公开(公告)号：WO2012087369A1

公开(公告)日：2012-06-28

申请号：PCT/US2011/034371

申请日：2011-04-28

Applicant: MEDTRONIC, INC. ,  RUBEN, David, A. ,  SANDLIN, Michael, S.

Inventor： RUBEN, David, A. ,  SANDLIN, Michael, S.

IPC: H01L21/20

CPC classification number: B32B7/04 ,  B32B17/06 ,  B32B2250/02 ,  B32B2457/00 ,  H01L21/2007 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/16195 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/183 ,  H05K2201/0175 ,  Y10T428/13 ,  Y10T428/24562 ,  Y10T428/265 ,  Y10T428/30 ,  Y10T428/31678

Abstract: A method includes depositing a thin film on a first surface of a first substrate and moving a second surface of a second substrate into contact with the thin film such that the thin film is located between the first and second surfaces. The method further includes generating electromagnetic (EM) radiation of a first wavelength, the first wavelength selected such that the thin film absorbs EM radiation at the first wavelength. Additionally, the method includes directing the EM radiation through one of the first and second substrates and onto a region of the thin film until the first and second substrates are fused in the region.

Abstract translation: 一种方法包括在第一衬底的第一表面上沉积薄膜并使第二衬底的第二表面与薄膜接触，使得薄膜位于第一和第二表面之间。 该方法还包括产生第一波长的电磁（EM）辐射，所述第一波长选择为使得薄膜吸收第一波长的EM辐射。 另外，该方法包括将EM辐射引导通过第一和第二基板中的一个并且到薄膜的区域上，直到第一和第二基板在该区域中熔合。

公开(公告)号：WO2012057871A1

公开(公告)日：2012-05-03

申请号：PCT/US2011/034547

申请日：2011-04-29

Applicant: MEDTRONIC, INC. ,  SCHULHAUSER, Randal, C. ,  GERRISH, Paul, F. ,  MATTES, Michael, F. ,  KALLMEYER, Todd, A. ,  SENARITH, Patrick, P. ,  KLYPE, Per ,  RUBEN, David, A.

Inventor： SCHULHAUSER, Randal, C. ,  GERRISH, Paul, F. ,  MATTES, Michael, F. ,  KALLMEYER, Todd, A. ,  SENARITH, Patrick, P. ,  KLYPE, Per ,  RUBEN, David, A.

IPC: A61B19/00 ,  A61B17/00

CPC classification number: A61B34/20 ,  A61B2017/00703 ,  A61B2034/2048 ,  A61B2034/2051 ,  A61B2034/2055 ,  A61B2034/2072 ,  A61B2090/0818 ,  A61B2090/376

Abstract: A medical system includes a sensor location module, a first module, and a second module. The sensor location module (132) determines a location of a magnetic field sensor (110) within a magnetic field. The first module (160) determines an acceleration of the magnetic field sensor. The second module (138) indicates a modified location of the magnetic field sensor in an image of a medical patient based on the acceleration and one or more previously determined locations.

Abstract translation: 医疗系统包括传感器定位模块，第一模块和第二模块。 传感器位置模块（132）确定磁场中的磁场传感器（110）的位置。 第一模块（160）确定磁场传感器的加速度。 第二模块（138）基于加速度和一个或多个先前确定的位置指示医疗患者的图像中的磁场传感器的修改位置。

公开(公告)号：WO2012057859A1

公开(公告)日：2012-05-03

申请号：PCT/US2011/033990

申请日：2011-04-26

Applicant: MEDTRONIC, INC. ,  DANZL, Ralph B. ,  RUBEN, David, A. ,  SANDLIN, Michael, S.

Inventor： DANZL, Ralph B. ,  RUBEN, David, A. ,  SANDLIN, Michael, S.

IPC: H01L21/18

CPC classification number: H01L21/187 ,  Y10T428/13 ,  Y10T428/24942 ,  Y10T428/31504

Abstract: Techniques are described for directly bonding different substrates together. In some examples, a technique includes placing a first surface of a first substrate in contact with a second surface of a second substrate to directly bond the first substrate to the second substrate at a contact location. The contact location is defined where at least a portion of the first surface of the first substrate contacts at least a portion of the second surface of the second substrate. The technique may also include directing a laser beam on at least a portion of the contact location to strengthen the direct bond between the first substrate and the second substrate. In this manner, a direct bond may be heated with localized laser energy to strengthen the direct bond. Localized laser energy may create a strong direct bond while minimizing thermal defects in regions proximate the direct bond.

