公开(公告)号：US20220348011A1

公开(公告)日：2022-11-03

申请号：US17725997

申请日：2022-04-21

申请人： CANON KABUSHIKI KAISHA

发明人： Yohei Hamade ,  Isao Imamura ,  Sachiko Yamauchi ,  Songhee Kim

IPC分类号： B41J2/14 ,  C09J163/10 ,  C09J11/04 ,  C09D11/30 ,  C09D11/03 ,  C09J11/08

摘要： An ink jet recording head that includes a substrate having an ejection orifice for ejecting a liquid and a member provided with a recessed portion for accommodating the substrate, the head including a gap formed between a wall of the recessed portion of the member and the substrate, and a sealing material that seals the gap, in which the sealing material contains a cured product of a composition containing at least a hydrogenated bisphenol A type epoxy resin, a solid basic compound, and polythiol.

公开(公告)号：US11079635B2

公开(公告)日：2021-08-03

申请号：US16034877

申请日：2018-07-13

申请人： BOE Technology Group Co., Ltd. ,  Hefei BOE Display Technology Co., Ltd.

发明人： Dong Xu ,  Xiaoqing Liu ,  Wenbo Dong

IPC分类号： G02F1/1339 ,  C09J163/10 ,  C08G59/40 ,  C08G59/62

摘要： The disclosure discloses a sealant and a method for fabricating the same, and a display device. The sealant includes a thermal-curing agent and an epoxy resin, wherein the thermal-curing agent includes a diphenyl ketone alcohol compound capable of emitting a fluorescent light and a phosphorescent light simultaneously.

公开(公告)号：US20190194502A1

公开(公告)日：2019-06-27

申请号：US16330517

申请日：2017-08-17

申请人： THREEBOND CO., LTD.

发明人： Soichi OTA ,  Hitoshi MAFUNE ,  Makoto KATO ,  Tomoya KODAMA

IPC分类号： C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/10 ,  C09J201/00 ,  H01B1/20

CPC分类号： C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J163/10 ,  C09J201/00 ,  H01B1/00 ,  H01B1/20

摘要： Conventionally, when an adherend is nickel or the like, it has been difficult to realize an electroconductive adhesive that lowers connection resistance in various kinds of thermocurable curing resins. However, it is possible to provide an electroconductive adhesive, in the case where the adherend is nickel or the like, which reduces connection resistance in various kinds of thermocurable curing resins while simultaneously maintaining storage stability to have good handleability. The present description provides a thermocurable electroconductive adhesive including the following components (A) to (D): Component (A): a curable resin, Component (B): a thermal curing agent that cures Component (A), Component (C): an organometallic complex, and Component (D): electroconductive particles.

公开(公告)号：US20190085211A1

公开(公告)日：2019-03-21

申请号：US16189165

申请日：2018-11-13

申请人： DEXERIALS CORPORATION

发明人： Ryosuke ODAKA ,  Daisuke SATO

IPC分类号： C09J4/00 ,  C08F220/32 ,  C09J163/10

摘要： Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent comprising a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C. or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal.

公开(公告)号：US09845413B1

公开(公告)日：2017-12-19

申请号：US15186947

申请日：2016-06-20

申请人： Engineered Bonding Solutions, LLC

发明人： Samuel B. Osae ,  Matt Brandli

IPC分类号： C09J167/06 ,  C08L67/06 ,  C09J4/06 ,  C09J163/10

CPC分类号： C09J4/06 ,  C08F283/01 ,  C08L67/06 ,  C08L2207/53 ,  C09J163/10 ,  C09J167/06

摘要： An adhesive composition may include, but is not limited to: at least one of an alkyl acrylate monomer and a methacrylate monomer; and at least one of a polyester alkyd polymer and a vinyl ester alkyd polymer.

公开(公告)号：US09790398B2

公开(公告)日：2017-10-17

申请号：US14766342

申请日：2014-02-05

申请人： Sika Technology AG

发明人： Neil Carter ,  Ian Martin ,  Alexander Coward ,  Mark Gatrell ,  Michael Byrne ,  John E. Cullen ,  Peter Cormack

IPC分类号： C09D175/04 ,  C09J175/04 ,  C09D175/08 ,  C09J175/08 ,  C09D163/10 ,  C09J163/10 ,  C08G18/76 ,  C08G18/28 ,  C08G18/67 ,  E04B7/00 ,  E04D7/00

CPC分类号： C09D175/04 ,  C08G18/2845 ,  C08G18/6745 ,  C08G18/7671 ,  C09D163/10 ,  C09D175/08 ,  C09J163/10 ,  C09J175/04 ,  C09J175/08 ,  E04B7/00 ,  E04D7/00

摘要： The present application is directed at the reaction product of an azide compound having two or more azide groups attached thereto and an alkyne compound having two or more alkyne groups attached thereto, wherein the azide and alkyne groups react in a 1,3-dipolar cyclo addition to form 1,4-disubstituted triazols and wherein the azide or alkyne compound or both include —O—(C═O)—NR— functional groups. The reaction products can be used as coatings, such as for flat roofs, sealants, adhesives and in elastomer applications. Methods for producing the reaction products as well as substrates including a coating of the reaction product are also disclosed.

公开(公告)号：US09688892B2

公开(公告)日：2017-06-27

申请号：US14804418

申请日：2015-07-21

申请人： Henkel IP & Holding GmbH ,  Ablestik (Shanghai) Ltd.

