公开(公告)号：EP3172282A4

公开(公告)日：2018-03-14

申请号：EP15824029

申请日：2015-07-21

Applicant: HENKEL IP & HOLDING GMBH

Inventor： HUANG TIANJIAN ,  THOMPSON KRISTINA ,  WASKI DANIEL ,  GETTY KRIS

IPC: C09D5/02 ,  C09D201/00 ,  C09J5/06 ,  C09J11/08 ,  C09J201/00

CPC classification number: C09D5/024 ,  B65D65/42 ,  B65D81/3888 ,  C09D5/02 ,  C09D201/00 ,  C09J201/00 ,  C09D131/04 ,  C08K7/22

Abstract: The present invention is directed to impact resistant and/or thermally insulative coating compositions for protective packages. Particularly, the protective packages include envelopes, pillows and Gusseted bags that house fragile and/or perishable objects during transport or mailing. The coating composition, upon heat or radiation trigger, expands at least 2500% in volume. The protective packages coated with the coating composition provide impact resistance, high strength, thermal insulation and light-weighting.

公开(公告)号：EP3275956A1

公开(公告)日：2018-01-31

申请号：EP16772152.1

申请日：2016-03-09

Applicant: Toray Industries, Inc.

Inventor： SHINBA, Yoichi

IPC: C09J7/00 ,  C09J5/00 ,  C09J11/04 ,  C09J201/00 ,  H01L21/52 ,  H01L23/36

CPC classification number: C09J7/00 ,  C09J5/00 ,  C09J7/10 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  C09J2201/12 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  C09J2479/08 ,  H01L21/52 ,  H01L23/36

Abstract: Provided is an adhesive composition sheet containing an organic compound and inorganic particles, the adhesive composition sheet including a structure obtained by stacking a layer A that contains at least an organic compound and a layer B that contains an organic compound and inorganic particles, the layer A having a content rate of the organic compound larger than the content rate of the organic compound in the layer B, and the layer A and/or the layer B containing anisotropically shaped inorganic particles. The present invention provides an adhesive composition sheet excellent in thermal conductivity and insulating properties after cured.

Abstract translation: 本发明提供一种粘合剂组合物片，其含有有机化合物和无机粒子，该粘合剂组合物片包含将至少含有有机化合物的层A和含有有机化合物和无机粒子的层B层叠而成的结构体，A层 所述有机化合物的含有率比所述B层中的所述有机化合物的含有率大，所述A层和/或所述B层含有各向异性形状的无机粒子。 本发明提供固化后的导热性和绝缘性优异的粘合剂组合物片。

公开(公告)号：EP3190163A1

公开(公告)日：2017-07-12

申请号：EP16204321.0

申请日：2016-12-15

Applicant: certoplast Technische Klebebänder GmbH

Inventor： Leermann, Timo ,  Rambusch, Peter

IPC: C09J7/04 ,  D03D3/00 ,  D03D15/00 ,  H02G3/04

CPC classification number: D02G3/26 ,  C09J7/21 ,  C09J7/255 ,  C09J201/00 ,  C09J2203/302 ,  C09J2400/263 ,  C09J2467/006 ,  D03D3/005 ,  D03D15/0077 ,  D03D15/0094 ,  D06N3/0006 ,  D06N3/042 ,  D06N2201/02 ,  D06N2203/041 ,  D10B2331/04 ,  H02G3/0481

Abstract: Die Erfindung betrifft ein Klebeband, insbesondere Wickelband zur Ummantelung von Kabeln in Automobilen, mit einem bandförmigen Gewebeträger (1) aus materialgleichen Kettfäden (2) und Schussfäden (3), und mit einer wenigstens einseitigen Klebebeschichtung (4), wobei die Fadenstärke der jeweiligen Schussfäden (3) größer oder gleich der Fadenstärke der jeweiligen Kettfäden (2) ist, und wobei die auf die Breite bezogene Fadenstärke der Kettfäden (2) kleiner oder gleich der auf die Länge bezogenen Fadenstärke der Schussfäden (3) ist. Die Schussfäden (3) sind jeweils mit mehr als 180 Drehungen pro Meter Schussfaden (3), insbesondere mit mehr als 200 Drehungen pro Meter Schussfaden (3) gezwirnt.

