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    Electroplating apparatus
    2.
    发明授权
    Electroplating apparatus 有权

    公开(公告)号：US10047453B2

    公开(公告)日：2018-08-14

    申请号：US14721693

    申请日：2015-05-26

    申请人： APPLIED Materials, Inc.

    发明人： Daniel J. Woodruff ,  Gregory J. Wilson ,  Paul R. McHugh

    IPC分类号： C25D17/18 ,  C25D17/00 ,  C25D21/10

    摘要： An electroplating processor includes a base having a vessel body. A membrane assembly including a membrane housing is attached to a membrane plate. A membrane is provided on a membrane support attached to the membrane housing. An anode assembly includes an anode cup and one or more anodes in the anode cup. An anode plate is attached to the anode cup. Two or more posts on a first side of the anode plate are engageable with post fittings on the membrane plate. Latches on a second side of the anode plate are engageable with and releasable from a latch fitting on the membrane plate. The anode assembly is quickly and easily removable from the processor for maintenance, without disturbing or removing other components of the processor.

    Apparatus for forming an electroplated abrasive tool
    4.
    发明授权
    Apparatus for forming an electroplated abrasive tool 失效
    用于形成电镀磨具的装置

    公开(公告)号：US4082640A

    公开(公告)日：1978-04-04

    申请号：US684005

    申请日：1976-05-07

    申请人： William M. Haack

    发明人： William M. Haack

    IPC分类号： B24D18/00 ,  C25D15/00 ,  C25D17/06 ,  C25D17/18

    CPC分类号： C25D15/00 ,  B24D18/0018

    摘要： An improved abrasive tool useful in grinding and cutting and an improvement method and apparatus for making the same wherein a blank having a metallic working area presenting the required profile configuration of the tool has a multiplicity of closely spaced abrasive particles of predetermined size, uniformly distributed in a layer of substantially single particle thickness over the working area, and held in place by electro-deposited nickel preferably formed in two layers adhered to the working surface and to the sides of the abrasive particles for approximately 1/2 to 2/3 of the height thereof. The upper surface of the particles are free from plating material and project above the surface of the plating material between the particles. In applying the abrasive particles, the blank is supported by a fixture in a container having a cylindrical impervious side wall surrounding the working surface in spaced relation thereto and having a porous mesh base portion beneath the working surface. A mass of abrasive particles is packed in the space between the working surface and side wall enclosure and a nickel plating solution is poured downwardly over the working surface and through the abrasive particles and mesh in the presence of a nickel anode to lightly secure or tack the first layer of nickel plating. The surplus abrasive particles outside of the said first layer are then removed and thereafter further nickel plating is applied to firmly secure the first layer of abrasive particles in place.

    SURFACE TREATING DEVICE
    7.
    发明申请
    SURFACE TREATING DEVICE 审中-公开

    公开(公告)号：US20190301048A1

    公开(公告)日：2019-10-03

    申请号：US16252903

    申请日：2019-01-21

    申请人： C. Uyemura & Co., Ltd.

    发明人： Teruyuki HOTTA ,  Kouji SHIMIZU ,  Masayuki UTSUMI ,  Masato ARATANI

    IPC分类号： C25D17/18 ,  C25D5/04 ,  C25D21/18

    摘要： A rotational surface treating device with a high treatment efficiency that allows a treatment liquid to be discharged in a short time is provided. When a treatment bath 2 is rotated, parts 20 contact an electrode 50 to be electroplated. In this event, a plating liquid 16 is used as circulated by a pump P. The plating liquid 16 is discharged to the outside through a gap in a side wall 80 for replacement of the plating liquid 16 or the like. During discharge, the plating liquid 16 is not circulated by the pump P. The gap 8 which is formed in the side wall 80 is formed to be smaller than the minimum dimension of the parts 20 on the inner side. The gap 8 is formed to be wider toward the outer side. Thus, water is discharged immediately.

    Electroplating method and electroplating apparatus for through-hole
    8.
    发明授权
    Electroplating method and electroplating apparatus for through-hole 有权
    电镀方法和通孔电镀设备

    公开(公告)号：US09297088B2

    公开(公告)日：2016-03-29

    申请号：US13959811

    申请日：2013-08-06

    申请人： EBARA CORPORATION

    发明人： Masashi Shimoyama ,  Yuji Araki ,  Fumio Kuriyama ,  Jumpei Fujikata

    IPC分类号： C25D5/18 ,  C25D5/02 ,  C25D5/20 ,  C25D17/18 ,  C25D21/10 ,  C25D21/12 ,  H01L21/768 ,  H01L21/288 ,  C25D5/10 ,  C25D17/00

    CPC分类号： C25D5/18 ,  C25D5/02 ,  C25D5/10 ,  C25D17/001 ,  C25D21/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76898

    摘要： There is provided an electroplating method for a through-hole. The method includes: a first plating process, a second plating process, and a third plating process. The first plating process is a plating process of forming a metal film with a uniform thickness in the through-hole to reduce a diameter of the through-hole, the second plating process is a plating process of blocking up a central portion of the through-hole with the metal film using a PR pulsed current, and the third plating process is a plating process of completely filling the through-hole with the metal film using the plating current whose value is equal to or larger than a forward-current value of the PR pulsed current used in the second plating process.