Abstract translation: 描述了将不同衬底直接粘合在一起的技术。 在一些示例中，一种技术包括将第一衬底的第一表面与第二衬底的第二表面接触，以在接触位置处将第一衬底直接接合到第二衬底。 限定接触位置，其中第一衬底的第一表面的至少一部分接触第二衬底的第二表面的至少一部分。 该技术还可以包括将激光束引导到接触位置的至少一部分上，以加强第一基底和第二基底之间的直接结合。 以这种方式，可以用局部激光能量加热直接粘合以加强直接键合。 局部激光能量可以产生强直接粘合，同时最小化直接键附近的区域的热缺陷。

公开(公告)号：WO2012057858A1

公开(公告)日：2012-05-03

申请号：PCT/US2011/033986

申请日：2011-04-26

Applicant: MEDTRONIC, INC. ,  O'BRIEN, Richard, J. ,  DAY, John, K. ,  GERRISH, Paul, F. ,  MATTES, Michael, F. ,  RUBEN, David, A. ,  GRIEF, Malcolm, K.

Inventor： O'BRIEN, Richard, J. ,  DAY, John, K. ,  GERRISH, Paul, F. ,  MATTES, Michael, F. ,  RUBEN, David, A. ,  GRIEF, Malcolm, K.

IPC: B81C1/00 ,  A61B5/00

CPC classification number: H01L23/12 ,  A61B5/0031 ,  A61B5/01 ,  A61B5/03 ,  A61B5/11 ,  A61N1/37211 ,  A61N1/3758 ,  B81B2201/0214 ,  B81B2207/012 ,  B81C1/0023 ,  H01L23/58 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15313 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/00

Abstract: A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.

Abstract translation: 医疗装置包括第一基板，第二基板，控制模块和能量存储装置。 第一基板包括第一半导体材料和第一绝缘材料中的至少一个。 第二基板包括第二半导体材料和第二绝缘材料中的至少一个。 第二基板结合到第一基板，使得第一和第二基板在第一和第二基板之间限定封闭的空腔。 控制模块设置在封闭腔内。 控制模块被配置为至少确定患者的生理参数并向患者传递电刺激中的至少一个。 能量存储装置设置在空腔内并被配置为向控制模块供电。

公开(公告)号：WO2002045542A1

公开(公告)日：2002-06-13

申请号：PCT/US2001/048195

申请日：2001-12-07

Applicant: AMERICAN DESIGN GROUP ,  RUBEN, David, A.

Inventor： RUBEN, David, A.

IPC: A45D20/00

CPC classification number: A45D20/122 ,  A45D20/08 ,  A45D20/50

Abstract: A hair dryer assembly provides an additional amount of heat to the air exiting the dryer (2). The assembly includes a hand-held hair dryer (2) and a diffuser (22) attachable to the air outlet end (18) of the hair dryer (2). The diffuser comprises a heating element (28) to add heat directly to a user's hair or to air passing out of the hair dryer (2) and through the diffuser (22). This additional measure of heat is used to facilitate drying and/or styling of hair.

Abstract translation: 吹风机组件向离开干衣机（2）的空气提供额外的热量。 该组件包括手持式吹风机（2）和可连接到吹风机（2）的空气出口端（18）的扩散器（22）。 扩散器包括加热元件（28），以将热量直接加热到使用者的头发或通过吹风机（2）并通过扩散器（22）的空气。 这种额外的热量用于促进头发的干燥和/或造型。

公开(公告)号：WO2012102746A1

公开(公告)日：2012-08-02

申请号：PCT/US2011/034542

申请日：2011-04-29

Applicant: MEDTRONIC, INC ,  MATTES, Michael, F. ,  RUBEN, David, A.

Inventor： MATTES, Michael, F. ,  RUBEN, David, A.