Abstract translation: 本发明涉及一种胶带，在用于汽车外装电缆的特殊卷绕磁带，包括一带状组织支架（1）的材料的相同经纱（2）和纬纱（3），并具有至少单面粘合涂层（4），相应的纬纱的纱线强度 （3）大于或等于各自的经纱（2）的纱线的强度，并且其中，与所述经线的纱线粗细的宽度（2）小于或等于与所述纬纱的纱线粗细的长度（3）。 每米纬纱分别设置在纬纱（3）与每根纱线（3）米纬纱超过180匝，特别是超过200匝（3）扭曲。

公开(公告)号：EP3187560A1

公开(公告)日：2017-07-05

申请号：EP15837005.6

申请日：2015-08-10

Applicant: Furukawa Electric Co. Ltd.

Inventor： AOYAMA, Masami ,  KIRIKAE, Noriyuki

IPC: C09J201/00 ,  C09J7/02 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  H01L21/301 ,  H01L21/52 ,  H01L21/60

CPC classification number: C09J9/02 ,  C09J7/30 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J179/08 ,  C09J179/085 ,  C09J201/00 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2400/163 ,  C09J2479/08 ,  H01L21/52 ,  H01L21/6836 ,  H01L21/78

Abstract: A conductive adhesive that does not contain toxic substances such as solder (lead) and shows excellent adhesiveness is provided.
Specifically, it is a conductive adhesive composition, which comprises
(A) a thermosetting resin;
(C) a filler that contains a metal element; and
(D) at least one catalyst or curing agent,
wherein the reaction initiation temperature for the (A) thermosetting resin and the (D) at least one catalyst or curing agent is 180°C or higher.
More preferably, the reaction initiation temperature is 200°C or higher.
More preferably, it is a conductive adhesive composition that further comprises (B) a flux and (E) a polymer component.

Abstract translation: 提供不含有焊剂（铅）等有害物质且显示优异的粘附性的导电性粘接剂。 具体而言，是导电性粘接剂组合物，其含有（A）热固性树脂， （C）含有金属元素的填料; 和（D）至少一种催化剂或固化剂，其中（A）热固性树脂和（D）至少一种催化剂或固化剂的反应起始温度为180℃或更高。 更优选地，反应起始温度为200℃或更高。 更优选地，它是进一步包含（B）助熔剂和（E）聚合物组分的导电粘合剂组合物。

公开(公告)号：EP3165583A4

公开(公告)日：2017-07-05

申请号：EP15814156

申请日：2015-03-03

Applicant: FUJIKURA LTD

Inventor： KUMETA SHOHEI ,  YOSHINO GENTO ,  KASAI YOHEI ,  SAKAMOTO AKIRA

IPC: C09J5/02 ,  B29C65/16 ,  B32B15/04 ,  C03C27/04 ,  C09J201/00

CPC classification number: B32B15/04 ,  B32B7/12 ,  B32B37/12 ,  B32B38/0008 ,  B32B2307/412 ,  C03C27/048 ,  C09J5/02 ,  C09J201/00 ,  C09J2205/31 ,  C09J2400/163 ,  C09J2400/166

公开(公告)号：EP3163607A1

公开(公告)日：2017-05-03

申请号：EP15812648

申请日：2015-06-22

Applicant: TOPPAN PRINTING CO LTD

Inventor： KOBAYASHI AKANE ,  AKUTAGAWA YOSHITO

IPC: H01L23/12 ,  C09J201/00 ,  H05K3/00

CPC classification number: H01L23/49838 ,  C09J7/0264 ,  C09J7/22 ,  C09J201/00 ,  C09J2203/326 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/12 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L2221/68331 ,  H01L2221/68359 ,  H01L2221/68386 ,  H01L2224/1146 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13644 ,  H01L2224/16104 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29387 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81143 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81395 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/83005 ,  H01L2224/83104 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K3/00 ,  H01L2924/00012 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/01322 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2221/68304 ,  H01L21/56 ,  H01L2221/68381

Abstract: A wiring substrate 11 used for improvement in manufacturing efficiency of a semiconductor device includes a support body 12 having transparency; an adhesive layer 13 disposed on a main surface 12a of the support body 12, the adhesive layer 13 including a peeling layer 41 which contains a third resin which is decomposed by light irradiation and a protective layer 42 which is disposed on the peeling layer 41 and contains a fourth resin; and a laminate 21 disposed on the adhesive layer 13, the laminate 21 including a first resin layer 14, a second resin layer 19 disposed on the first resin layer 14, and a wiring pattern 18 disposed at least between the first resin layer 14 and the second resin layer 19. Accordingly, the semiconductor chip 22 and the wiring substrate 11 which is the external connection member can be separately manufactured, thereby improving manufacturing efficiency of the semiconductor device 1.