    摘要翻译： 提供了一种用于通孔的电镀方法。 该方法包括：第一电镀工艺，第二电镀工艺和第三镀覆工艺。 第一电镀工艺是在通孔中形成均匀厚度的金属膜以减小通孔的直径的电镀工艺，第二电镀工艺是封闭通孔的中心部分的电镀工艺， 使用PR脉冲电流与金属膜形成孔，并且第三电镀工艺是使用等于或大于其的正向电流值的电镀电流，用金属膜完全填充通孔的电镀工艺 PR脉冲电流用于第二电镀工艺。

    Apparatus in electro deposition plants, particularly for use in making master phonograph records
    9.
    发明授权
    Apparatus in electro deposition plants, particularly for use in making master phonograph records 失效
    电沉积设备中的设备，特别用于制作主唱唱机

    公开(公告)号：US4391694A

    公开(公告)日：1983-07-05

    申请号：US347864

    申请日：1982-02-11

    申请人： Bengt W. Runsten

    发明人： Bengt W. Runsten

    IPC分类号： C25D17/00 ,  C25D1/10 ,  C25D17/18 ,  C25D21/06 ,  C25D21/12

    CPC分类号： C25D1/10

    摘要： Apparatus in plants, particularly for use in making master phonograph records and the like.In plants (FIG. 1) for galvanic processing in making master phonograph records, the apparatus in accordance with the invention comprises an arrangement of the receptacle (12) containing anode material (16) such that the electrolyte (2) is constrained (19, 35) to a given extent to flow through the receptacle in a direction from the surrounding liquid in a processing tub (1). The receptacle (12) is connected to an outlet (35) for liquid such that there is always a level (37) of liquid in the receptacle lower than the level thereof in the tub. By means of the liquid flow there is gained that particles which may be liberated from the anode material are not carried over to the object on which electro deposition takes place.

    摘要翻译： 植物中的装置，特别用于制作主唱唱片记录等。 在用于制造主留唱机记录的电加工的装置（图1）中，根据本发明的装置包括容纳阳极材料（16）的容器（12）的布置，使得电解质（2）受到约束 35）在给定的程度上沿着处理桶（1）中的周围液体的方向流过容器。 容器（12）连接到用于液体的出口（35），使得容器中的液体总是高于其在桶中的高度（37）。 通过液体流动，可以从阳极材料中释放的颗粒不会转移到发生电沉积的物体上。

    Method of forming electrical wiring path on insulative substrate
    10.
    发明授权
    Method of forming electrical wiring path on insulative substrate 失效
    在绝缘基板上形成电气布线路径的方法

    公开(公告)号：US4358349A

    公开(公告)日：1982-11-09

    申请号：US233596

    申请日：1981-01-24

    申请人： Takagi Masami ,  Nakayama Shunichi ,  Honda Kazuyoshi

    发明人： Takagi Masami ,  Nakayama Shunichi ,  Honda Kazuyoshi

    IPC分类号： H05K3/18 ,  H05K1/00 ,  H05K1/02 ,  H05K3/10 ,  H05K3/24 ,  H05K3/40 ,  C25D5/00 ,  C25D17/18

    CPC分类号： H05K3/243 ,  H05K3/108 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/0393 ,  H05K2201/09736 ,  H05K2203/0557 ,  H05K2203/0574 ,  H05K2203/0723 ,  H05K2203/0746 ,  H05K2203/085 ,  H05K2203/104 ,  H05K2203/1545 ,  H05K3/181 ,  H05K3/241 ,  H05K3/4007

    摘要： A method of this invention for forming electrical wiring paths on an insulative substrate by means of an electroplating only at necessary portions on the insulative substrate comprises steps of forming on the insulative substrate a plated metal foundation layer which comprises an extremely thin conductive metal layer, closely fitting onto this extremely thin layer a first mask member from which the necessary portions for forming the electrical wiring paths are removed and having a surface to which no plating is applicable, forming a first plated layer of such metal as copper on the extremely thin conductive metal layer over the first mask member, closely fitting onto the first plated layer a second mask member from which some but not all portion of the electrical wiring paths of the first mask member are removed, forming a second plated layer of a second metal on the second mask member, and removing the first and second mask members and thus exposed portions of the extremely thin conductive metal layer, whereby the electrical wiring paths can be formed of a first metal only at the necessary portions on the insulative substrate, so that the amount to be used of such conductive first metal as copper can be reduced and it can be made possible to have a different second metal selectively plated on some but not all of such electrical wiring paths so as to improve environmental durability, to have the same first and second metal plated so as to improve the environmental durability, and to have the same first and second metal plated so as to increase the thickness of such electrical wiring paths and thereby increase the current flowing capacity.

    摘要翻译： PCT No.PCT / JP80 / 00042 Sec。 371日期1981年1月26日 102（e）日期1981年1月26日PCT提交1980年3月13日PCT公布。 出版物WO80 / 02632 日本时间1980年11月27日。一种用于在绝缘基板上仅在绝缘基板上的必要部分上通过电镀在绝缘基板上形成电布线路径的方法包括以下步骤：在绝缘基板上形成电镀金属基底层， 非常薄的导电金属层，紧密地配合到这个极薄的层上，去除用于形成电布线路径的必要部分的第一掩模构件，并且具有不具有电镀的表面，形成第一镀层， 在第一掩模构件上的非常薄的导电金属层上的铜，紧密地配合到第一镀层上的第二掩模构件，第一掩模构件的电路布线路径的一些但不是全部部分从该掩模构件去除，形成第二镀层 在第二掩模构件上的第二金属，并且移除第一和第二掩模构件，从而暴露出e部分 绝缘薄导电金属层，由此电绝缘基板上的必要部分可以由第一金属形成电路径，从而能够减少与铜等导电性的第一金属相同的量，并且可以制成 可能具有在一些但不是全部这样的电路路径上选择性地镀覆的不同的第二金属，从而提高环境耐久性，使得具有相同的第一和第二金属镀以提高环境耐久性，并且具有相同的第一和第 第二金属电镀以增加这种电路径的厚度，从而增加电流流动能力。