料。 掩模材料一旦在真空室内就具有最小的除气，并能承受沉积过程中的温度。 将掩模喷涂在晶片上，并且在沉积之后，使用搅拌（例如超声波搅拌）或使用激光烧掉来除去掩模。