Abstract translation: 用于提高半导体器件制造效率的布线基板11包括具有透明性的支撑体12; 设置在支撑体12的主表面12a上的粘合层13，粘合层13包括剥离层41和保护层42，剥离层41包含通过光照射而分解的第三树脂，保护层42设置在剥离层41上并且 含有第四树脂; 以及设置在粘合层13上的层压体21，层压体21包括第一树脂层14，设置在第一树脂层14上的第二树脂层19和布置在第一树脂层14和 第二树脂层19.因此，半导体芯片22和作为外部连接部件的布线基板11可以分开制造，由此提高了半导体器件1的制造效率。

公开(公告)号：EP3057162A4

公开(公告)日：2017-03-01

申请号：EP14853018

申请日：2014-10-08

Applicant: NITTO DENKO CORP

Inventor： NAKANO TAKESHI ,  SATO TSUKASA ,  MASAKI TOSHIAKI ,  NISHII HIROYUKI ,  MATSUMURA TAKESHI ,  ARIMITSU YUKIO

IPC: H01M8/02 ,  C09J5/00 ,  C09J7/02 ,  C09J11/00 ,  C09J201/00 ,  H01M8/10 ,  H01M8/1004 ,  H01M8/1018 ,  H01M8/1023 ,  H01M8/1039

CPC classification number: H01M8/1004 ,  C09J7/0207 ,  C09J7/38 ,  C09J201/00 ,  C09J2203/33 ,  C09J2205/11 ,  C09J2205/302 ,  C09J2421/00 ,  C09J2423/006 ,  C09J2433/00 ,  H01M8/1023 ,  H01M8/1039 ,  H01M2008/1095 ,  Y02P70/56

Abstract: Provided is a pressure-sensitive adhesive sheet for conveying an electrolyte membrane capable of contributing to improving a handling property at the time of conveyance of a polymer electrolyte membrane, and to preventing deformation of the polymer electrolyte membrane and preventing the occurrence of a wrinkle therein during processing of a membrane electrode assembly (MEA). The pressure-sensitive adhesive sheet for conveying an electrolyte membrane of the present invention includes: a base material; and a pressure-sensitive adhesive layer arranged on one surface or each of both surfaces of the base material, in which the pressure-sensitive adhesive layer has a pressure-sensitive adhesive strength which lowers or disappears through an external stimulus. In one embodiment, the pressure-sensitive adhesive layer contains thermally expandable microspheres.

公开(公告)号：EP3133132A1

公开(公告)日：2017-02-22

申请号：EP15779569.1

申请日：2015-04-03

Applicant: Dai Nippon Printing Co., Ltd.

Inventor： HOSHI Kentaro ,  TANIGUCHI Takahisa ,  TACHIKAWA Tomoyuki

IPC: C09J5/00 ,  C09D7/12 ,  C09D163/00 ,  C09J5/02 ,  C09J7/00 ,  C09J11/06 ,  C09J201/00 ,  E04G23/02

CPC classification number: C09D7/40 ,  B29C35/0805 ,  B29C35/0866 ,  B29C73/10 ,  B29C2035/0833 ,  B29C2035/0872 ,  B29K2063/00 ,  B29K2105/0097 ,  B29K2105/0809 ,  B29L2031/776 ,  C09D5/002 ,  C09D163/00 ,  C09J5/00 ,  C09J5/02 ,  C09J7/00 ,  C09J11/06 ,  C09J163/00 ,  C09J201/00 ,  C09J2205/31 ,  C09J2453/00 ,  C09J2463/00 ,  C09J2463/008 ,  E04G23/02

Abstract: There is provided a method for repairing or reinforcing a structure. The method includes the steps of: providing an adhesive sheet comprising an adhesive layer comprising at least a curable resin composition whose curing is promoted by irradiation with ionizing radiation and a curing aid which generates a basic substance by irradiation with ionizing radiation; attaching the adhesive sheet to a surface of the structure; and curing the adhesive layer of the adhesive sheet in a state where the adhesive layer is exposed.

