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11.发明授权
公开(公告)号：EP1058306B1
公开(公告)日：2008-08-20
申请号：EP00111065.9
申请日：2000-06-02
Applicant: JAPAN RADIO CO., LTD
Inventor： Yatsuda, Hiromi
CPC classification number: H01L23/10 , H01L21/50 , H01L24/97 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01079 , H01L2924/14 , H01L2924/351 , H05K3/3436 , H05K3/3442 , H05K2201/0379 , H05K2201/09472 , H05K2201/10666 , H05K2203/1147 , Y02P70/613 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
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12.发明公开Adhesive for bonding circuit members, circuit board and process for its production 有权粘合剂用于粘合的电路元件，电路板及其制造方法相同的
公开(公告)号：EP1454973A1
公开(公告)日：2004-09-08
申请号：EP04013449.6
申请日：1998-08-13
Applicant: Hitachi Chemical Co., Ltd.
Inventor： Watanabe, Itsuo , Takemura, Kenzo , Nagai, Akira , Isaka, Kazuhiro , Watanabe, Osamu , Kojima, Kazuyoshi
CPC classification number: H01L24/83 , C09J7/10 , C09J9/00 , C09J11/04 , C09J2201/36 , H01L21/563 , H01L24/29 , H01L2224/04026 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29499 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0209 , H05K2201/0379 , H05K2201/068 , H01L2924/00
Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
Abstract translation: 一个半导体芯片固定到电路板，并且电连接这两个的电极，和粘合剂树脂组合物和无机填料的含被以10至200份的量（重量）的100重量份的包含在用于粘接的粘合剂和 粘合剂树脂组合物。
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13.发明公开
公开(公告)号：EP1442463A1
公开(公告)日：2004-08-04
申请号：EP02772390.7
申请日：2002-10-23
Applicant: SCHAFFNER EMV AG
Inventor： SIPPOLA, Mika, Matti
CPC classification number: H05K3/46 , H01F17/0013 , H01F27/2804 , H01F27/2847 , H01F41/041 , H01F2027/2861 , H05K1/118 , H05K1/165 , H05K3/4084 , H05K3/4092 , H05K2201/0379 , H05K2201/0394 , H05K2201/0397 , H05K2201/055
Abstract: The invention relates to the manufacturing of a multilayer structure and especially it relates to the manufacturing of a three-dimensional structure and its use as an electronics assembly substrate and as a winding for transformers and inductors. When a multilayer structure is manufactured by folding a conductor-insulator-conductor laminate, where the conductor layers to be separated from each other follow each other on opposite sides of the conductor-insulator-conductor laminate in the sections following each other and where the insulator has been removed from the places where the conductor layers are to be connected together after folding, it is possible to manufacture a wide range of three-dimensional multilayer structures where the volume occupied by the windings over the total volume can be maximized. Alternatively, by using the method it is also possible to manufacture a multilayer structure where components have been buried inside. The method makes it also possible to make connections between layers in a flexible manner. Among other issues, the method can be easily automated for mass-production.
Abstract translation: 本发明涉及多层结构的制造，特别涉及三维结构的制造及其作为电子组装基板和用于变压器和电感器的绕组的用途。 当通过折叠导体 - 绝缘体 - 导体层叠体来制造多层结构时，彼此分离的导体层在彼此相邻的部分中的导体 - 绝缘体 - 导体层叠体的相对侧彼此相邻，并且绝缘体 已经从折叠后导体层要连接在一起的地方去除，可以制造宽范围的三维多层结构，其中可以使总体积上的绕组占据的体积最大化。 或者，通过使用该方法，也可以制造其中部件被埋在其中的多层结构。 该方法还可以以灵活的方式在层之间进行连接。 除了其他问题之外，该方法可以容易地自动化进行批量生产。
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公开(公告)号：EP1293009A4
公开(公告)日：2004-06-09
申请号：EP01946211
申请日：2001-06-08
Applicant: SYNERGY MICROWAVE CORPROATION
Inventor： SRIDHARAN MADADEVAN , MUNIKOTI VASANTH
CPC classification number: H01P3/085 , H01P3/081 , H01P11/003 , H05K1/0237 , H05K3/403 , H05K3/4614 , H05K3/4623 , H05K2201/0379 , H05K2201/0715 , H05K2201/09181 , H05K2201/09318 , H05K2201/096 , H05K2201/09718
Abstract: A multi-layer circuit board including top (40), middle (24), and bottom (18) dielectric layers, a conductive pattern (44) disposed on the top surface (42) and a ground layer (46) disposed on the bottom surface of the top dielectric layer (40), a conductive pattern (28) disposed on the bottom surface (22) of the middle dielectric layer (24), and a ground layer (30) disposed on the bottom surface (16) of the bottom dielectric layer (18).
