-
公开(公告)号:US20240149337A1
公开(公告)日:2024-05-09
申请号:US18279660
申请日:2022-07-20
Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
Inventor: Tomohiro FUKUURA
CPC classification number: B22F1/18 , C23C18/1639 , C23C18/165 , C23C18/1658 , C23C18/44 , C23C22/02 , B22F2301/255 , B22F2302/256 , B22F2998/10
Abstract: The present invention provides a novel method for producing a structure comprising an assembly of metal-based particles. Provided is a method for producing a layered product, the layered product comprising a substrate having a three-dimensional surface; and a metal-based particle assembly layer arranged on the three-dimensional surface and comprising a plurality of metal-based particles arranged apart from each other, the method comprising the step of forming the metal-based particle assembly layer on the three-dimensional surface by immersing the substrate in a plating solution containing a cation of a metal constituting the metal-based particles to reduce the cation, wherein a VS/VL ratio of volume VS [cm3] of the substrate to volume VL [cm3] of the plating solution is 0.03 or less.
-
公开(公告)号:US11946144B2
公开(公告)日:2024-04-02
申请号:US16753395
申请日:2018-10-03
Applicant: C. Uyemura & Co., Ltd.
Inventor: Tsuyoshi Maeda , Katsuhisa Tanabe , Tomohiro Kawahara
Abstract: An object of the present invention is to provide an electroless Pd plating solution which enables formation of a Pd plating film forming a plating film having excellent wire bondability even after a high-temperature thermal history. An electroless Pd plating solution of the present invention includes: a Palladium compound, a reducing agent, a complexing agent, and at least one selected from a group consisting of Ge and rare earth element.
-
公开(公告)号:US20230243039A1
公开(公告)日:2023-08-03
申请号:US17736106
申请日:2022-05-04
Applicant: EGO 93 s.r.o.
Inventor: Martin Molnár
CPC classification number: C23C18/1879 , C09D5/002 , C23C18/285 , C23C18/44 , C03C17/10 , C03C2217/256 , C03C2218/11 , C03C2218/31
Abstract: A sensitizing solution, especially a sensitizing solution for sensitizing surfaces, containing a solution of tin(II) chloride SnCl2 and distilled water, especially for sensitizing non-conductive surfaces, which further contains glycerine. A method of preparation of the sensitizing solution, especially the method of preparation of the sensitizing solution, according to which the solution of tin(II) chloride SnCl2 and distilled water is mixed with a reducing agent, which is glycerine.
-
公开(公告)号:US11668010B2
公开(公告)日:2023-06-06
申请号:US15354733
申请日:2016-11-17
Applicant: C3Nano Inc.
Inventor: Yongxing Hu , Xiqiang Yang , Ying-Syi Li , Alexander Seung-il Hong , Melanie Mariko Inouye , Yadong Cao , Ajay Virkar
IPC: C23C18/44 , C23C18/54 , C09D133/06 , C23C18/16 , B32B27/20 , B32B9/04 , B32B27/28 , B32B27/08 , B32B15/04 , B32B15/08 , B82Y30/00 , C09D11/52 , C09D101/02 , C09D139/06 , C23C18/42 , H01B1/22 , H01B13/30 , H05K1/02 , H05K1/09 , H05K3/10 , H05K3/12 , B32B15/01 , C09D105/08 , B82Y20/00
CPC classification number: C23C18/44 , B32B9/045 , B32B15/018 , B32B15/04 , B32B15/08 , B32B27/08 , B32B27/20 , B32B27/28 , B82Y30/00 , C09D11/52 , C09D101/02 , C09D133/06 , C09D139/06 , C23C18/1635 , C23C18/1637 , C23C18/42 , C23C18/54 , H01B1/22 , H01B13/30 , H05K1/02 , H05K1/0274 , H05K1/097 , H05K3/10 , H05K3/105 , H05K3/1283 , B32B2255/10 , B32B2255/26 , B32B2262/103 , B32B2262/12 , B32B2307/202 , B32B2307/412 , B32B2307/414 , B32B2457/20 , B82Y20/00 , C09D105/08 , H05K2201/0108 , H05K2201/026 , Y10T428/12444 , Y10T428/12479 , Y10T428/12486 , Y10T428/12889 , Y10T428/12896
Abstract: Metal nanowires with uniform noble metal coatings are described. Two methods, galvanic exchange and direct deposition, are disclosed for the successful formation of the uniform noble metal coatings. Both the galvanic exchange reaction and the direct deposition method benefit from the inclusion of appropriately strong binding ligands to control or mediate the coating process to provide for the formation of a uniform coating. The noble metal coated nanowires are effective for the production of stable transparent conductive films, which may comprise a fused metal nanostructured network.
-
公开(公告)号:US20230095982A1
公开(公告)日:2023-03-30
申请号:US17488453
申请日:2021-09-29
Applicant: Lawrence Livermore National Security, LLC
Inventor: Nikola DUDUKOVIC , Rebecca DYLLA-SPEARS , Megan Elizabeth ELLIS
Abstract: The present disclosure relates to a method for forming a glass structure having a metallized surface portion. The method may comprise forming a structure using a flowable first material, adapted to form a glass, which includes a metal component. The structure is then treated to remove substantially all solvents and organic components contained in the first flowable material. Finally, the structure is exposed to a bath of a metal salt during which nucleation occurs and a metallized surface coating is formed on at least a portion of an outer surface of the structure.