IPC: A61B5/0215 ,  A61N1/05 ,  G01D5/241 ,  G01L9/00

CPC classification number: A61B5/0215 ,  A61B2562/0247 ,  A61B2562/028 ,  A61N1/056 ,  G01L9/0072 ,  G01L9/12 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An implantable capacitive pressure sensor apparatus and method for making such an apparatus includes a first pressure sensor portion and a second pressure sensor portion. The first pressure sensor portion includes a diaphragm electrode connectable to ground (e.g., the diaphragm electrode being positioned in close proximity to the body when implanted therein such that the diaphragm electrode is deformable in response to pressure applied thereto by the body). The second pressure sensor portion includes a signal electrode (e.g., wherein the first pressure sensor portion and the second pressure sensor portion are coupled such that a gap is provided between the diaphragm electrode and the signal electrode) and an insulator material. The signal electrode is provided on and in direct contact with the insulator material to electrically isolate the signal electrode such that parasitic capacitance effects on the signal electrode are reduced.

Abstract translation: 一种用于制造这种装置的可植入电容式压力传感器装置和方法包括第一压力传感器部分和第二压力传感器部分。 第一压力传感器部分包括可连接到地面的隔膜电极（例如，当植入其中时，隔膜电极位于身体附近，使得隔膜电极响应于由身体施加到其上的压力而变形）。 第二压力传感器部分包括信号电极（例如，其中第一压力传感器部分和第二压力传感器部分联接成使得在隔膜电极和信号电极之间设置间隙）和绝缘体材料。 信号电极设置在绝缘体材料上并与绝缘体材料直接接触，以使信号电极电隔离，从而减少对寄生电容对信号电极的影响。

公开(公告)号：WO2008134603A2

公开(公告)日：2008-11-06

申请号：PCT/US2008/061706

申请日：2008-04-28

Applicant: MEDTRONIC, INC. ,  RUBEN, David A.

Inventor： RUBEN, David A.

IPC: A61B5/02

CPC classification number: A61B5/0215 ,  A61B2562/028

Abstract: The present invention is directed to an interconnect for an implantable medical device. The interconnect includes a first conductive layer, a second conductive layer introduced over the first conductive layer, and a third conductive layer introduced over the second conductive layer. One of the first conductive layer, the second conductive layer, and the third conductive layer comprises titanium-niobium (Ti-Nb).

Abstract translation: 本发明涉及用于可植入医疗装置的互连。 互连件包括第一导电层，在第一导电层上引入的第二导电层以及在第二导电层上引入的第三导电层。 第一导电层，第二导电层和第三导电层中的一个包括钛 - 铌（Ti-Nb）。

公开(公告)号：WO2007079340A1

公开(公告)日：2007-07-12

申请号：PCT/US2006/062082

申请日：2006-12-14

Applicant: MEDTRONIC, INC. ,  SCHUGT, Michael A. ,  MOTHILAL, Kamal Deep ,  LARSON, Lary R. ,  MATTES, Michael F. ,  RUBEN, David A.

Inventor： SCHUGT, Michael A. ,  MOTHILAL, Kamal Deep ,  LARSON, Lary R. ,  MATTES, Michael F. ,  RUBEN, David A.

IPC: A61B5/0215 ,  A61N1/05

CPC classification number: A61N1/056 ,  A61B5/0215 ,  B81B3/0072 ,  B81C2201/0167 ,  H01L21/4857 ,  H05K1/0271 ,  H05K3/4061 ,  H05K3/4092

Abstract: Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.

Abstract translation: 公开了用于传感器模块的介质曝光互连。 换能器可以是感测换能器，致动换能器，仅IC元件的换能器，或其组合，或其他合适的换能器。 换能器可以与可植入医疗装置结合使用，并且可以暴露于各种介质，例如体液。 用于换能器模块的介质暴露互连可以允许换能器与诸如可植入医疗装置的其它部件电气通信。

公开(公告)号：WO2015153187A1

公开(公告)日：2015-10-08

申请号：PCT/US2015/022188

申请日：2015-03-24

Applicant: MEDTRONIC, INC. ,  FENNER, Andreas ,  RUBEN, David, A. ,  MALIN, Anna, J. ,  GERRISH, Paul, F. ,  FLEISCHHAUER, Bruce, C. ,  TYLER, Larry, E.

Inventor： FENNER, Andreas ,  RUBEN, David, A. ,  MALIN, Anna, J. ,  GERRISH, Paul, F. ,  FLEISCHHAUER, Bruce, C. ,  TYLER, Larry, E.