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公开(公告)号：EP1187520A2
公开(公告)日：2002-03-13
申请号：EP01121380.8
申请日：2001-09-06
Applicant: Visteon Global Technologies, Inc.
Inventor： Jairazbhoy, Vivek Amir , Pham, Cuong Van , Glovatsky, Andrew Z. , Krautheim, Thomas Bernd , Belke, Robert Edward, Jr.
CPC classification number: H05K3/4084 , H05K1/056 , H05K3/062 , H05K3/4092 , H05K3/44 , H05K3/445 , H05K2201/0305 , H05K2201/0361 , H05K2201/0379 , H05K2201/0397 , H05K2201/09554 , H05K2203/0195 , H05K2203/063 , Y10T29/49128 , Y10T29/49144 , Y10T29/49156
Abstract: The present invention discloses a multi-layer circuit board assembly having a first circuit portion having a top surface and a bottom surface a first pre-circuit assembly which is attached to the top surface of the first circuit portion and which includes a top conductive layer. A second pre-circuit assembly is attached to the bottom surface of the first circuit portion and includes a bottom conductive layer. An aperture is formed through the first circuit portion, the first pre-circuit assembly and the second pre-circuit assembly. A plurality of tab portions are integrally formed from the top conductive layer, which extend through the aperture and which are coupled to the bottom conductive layer.
Abstract translation: 本发明公开了一种多层电路板组件，其具有具有顶表面的第一电路部分和底部表面，其被附接到所述第一电路部分的顶表面，并包括一顶导电层的第一前置电路组合件。 第二预制电路组件附接到第一电路部分的底表面并且包括底部导电层。 通过第一电路部分，第一预电路组件和第二预电路组件形成孔。 多个接片部分由顶部导电层整体形成，其延伸穿过孔并耦合至底部导电层。
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Patent Agency Ranking16.发明公开ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD, AND METHOD OF PRODUCING THE SAME 有权胶水连接电路的元件，PCB和方法生产同样
公开(公告)号：EP1120449A1
公开(公告)日：2001-08-01
申请号：EP98937808.8
申请日：1998-08-13
Applicant: Hitachi Chemical Company, Ltd.
Inventor： WATANABE, Itsuo , TAKEMURA, Kenzo , NAGAI, Akira, B306 Hitachi Kasei , ISAKA, Kazuhiro , WATANABE, Osamu , KOJIMA, Kazuyoshi
IPC: C09J9/02
CPC classification number: H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
Abstract: An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition.
Abstract translation: 一个半导体芯片固定到电路板，并且电连接这两个的电极，和粘合剂树脂组合物和无机填料的含被以10至200份的量（重量）的100重量份的包含在用于粘接的粘合剂和 粘合剂树脂组合物。
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17.发明公开
公开(公告)号：EP1058306A2
公开(公告)日：2000-12-06
申请号：EP00111065.9
申请日：2000-06-02
Applicant: JAPAN RADIO CO., LTD
Inventor： Yatsuda, Hiromi
CPC classification number: H01L23/10 , H01L21/50 , H01L24/97 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/01079 , H01L2924/14 , H01L2924/351 , H05K3/3436 , H05K3/3442 , H05K2201/0379 , H05K2201/09472 , H05K2201/10666 , H05K2203/1147 , Y02P70/613 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
Abstract: Substrate 10 has bumps 28, 30, 32, 34 and a substrate 20 has openings 36, 38, 40, 42 at positions in which bumps 28, 30, 32, 34 confront respectively. The substrates 10 and 22 are put together by fusing a sealing wall 26 formed on the substrate 22, to hermetically seal an electronic device lying on the substrate 10 therein. Gas that may be generated upon fusing of the sealing wall 26 can be effectively removed through the openings 36, 38, 40, 42 in the substrate 22.
