公开(公告)号：EP3301082A1

公开(公告)日：2018-04-04

申请号：EP16191691.1

申请日：2016-09-30

Applicant: Infineon Technologies AG

Inventor： Roth, Alexander

IPC: C04B37/02

CPC classification number: C04B37/026 ,  C04B37/02 ,  C04B37/021 ,  C04B2235/6567 ,  C04B2235/6584 ,  C04B2235/6586 ,  C04B2237/12 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/70 ,  C04B2237/86 ,  H05K1/0263 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/28 ,  H05K3/38 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2203/1121

Abstract: The invention relates to a method for producing a metal-ceramic substrate (1, 11, 12), in which at least one metal layer (3) is attached to at least one surface side of a ceramic layer (2), which metal layer (3) is structured into several metallization regions (5, 6) respectively separated from one another by at least one trench-shaped intermediate space (4) to form conductive paths and/or connective surfaces and/or contact surfaces, wherein at least the intermediate space (4) is filled with an electrically insulating filler material (7). First edges (8) of the metallization regions (5, 6) facing and adjoining the surface side of the ceramic layer (2) in the intermediate space (4), as well as at least one second edge (9) of the metallization regions (5, 6) facing away from the surface side of the ceramic layer (2) in the intermediate space (4), are covered by the filler material (7).
Furthermore, the invention relates to an associated metal-ceramic substrate (1, 11, 12).

Abstract translation: 本发明涉及一种用于制造金属陶瓷基底（1,11,12）的方法，其中至少一个金属层（3）附着到陶瓷层（2）的至少一个表面侧，该金属层 （3）被构造成分别通过至少一个沟槽形中间空间（4）彼此分开以形成导电路径和/或连接表面和/或接触表面的多个金属化区域（5,6），其中至少所述 中间空间（4）填充有电绝缘填充材料（7）。 在中间空间（4）中面向和邻接陶瓷层（2）的表面侧的金属化区域（5,6）的第一边缘（8）以及金属化区域的至少一个第二边缘（9） 在所述中间空间（4）中背向所述陶瓷层（2）的表面侧的所述填充材料（5,6）被所述填充材料（7）覆盖。 此外，本发明涉及相关的金属陶瓷基底（1,11,12）。

公开(公告)号：EP3155880A1

公开(公告)日：2017-04-19

申请号：EP15727807.8

申请日：2015-05-26

Applicant: 3M Innovative Properties Company

Inventor： PALANISWAMY, Ravi ,  NARAG, Alejandro Aldrin II Agcaoili ,  FOO, Siang Sin ,  KOSUGI, Hiromitsu

IPC: H05K1/03 ,  B32B15/08 ,  H05K1/18 ,  H05K3/28

CPC classification number: H01L33/62 ,  B32B7/12 ,  B32B15/08 ,  B32B27/281 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2307/202 ,  B32B2457/202 ,  H01L33/486 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066 ,  H05K1/0306 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/189 ,  H05K3/28 ,  H05K2201/0154 ,  H05K2201/017 ,  H05K2201/0179 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2201/10106

Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

Abstract translation: 描述了柔性LED组件（300）。 更具体地，具有位于衬底上或衬底中的具有导电特征（304,306）的柔性衬底（302）的柔性LED（320）组件和位于衬底的暴露部分上以防止UV降解的陶瓷层（310） 以及制作这种组装的方法。

公开(公告)号：EP1827067B1

公开(公告)日：2016-09-21

申请号：EP06255669.1

申请日：2006-11-03

Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.

Inventor： Cohn, Charles

IPC: H05K1/11 ,  H05K3/24 ,  H01L23/498 ,  H05K3/40

CPC classification number: H05K1/111 ,  H01L23/49811 ,  H01L23/4985 ,  H01L2224/16225 ,  H05K1/0204 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/064 ,  H05K3/202 ,  H05K3/243 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0376 ,  H05K2201/09881 ,  H05K2201/10674 ,  H05K2203/016 ,  H05K2203/0376 ,  Y02P70/611

公开(公告)号：EP2632237A4

公开(公告)日：2015-03-18

申请号：EP12817081

申请日：2012-05-16

Applicant: NGK SPARK PLUG CO

Inventor： ITO TATSUYA ,  MORI SEIJI ,  HAYASHI TAKAHIRO ,  WAKAZONO MAKOTO ,  NISHIDA TOMOHIRO

IPC: H05K3/34 ,  H05K3/28

CPC classification number: H05K1/0213 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/4007 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2201/099 ,  H05K2201/09918 ,  Y02P70/611 ,  H01L2924/00

Abstract: A wiring substrate according to the present invention includes a laminate of one or more insulation layers and one or more conductive layers and further includes a plurality of connection terminals formed on the laminate and spaced apart from one another, each having a step formed at the outer periphery of a first main surface opposite a contact surface in contact with the laminate, and a filling member provided in a filling manner between the convection terminals.

公开(公告)号：EP2784807A1

公开(公告)日：2014-10-01

申请号：EP13824470.2

申请日：2013-05-27

Applicant: NGK Spark Plug Co., Ltd.