发明人： Xiaolong Hu ,  Derek Wyatt ,  Jiong England ,  Paul J. Gleeson ,  Renfel He

IPC分类号： C09J163/10 ,  H01L23/29 ,  C08K3/04 ,  C08G59/40 ,  H01L21/56

CPC分类号： C09J163/10 ,  C08G59/40 ,  C08G59/4007 ,  C08K3/04 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00

摘要： The present invention provides a one part liquid underfill composition comprising an epoxy resin, a latent epoxy curing agent, a photocurable resin or monomer, a photoinitiator, an optional filler, and an optional thermal initiator. Also provided is a packaging process using the underfill composition.

公开(公告)号：US09676972B2

公开(公告)日：2017-06-13

申请号：US14386503

申请日：2013-12-20

申请人： BOE TECHNOLOGY GROUP CO., LTD. ,  BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.

发明人： Xiuqiang Zhao ,  Ang Xiao ,  Hao Wu

IPC分类号： C09J133/12 ,  C09J133/08 ,  C09J163/10 ,  G02F1/1339

CPC分类号： C09J133/12 ,  C09J133/08 ,  C09J163/10 ,  G02F1/1339 ,  C08L63/00 ,  C08K3/36 ,  C08K7/18

摘要： A frame sealant composition and a method of preparing the same, a liquid crystal panel containing the frame sealant composition. The frame sealant composition comprises a resin, a catalyst, a solvent, a hydrophobic silica filler, and silicon spheres; wherein, the hydrophobic silica filler has a shape of irregular polyhedron. The optimum of hydrophobic silica particles increases the whole surface area of the silica particles and correspondingly enhances the hydrophobicity of the frame sealant composition. The frame sealant composition further comprises a dispersant, the addition of which makes the silica fillers more evenly distributed in the frame sealant composition and avoids void caused by the uneven distribution. Even distribution of silica fillers in conjunction with an increase of specific surface area functions to enhance the waterproof property of the frame sealant composition, such that the liquid crystal panel sealed with the frame sealant composition can better block external moisture and prevent internal metal wires from corroding.

公开(公告)号：US09657203B2

公开(公告)日：2017-05-23

申请号：US14696611

申请日：2015-04-27

申请人： Henkel IP & Holding GmbH

发明人： James Murray ,  Charles F. Schuft ,  Chih-Min Cheng

IPC分类号： C09J133/12 ,  C09J4/00 ,  C09J163/10 ,  C09J5/06 ,  B32B37/12 ,  C09J163/00 ,  C08K5/08 ,  C08K5/14 ,  C08K5/17 ,  C08K5/50

CPC分类号： C09J133/12 ,  B32B37/12 ,  B32B2037/1269 ,  C08K5/08 ,  C08K5/14 ,  C08K5/17 ,  C08K5/50 ,  C09J4/00 ,  C09J5/06 ,  C09J163/00 ,  C09J163/10 ,  C09J2203/10 ,  C09J2400/20 ,  C09J2433/00 ,  C09J2463/00

摘要： A two part curable composition is provided, where the composition comprises: (a) a first part comprising: (i) a (meth)acrylate component; (ii) 1,4-quinones, such as napthoquinone or benzoquinone and derivatives thereof in an amount less than or equal to about 0.05 weight percent; (iii) triaryl or alkaryl phenylphosphine in an amount greater than or equal to about 0.5 weight percent; and (iv) an amine; and (b) a second part comprising: (i) benzoyl peroxide in an amount greater than about 1.0 weight percent.

公开(公告)号：US09562179B2

公开(公告)日：2017-02-07

申请号：US14868421

申请日：2015-09-29

申请人： Lintec Corporation

发明人： Naoya Saiki ,  Isao Ichikawa ,  Hironori Shizuhata ,  Osamu Yamazaki

IPC分类号： C09J133/08 ,  C09J163/10 ,  C08L33/08 ,  C08L63/10 ,  C08L63/00 ,  C08K5/07 ,  C08K5/103 ,  C08K5/29 ,  C08K5/00 ,  H01L21/683 ,  H01L23/495 ,  H01L23/00

CPC分类号： C09J133/08 ,  C08K5/0025 ,  C08K5/07 ,  C08K5/103 ,  C08K5/29 ,  C08L33/08 ,  C08L63/00 ,  C08L63/10 ,  C08L2205/03 ,  C08L2666/14 ,  C09J163/10 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2461/00 ,  C09J2463/00 ,  H01L21/6836 ,  H01L23/49513 ,  H01L24/27 ,  H01L24/31 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/2809 ,  Y10T428/2813 ,  Y10T428/287 ,  Y10T428/2891 ,  H01L2924/00 ,  H01L2924/3512

摘要： An adhesive composition is described, which includes an acrylic polymer, an epoxy thermosetting resin having an unsaturated hydrocarbon group, and a thermosetting agent. The adhesive composition achieves high reliability in a package in which a semiconductor chip of reduced thickness is mounted even when exposed to severe reflow conditions. An adhesive sheet having an adhesive layer that includes the above adhesive composition is also described.

摘要翻译： 描述了一种粘合剂组合物，其包括丙烯酸类聚合物，具有不饱和烃基的环氧热固性树脂和热固性剂。 粘合剂组合物在即使暴露于严格的回流条件下也安装了厚度减小的半导体芯片的封装中实现了高可靠性。 还描述了具有包括上述粘合剂组合物的粘合剂层的粘合片。