-
公开(公告)号:US11566329B2
公开(公告)日:2023-01-31
申请号:US16768556
申请日:2018-11-30
Applicant: AP & S INTERNATIONAL GMBH
Inventor: Jörg Hildebrand
Abstract: An assembly for electroless metallization of a target surface (11) of at least one workpiece (10), comprising—a container (13) for receiving an electrolyte solution—an inlet for the electrolyte solution, said inlet arranged in the base (15) of the container (13), wherein the inlet (20) is designed as an inlet port (21) with a diffuser plate (24) comprising inlet openings (25) arranged in concentric circles—an outlet (30) which is arranged on an upper side of the container (13)—a receiving area for holding the at least one workpiece (10), wherein the diffuser plate (24) is formed as a first assembly (31) and a second assembly (32), which is identical to the first assembly, of a respective plurality of inlet openings (25), wherein the assemblies at least partially but not completely overlap, and the inlet (20) has at least two inlet ports (21, 22).
-
公开(公告)号:US11492706B2
公开(公告)日:2022-11-08
申请号:US16968981
申请日:2019-02-15
Applicant: C. Uyemura & Co., Ltd.
Inventor: Tetsuya Sasamura , Tatsushi Someya , Katsuhisa Tanabe , Shinsuke Wada , Eriko Furuya
Abstract: An electroless palladium plating liquid containing at least hydrazine or a salt thereof as a reducing agent, which has excellent bath stability in the vicinity of acidity to neutrality range, long-term stability, and is capable of suppressing the Pd film deposition rate decrease caused by elution of etching resist. An electroless palladium plating solution of the invention includes a palladium compound, hydrazine or its salt, at least one selected from a group consisting of a compound represented by the following formula (1) or its salt and a compound represented by the following formula (2) or its salt; and a pH of 8 or less, NH2NHCOR1 (1), (NH2NHCO)2(R2)n (2), wherein R1 represents H, NH2, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, NHNH2, or an aromatic group, wherein each of these groups may have a substituent; R2 represents (CH2) or an aromatic group, wherein each of these groups may have a substituent; and n represents an integer of 0 to 10.
-
公开(公告)号:US20220235468A1
公开(公告)日:2022-07-28
申请号:US17595570
申请日:2020-07-09
Applicant: SHOWA DENKO K.K.
Inventor: Akira FURUYA , Tadaaki KOJIMA , Hiroshi SUZUKI , Fumiaki NAKA
Abstract: A laminate including a metallic base material, a nickel-containing plating film layer formed on the metallic base material, and a gold plating film layer formed on the nickel-containing plating film layer, in which pinholes in the gold plating film layer are sealed with a passive film having a thickness of 15 nm or greater. Also disclosed is a constituent member of a semiconductor production device including the laminate and a method for producing the laminate.
-
公开(公告)号:US20220172867A1
公开(公告)日:2022-06-02
申请号:US17413553
申请日:2019-08-05
Inventor: Soo Dong KIM , Won Kyun CHOE , Sung Hyun JOO , Hong Keon KIM , Hyun Soo KIM
Abstract: Disclosed is an AlNiCo-based hard magnetic particle containing Al, Ni, Co, Cu, Ti, and the balance of Fe. The AlNiCo-based hard magnetic particle contains Co in an amount of 10 to 17 wt %, has a coercive force of 250-450 Oe, and has a residual magnetization/coercive force rate of 0.06 or more. The AlNiCo-based hard magnetic particle according to the present invention can advantageously guarantee magnetic properties suitable for being detected by a magnetic reluctance device due to a low content of Co.
-
公开(公告)号:US11111593B2
公开(公告)日:2021-09-07
申请号:US14995334
申请日:2016-01-14
Applicant: Nanowear Inc.
Inventor: Vijay K. Varadan , Pratyush Rai , Se Chang Oh
IPC: C23C18/44 , C25D5/56 , C23C18/28 , C23C18/20 , C23C18/16 , B82Y15/00 , B82Y30/00 , B82Y40/00 , B82Y99/00
Abstract: A process for the large scale manufacturing of vertically standing hybrid nanometer-scale structures of different geometries, including fractal architecture made of flexible materials, on a flexible substrate including textiles is disclosed. The nanometer-scale structures increase the surface area of the substrate. The nanometer-scale structures may be coated with materials that are sensitive to various physical parameters or chemicals such as but not limited to temperature, humidity, pressure, atmospheric pressure, electromagnetic signals originating from biological or non-biological sources, volatile gases, and pH. The increased surface area achieved through the disclosed process is intended to improve the sensitivity of the sensors formed by coating of the nanometer-scale structure and substrate with a material which can be used to sense physical parameters and chemicals as listed previously. An embodiment with nanometer-scale structures on a textile substrate coated with a conductive, malleable and bio-compatible sensing material for use as a biopotential measurement electrode is provided.
-
-
-
-
-
-
-
-
-