Abstract translation: 基板10具有突起28，30，32，34和基板20具有开口36，38，40，42在哪个凸点28的位置，30，32，分别面对第34 在衬底10和22通过熔接形成在基板22的密封壁26，以气密地密封躺在基板10其内的电子设备放在一起。 气体也可以在密封壁26可通过开口36，38，40，42层的基板在22
被有效地去除的熔融而产生 -
公开(公告)号：EP0994508A1
公开(公告)日：2000-04-19
申请号：EP99307990.4
申请日：1999-10-11
Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.
IPC: H01L23/485 , H01L21/60
CPC classification number: H05K3/3436 , H01L24/11 , H01L24/13 , H01L2224/05571 , H01L2224/05573 , H01L2224/11334 , H01L2224/13099 , H01L2224/13111 , H01L2224/13116 , H01L2924/0001 , H01L2924/00014 , H01L2924/01004 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H05K2201/0379 , H05K2201/09472 , H05K2201/10992 , H05K2203/043 , Y02P70/613 , H01L2924/0105 , H01L2924/00 , H01L2224/05599
Abstract: A semiconductor device including a semiconductor chip (10) which has an electrode and also has an active surface covered with an insulating layer (100). A rewiring circuit (120) is formed on the insulating layer (100) and is electrically connected to the electrode. An inner bump (140) is formed on a conductive pad (122) which is a part of the rewiring circuit (120). An insulating film (160) is attached to the rewiring circuit (120) and a surface of the insulating layer (100) at a peripheral portion of the rewiring circuit (120). The insulating film (160) has a through hole (180) into which the inner bump (140) is inserted. An outer bump (200) is superimposed on the inner bump (140) in the through hole (180) so as to project outwards away from the semiconductor chip (10).
Abstract translation: 一种半导体器件，包括具有电极并且还具有覆盖有绝缘层（100）的有源表面的半导体芯片（10）。 重新布线电路（120）形成在绝缘层（100）上并与电极电连接。 在作为再布线电路（120）的一部分的导电焊盘（122）上形成有内凸块（140）。 绝缘膜（160）在再布线电路（120）的周边部分附接到重新布线电路（120）和绝缘层（100）的表面。 绝缘膜（160）具有插入内凸块（140）的通孔（180）。 外部突起（200）重叠在通孔（180）中的内凸块（140）上，从而向外突出远离半导体芯片（10）突出。
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19.发明公开ANTENNA SHEET, DATA CARRIER WITH NON-CONTACT IC, AND METHOD FOR PRODUCING ANTENNA SHEET 有权天线薄膜，具有无接触的集成电路和方法媒体制造天线的电影
公开(公告)号：EP2426626A4
公开(公告)日：2012-12-05
申请号：EP10769518
申请日：2010-04-28
Applicant: TOPPAN PRINTING CO LTD
Inventor： GOTOU HIROYOSHI
IPC: G06K19/077 , G06K19/07 , H05K3/40
CPC classification number: G06K19/07783 , G06K19/07754 , H05K3/4038 , H05K3/4084 , H05K2201/0129 , H05K2201/0355 , H05K2201/0379 , H05K2201/0382 , H05K2201/0394 , H05K2201/10098 , H05K2203/0195 , H05K2203/107 , Y10T29/49016 , Y10T29/49018
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公开(公告)号：EP2308274B1
公开(公告)日：2012-05-09
申请号：EP09780632.7
申请日：2009-07-15
Applicant: Robert Bosch GmbH
Inventor： KUGLER, Andreas , VOIGTLAENDER, Klaus , KIMMICH, Peter
CPC classification number: H05K1/185 , H01L23/427 , H01L23/473 , H01L23/49822 , H01L23/4985 , H01L23/5389 , H01L24/19 , H01L24/24 , H01L24/25 , H01L24/82 , H01L24/96 , H01L25/071 , H01L25/072 , H01L25/074 , H01L2224/04105 , H01L2224/24137 , H01L2224/2518 , H01L2924/01013 , H01L2924/01029 , H01L2924/01047 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/1433 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H01L2924/3025 , H05K1/0206 , H05K1/0272 , H05K1/162 , H05K1/189 , H05K3/4614 , H05K3/4644 , H05K2201/0379 , H05K2201/064 , H05K2201/066 , H05K2201/09745 , H05K2201/10166 , H05K2203/1469
Abstract: The invention relates to a printed circuit board (1) with a sheet-like board substrate (2) and with at least one electronic component (3), wherein it is provided that the component (3) is arranged within the board substrate (2). The invention also relates to a corresponding method for producing the printed circuit board.
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