摘要:
A semiconductor device includes a data input/output circuit that has an ODT function and a DLL circuit that generates an internal clock for determining an operation timing of the data input/output circuit. The DLL circuit has a first mode for controlling a phase of the internal clock in a precise manner and a second mode for operating with low power consumption. When the data input/output circuit does not perform an ODT operation, the DLL circuit operates in the first mode, and when the data input/output circuit performs the ODT operation, the DLL circuit operates in the second mode. In this manner, the operation mode of the DLL circuit is switched over depending on the ODT operation, so that the power consumption in the ODT operation in which strict phase control is not required can be reduced.
摘要:
A semiconductor device, includes an input buffer, first and second PMOS transistors serially interconnected between a first power supply node and an output node of the input buffer. First and second NMOS transistors are serially interconnected between a second power supply node and the output node of the input buffer. A replica circuit includes a third and fourth PMOS transistors serially interconnected between the first power supply node and an output node of the replica circuit. Third and fourth NMOS transistors are serially interconnected between the second power supply node and the output node of the replica circuit. The input node of the replica circuit is connected to the output node of the replica circuit and a comparison circuit compares a voltage at the output node of the replica circuit to a reference voltage.
摘要:
One semiconductor device includes a command receiver receiving the command signal to generate a first internal command signal, and a latency control circuit activating a second internal chip select signal after elapse of first cycles of a clock signal since a first internal chip select signal is activated. The latency control circuit activates a second control signal when the chip select signal is maintained in an inactive state during second cycles of the clock signal that is larger than the first cycles. The command receiver is activated based on a first control signal. The first control signal is activated in response to the first internal chip select signal. The first control signal is deactivated in response to the second control signal.
摘要:
A semiconductor device includes an insulating substrate including a first surface and an opposing second surface, and a semiconductor chip. The semiconductor chip is mounted over the first surface, includes signal electrodes, power-supply electrodes and ground electrodes, which connect to pads on the first surface of the insulating substrate. Lands provided on the second surface of the insulating substrate include signal lands, power-supply lands and ground lands through vias penetrate from the first surface to the second surface of the insulating substrate, and include signal vias electrically connected the signal connection pads to the signal lands, power-supply vias electrically connected the power-supply connection pads to the power-supply lands and ground vias electrically connected the ground connection pads to the ground lands. At least one of the signal vias are closer to the connection pads than immediately adjacent one of the power-supply vias or the ground vias.
摘要:
A semiconductor device includes a power-supply control portion and a latch portion. The power-supply control portion supplies power to an internal circuit in response to an input signal synchronized with rising of clock. The latch portion latches the input signal in synchronization with falling of the clock and supplies the latched input signal to the internal circuit.
摘要:
In order to achieve the reduction of contact resistance by forming a metal silicide layer with a sufficient thickness in an interface between a polycrystalline silicon plug and an upper conductive plug, the polycrystalline silicon plug contains germanium, which is ion-implanted before forming the metal silicide layer.
摘要:
A semiconductor device includes an output circuit having a plurality of unit buffer circuits, an impedance of each unit buffer circuit of the plurality of unit buffer circuits being adjustable, a control circuit configured to selectively activate one or more unit buffer circuits of the plurality of unit buffer circuits, and an impedance adjustment unit configured to adjust the impedance of each of the unit buffer circuits of the plurality of unit buffer circuits. The impedance adjustment unit includes a first power line, a replica circuit, and a load current generation circuit. The replica circuit and the load current generation circuit are coupled in common to the first power line, the replica circuit has a replica impedance that is substantially equal to the impedance of the output circuit, and the load current generation circuit changes current flowing therethrough.
摘要:
A control device that comprises a first data strobe input terminal to be connected in common to data strobe terminals that are included respectively in first memory devices, and a plurality of first sub-units each coupled to the first data strobe input terminal and each holding a data strobe delay value corresponding to an associated one of the first memory devices, and the data strobe delay values of the sub-units being independent from each other.
摘要:
Disclosed herein is a device that includes: first and second memory cell arrays arranged in a first direction; a plurality of first bump electrodes disposed between the first and second memory cell arrays and arranged in line in a second direction crossing the first direction; a plurality of second bump electrodes disposed between the first bump electrodes and the second memory cell arrays and arranged in line in the second direction; a first area being between the first and second bump electrodes; a plurality of third bump electrodes disposed in the first area; and a first capacitor formed in the third area.
摘要:
A semiconductor device includes a semiconductor substrate, a gate electrode, a dummy gate electrode, and a first impurity diffusion region. The semiconductor substrate has first and second grooves. The gate electrode is in the first groove. The dummy gate electrode is in the second groove. The dummy gate electrode has a first top surface. The first impurity diffusion region in the semiconductor substrate is positioned between the first and second grooves. The first top surface is positioned at a lower level than a bottom of the first impurity diffusion region.