IPC: G21H1/06

CPC classification number: G21H1/02 ,  G21C19/07 ,  G21H1/04 ,  G21H1/06 ,  Y10T29/49117

Abstract: Various embodiments of a nuclear radiation particle power converter and method of forming such power converter (10) are disclosed. In one or more embodiments, the power converter can include first and second electrodes, a three-dimensional current collector disposed between the first (12) and second (20) electrodes and electrically coupled to the first electrode, and a charge carrier separator (40) disposed on at least a portion of a surface of the three-dimensional current collector (30). The power converter can also include a hole conductor layer (50) disposed on at least a portion of the charge carrier separator and electrically coupled to the second electrode, and nuclear radiation-emitting material (60) disposed such that at least one nuclear radiation particle emitted by the nuclear radiation- emitting material is incident upon the charge carrier separator.

Abstract translation: 公开了核辐射粒子功率转换器的各种实施例和形成这种功率转换器（10）的方法。 在一个或多个实施例中，功率转换器可以包括第一和第二电极，设置在第一（12）和第二（20）电极之间并电耦合到第一电极的三维集电器，以及电荷载流子分离器 ）设置在所述三维集电体（30）的表面的至少一部分上。 功率转换器还可以包括设置在电荷载体分离器的至少一部分上并电耦合到第二电极的空穴导体层（50），以及核辐射发射材料（60），其被设置成使得至少一个核辐射粒子 由核辐射发射材料发射的物质入射到电荷载体分离器上。

公开(公告)号：WO2011139862A3

公开(公告)日：2012-04-26

申请号：PCT/US2011034399

申请日：2011-04-28

Applicant: MEDTRONIC INC ,  RUBEN DAVID A ,  MATTES MICHAEL F ,  SMITH JONATHAN R

Inventor： RUBEN DAVID A ,  MATTES MICHAEL F ,  SMITH JONATHAN R

IPC: H01L21/60 ,  A61B5/00 ,  A61N1/375 ,  H01L21/768 ,  H01L21/98 ,  H01L23/00

CPC classification number: H01L24/81 ,  A61B5/00 ,  A61B5/0402 ,  A61N1/375 ,  H01L21/76898 ,  H01L23/564 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/80 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05111 ,  H01L2224/05567 ,  H01L2224/05644 ,  H01L2224/05666 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/13007 ,  H01L2224/13016 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/16111 ,  H01L2224/29111 ,  H01L2224/80896 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83194 ,  H01L2224/83801 ,  H01L2224/83894 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/9205 ,  H01L2224/9212 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/80 ,  H01L2224/81 ,  H01L2924/01028 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/80001 ,  H01L2924/00012

Abstract: An implantable medical device (IMD) is disclosed. The !MD includes a first substrate having a front side and a backside. A first via is formed in the front side, the via extending from a bottom point in the front side to a first height located at a surface of the front side. A first conductive pad is formed in the first via, the first conductive pad having an exposed top surface lower than first height. A second substrate is coupled to the first substrate, the second substrate having a second via formed in the front side, the via extending from a bottom point in the front side to a second height located at a surface of the front side. A second conductive pad is formed in the second via, the second conductive pad having an exposed top surface lower than second height. The coupled substrates are heated until a portion of one or both conductive pads refiow, dewet, agglomerate, and merge to form an interconnect, hermetic seal, or both depending on the requirements of the device.

Abstract translation: 公开了可植入医疗装置（IMD）。 该MD包括具有前侧和后侧的第一基板。 第一通孔形成在前侧，通孔从前侧的底点延伸到位于前侧表面的第一高度。 第一导电焊盘形成在第一通孔中，第一导电焊盘具有低于第一高度的暴露的顶表面。 第二基板耦合到第一基板，第二基板具有形成在前侧的第二通孔，通孔从前侧的底点延伸到位于前侧表面的第二高度。 第二导电焊盘形成在第二通孔中，第二导电焊盘具有低于第二高度的暴露的顶表面。 耦合的衬底被加热直到根据器件的要求，一个或两个导电焊盘的一部分或者两个导电焊盘的一部分被反射，脱湿，聚集和合并以形成互连，气密密封或两者。