Abstract translation: 提供了一种用于修复或加强的结构的方法。 该方法包括如下步骤：在粘合片提供粘合层包括至少一种可固化树脂组合物是谁的固化是通过电离放射线照射和固化助剂，其基因率通过电离辐射照射中的碱性物质促进; 附着粘合片的结构的表面上; 和固化所述粘合片在所述粘合剂层露出的状态的粘接剂层。

公开(公告)号：EP3127980A1

公开(公告)日：2017-02-08

申请号：EP15773563.0

申请日：2015-04-02

Applicant: LINTEC Corporation

Inventor： KATO, Kiichiro ,  UEMURA, Kazue ,  AMINO, Yumiko ,  SAITO, Shigeru ,  MATSUSHIMA, Masaru

IPC: C09J7/02 ,  C09J11/04 ,  C09J11/06 ,  C09J133/00

CPC classification number: C09J7/383 ,  B05D1/36 ,  B05D3/108 ,  B05D5/00 ,  C08K3/013 ,  C08K3/34 ,  C08K3/346 ,  C08K3/36 ,  C08K7/00 ,  C08K2201/003 ,  C09J5/00 ,  C09J7/02 ,  C09J7/0207 ,  C09J7/0217 ,  C09J7/0253 ,  C09J7/026 ,  C09J7/0285 ,  C09J7/10 ,  C09J7/20 ,  C09J7/203 ,  C09J7/22 ,  C09J7/255 ,  C09J7/38 ,  C09J7/385 ,  C09J11/04 ,  C09J121/00 ,  C09J133/08 ,  C09J167/00 ,  C09J175/04 ,  C09J201/00 ,  C09J2201/16 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2205/10 ,  C09J2205/102 ,  C09J2205/114 ,  C09J2400/163 ,  C09J2421/00 ,  C09J2433/00 ,  C09J2467/006 ,  C09J2475/00 ,  C09J2483/005 ,  C08K3/00

Abstract: A pressure sensitive adhesive sheet containing, on a substrate or a release material, a resin layer, at least a surface (α) of the resin layer being opposite to the side of the substrate or being opposite to the side which the release material is provided, having pressure sensitive adhesiveness, the surface (α) having one or more concave portions, the concave portions having irregular shapes. The pressure sensitive adhesive sheet has an excellent air escape property capable of easily removing air accumulation that may be formed on attaching to an adherend, and is excellent in pressure sensitive adhesion characteristics.

Abstract translation: 一种压敏粘合剂片，其在基材或剥离材料上包含树脂层，所述树脂层的至少一个表面（α）与所述基材的侧面相反或与所述剥离材料所提供的侧面相反 具有压敏粘合性，所述表面（α）具有一个或多个凹部，所述凹部具有不规则形状。 该压敏粘合剂片具有优异的空气逸出性能，其能够容易地去除在粘附到被粘物上时可能形成的空气积聚，并且压敏粘合特性优异。

公开(公告)号：EP3121237A1

公开(公告)日：2017-01-25

申请号：EP15764663.9

申请日：2015-02-13

Applicant: Dexerials Corporation

Inventor： NAMIKI, Hidetsugu ,  KANISAWA, Shiyuki ,  ISHIGAMI, Akira ,  AOKI, Masaharu

IPC: C09J201/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/00 ,  H01B1/22 ,  H01B5/16 ,  H01L21/60 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34

CPC classification number: C09J9/02 ,  C08K3/22 ,  C08K7/16 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/2241 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0272 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/05341 ,  H01L2924/05432

Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles (31) each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles (32) having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles (31) solder particles (32) and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles (32) during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

Abstract translation: 提供可获得优异的光学特性和散热特性的各向异性导电粘合剂。 各向异性导电粘合剂含有导电粒子（31），每个导电粒子包含在树脂粒子的最表面上形成的Ag作为主要成分的金属层，平均粒径小于导电粒子的焊料粒子（32），反射绝缘粒子 具有比焊料颗粒更小的平均粒径和分散导电粒子（31）焊料颗粒（32）和反射绝缘颗粒的粘合剂。 导电颗粒和反射绝缘颗粒有效地反射光，从而提高LED安装体的光提取效率。 此外，焊接粒子（32）在压接期间的端子间焊接增加了相对端子之间的接触面积，从而能够实现高的散热特性。