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    Brightness Enhancement Component
    3.
    发明申请
    Brightness Enhancement Component 审中-公开
    亮度增强组件

    公开(公告)号：US20090231859A1

    公开(公告)日：2009-09-17

    申请号：US12190845

    申请日：2008-08-13

    申请人： Tou-Sheng Yeh ,  Chang-Yi Chen ,  Ming-Che Yang ,  Horng-Chin Yeh

    发明人： Tou-Sheng Yeh ,  Chang-Yi Chen ,  Ming-Che Yang ,  Horng-Chin Yeh

    IPC分类号： F21V5/02

    CPC分类号： G02B5/045 ,  G02B6/0053 ,  G02F2001/133607

    摘要： A brightness enhancement component includes a substrate and a plurality of prism elements. The prism elements are disposed on the substrate, and each element prism has a relatively high crest and at least one relatively low crest. A crest line of the relatively low crest is equal to or shorter than a crest line of the relatively high crest in length. All of the relatively high crests have their crest lines in parallel with one another, or all of the relatively high and relatively low crests have their crest lines in parallel with one another.

    摘要翻译： 亮度增强部件包括基板和多个棱镜元件。 棱镜元件设置在基板上，并且每个元件棱镜具有相对较高的峰值和至少一个相对低的波峰。 相对较低的波峰的波峰线等于或短于相对较高波峰长度的波峰线。 所有相对较高的波峰都具有彼此平行的波峰线，或者所有相对较高和相对较低的波峰的波峰线彼此平行。

    PREPREG, LAMINATED AND PRINTED CIRCUIT BOARD THEREOF
    6.
    发明申请
    PREPREG, LAMINATED AND PRINTED CIRCUIT BOARD THEREOF 有权

    公开(公告)号：US20210147646A1

    公开(公告)日：2021-05-20

    申请号：US16822013

    申请日：2020-03-18

    申请人： ITEQ CORPORATION

    发明人： MING LIU ,  TSUNG-LIEH WENG ,  SHAO-JIE YUAN ,  KAI-YANG CHEN ,  TA-YUAN YU

    IPC分类号： C08J5/24 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03 ,  H05K1/09

    摘要： A prepreg, a laminated board, and a printed circuit board thereof are provided. The prepreg includes a halogen-free epoxy resin composition and a partially cured non-woven reinforcing material impregnated therein. The non-woven reinforcing material has a dielectric strength of 1.5 to 4.8 and a loss factor that is less than 0.003 at 10 GHz, and the halogen-free epoxy resin composition includes: (a) 100 parts by weight of a halogen-free naphthalene type epoxy resin, (b) 10 to 25 parts by weight of a DOPO modifying curing agent, (c) 25 to 45 parts by weight of a cyanate resin, (d) 35 to 60 parts by weight of bismaleimide, (e) 45 to 65 parts by weight of a non-DOPO flame retardant, and (f) 0.5 to 15 parts by weight of a curing accelerator.

    Laminated substrate
    7.
    发明授权
    Laminated substrate 有权

    公开(公告)号：US10518503B2

    公开(公告)日：2019-12-31

    申请号：US15969922

    申请日：2018-05-03

    申请人： ITEQ CORPORATION

    发明人： Ta-Yuan Yu ,  Kai-Yang Chen ,  Yen-Hsing Wu

    IPC分类号： B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03

    摘要： A laminated substrate including a halogen-free epoxy resin composition. The halogen-free epoxy resin composition includes 100 parts by weight of a halogen-free naphthalene type epoxy resin, 10 to 25 parts by weight of a DOPO modified curing agent, 25 to 45 parts by weight of a cyanate resin, 35 to 60 parts by weight of bismaleimide, 45 to 65 parts by weight of a non-DOPO flame retardant, and 0.5 to 15 parts by weight of a curing accelerator. The laminated substrate of the present disclosure includes a halogen-free epoxy resin composition which has the characteristic of high transition temperature, so that the halogen-free epoxy resin composition has low dielectric constant, low dissipation factor, high heat resistance and high storage modulus.

    DIELECTRIC MATERIAL WITH LOW DIELECTRIC LOSS
    8.
    发明申请
    DIELECTRIC MATERIAL WITH LOW DIELECTRIC LOSS 有权
    具有低介电损耗的电介质材料

    公开(公告)号：US20140275377A1

    公开(公告)日：2014-09-18

    申请号：US13845908

    申请日：2013-03-18

    申请人： ITEQ Corporation

    发明人： Meng-Song YIN ,  Li-Chun CHEN

    IPC分类号： H01B3/42 ,  H01B3/44 ,  H01B3/30

    CPC分类号： H01B3/306 ,  C08L71/12 ,  C08L79/085 ,  H01B3/307 ,  H01B3/427 ,  H01B3/442 ,  H01B3/448 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022

    摘要： The invention provides a dielectric material with low dielectric loss. The dielectric material comprises (i) 40˜80 parts by weight of polyphenylene ether resin having a Mw of 1000˜7000, a Mn of 1000˜4000 and Mw/Mn=1.0˜1.8; (ii) 5˜30 parts by weight of bismaleimide resins; and (iii) 5˜30 parts by weight of polymer additives, wherein the dielectric material has Dk of 3.75˜4.0 and Df of 0.0025˜0.0045. The dielectric material is suitably used in prepregs and insulation layers of a circuit board, because it has high Tg, low thermal expansion coefficient, low moisture absorption and excellent dielectric properties such as Dk and Df.

    摘要翻译： 本发明提供具有低介电损耗的介电材料。 电介质材料包括（i）40〜80重量份Mw为1000〜7000，Mn为1000〜4000，Mw / Mn = 1.0〜1.8的聚苯醚树脂; （ii）5〜30重量份双马来酰亚胺树脂; 和（iii）5〜30重量份的聚合物添加剂，其中介电材料的Dk为3.75〜4.0，Df为0.0025〜0.0045。 介电材料适用于电路板的预浸料和绝缘层，因为它具有高Tg，低热膨胀系数，低吸湿性和优异的介电性能如Dk和Df。