Inventor： HAYASHI, Takahiro ,  NAGAI, Makoto ,  ITO, Tatsuya ,  MORI, Seiji ,  WAKAZONO, Makoto ,  NISHIDA, Tomohiro

IPC: H01L23/12 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K3/4007 ,  H01L21/4846 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/81 ,  H01L2224/10175 ,  H01L2224/1134 ,  H01L2224/1146 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/8114 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2224/81815 ,  H01L2924/12042 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K1/0298 ,  H05K1/0366 ,  H05K3/28 ,  H05K3/3452 ,  H05K3/4661 ,  H05K3/4688 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2201/10674 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00

Abstract: To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate 31 that configures this wiring board 10 includes multiple connection terminal portions 41 and wiring conductors 62 as a conductor layer 24 of the outermost layer. The wiring conductors 62 are arranged at predetermined positions, passing through between multiple connection terminal portions 41 for flip-chip mounting a semiconductor chip 51. A resin insulating layer 23 of the outermost layer of the laminate has a dam portion 63 and a reinforcement portion 64. The dam portion 63 covers the wiring conductors 62. The reinforcement portion 64 is formed, between the wiring conductor 62 and the connection terminal portion 41 that is adjacent to the wiring conductor 62, lower than a height H3 of the dam portion 63. The reinforcement portion 64 is concatenated with a side surface of the dam portion 63.

Abstract translation: 为了提供布线基板，其中布线导体被形成在层压体的最外层上的精确且刚性的坝部可靠地保护，并且与半导体芯片的连接可靠性优异。 构成该布线基板10的层叠体31具有作为最外层的导体层24的多个连接端子部41和布线导体62。 布线导体62布置在预定位置，穿过多个连接端子部分41，用于半导体芯片51的倒装芯片安装。层压体的最外层的树脂绝缘层23具有阻挡部分63和加强部分64 坝部63覆盖布线导体62.加强部64形成在布线导体62和与布线导体62相邻的连接端子部41之间，低于坝部63的高度H3。 加强部64与坝部63的侧面连接。

公开(公告)号：EP2337171A4

公开(公告)日：2013-10-16

申请号：EP09819195

申请日：2009-10-06

Applicant: SHOWA DENKO KK

Inventor： ONISHI MINA ,  ISHIHARA YOSHIMITSU ,  INOUE HIROFUMI ,  AZUMA YUKIHIKO

IPC: H01T4/10 ,  H01C7/10 ,  H01C7/12 ,  H05K1/02

CPC classification number: H01C7/12 ,  H01T4/10 ,  H05K1/0259 ,  H05K2201/09672 ,  H05K2201/09881

公开(公告)号：EP2403325A4

公开(公告)日：2013-07-10

申请号：EP10746157

申请日：2010-02-22

Applicant: HITACHI CHEMICAL CO LTD

Inventor： YOSHIDA HIDEKI ,  ISODA SATOSHI ,  URASAKI NAOYUKI ,  KOTANI HAYATO

IPC: H05K1/02 ,  G02B5/12 ,  G02F1/1335 ,  G02F1/1362 ,  H05K3/24 ,  H05K3/28 ,  H05K3/46

CPC classification number: G02B5/12 ,  G02F1/133553 ,  G02F1/136286 ,  G02F2203/12 ,  H05K1/0274 ,  H05K3/244 ,  H05K3/28 ,  H05K3/285 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0376 ,  H05K2201/09881 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/025 ,  Y10T29/49156

公开(公告)号：EP2006909B1

公开(公告)日：2013-06-05

申请号：EP07745152.4

申请日：2007-06-13

Applicant: Panasonic Corporation

Inventor： TSUMURA, Tetsuya Panasonic Corporation ,  NISHIYAMA, Hiroharu Panasonic Corporation ,  TSUJIMOTO, Etsuo Panasonic Corporation

IPC: H01L23/36 ,  H01L23/12 ,  H05K1/02 ,  H05K3/06 ,  H05K3/08

CPC classification number: H05K3/202 ,  H01L23/3737 ,  H01L23/49861 ,  H01L24/81 ,  H01L2924/12042 ,  H01L2924/15747 ,  H05K1/0373 ,  H05K1/056 ,  H05K3/027 ,  H05K3/06 ,  H05K2201/0209 ,  H05K2201/0376 ,  H05K2201/09118 ,  H05K2201/098 ,  H05K2201/09881 ,  H05K2201/10106 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00

公开(公告)号：EP1744609B1

公开(公告)日：2012-12-12

申请号：EP06123074.4

申请日：2000-05-25

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo c/o Ogaki-kita-kojou, Ibiden Co., Ltd. ,  Wang, Dongdong c/o Ogaki-kita-kojou, Ibiden Co., Ltd. ,  Mori, Takahiro c/o Ogaki-kita-kojou, Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

公开(公告)号：EP1731007B1

公开(公告)日：2010-06-09

申请号：EP05715333.0

申请日：2005-02-15

Applicant: SEFAR AG

Inventor： WAGNER, Paul-Heinz ,  HARTL, Thomas

IPC: H05K3/46 ,  H05K3/12

CPC classification number: H05K3/4664 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/28 ,  H05K2201/09881