公开(公告)号：EP2866535A4

公开(公告)日：2016-03-16

申请号：EP13806277

申请日：2013-03-13

Applicant: NIPPON KOGAKU KK

Inventor： SUGANUMA RYOICHI ,  ARIMA HIROFUMI ,  SUZUKI SATORU ,  SATO TAKUYA

IPC: H05K3/46 ,  H05K1/05

CPC classification number: H05K1/0271 ,  H01L27/14618 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/16195 ,  H04N5/2253 ,  H05K1/0206 ,  H05K1/0283 ,  H05K1/0366 ,  H05K1/05 ,  H05K1/056 ,  H05K1/111 ,  H05K1/181 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/10015 ,  H05K2201/10121 ,  H01L2924/00014

Abstract: A substrate comprises: a first insulating layer; a second insulating layer having an elastic modulus that is different from an elastic modulus of the first insulating layer; and a core layer that is sandwiched by the first insulating layer and the second insulating layer, and is more rigid than the first insulating layer and the second insulating layer.

公开(公告)号：EP2028664B1

公开(公告)日：2015-12-30

申请号：EP07745061.7

申请日：2007-06-12

Applicant: Murata Manufacturing Co. Ltd.

Inventor： NISHIZAWA, Yoshihiko

IPC: H01F17/00 ,  H01G4/12 ,  H05K3/46

CPC classification number: H05K3/4688 ,  B32B18/00 ,  C04B35/63 ,  C04B2235/663 ,  C04B2235/9607 ,  C04B2237/32 ,  C04B2237/34 ,  C04B2237/582 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/72 ,  H01F17/0006 ,  H01G4/12 ,  H01G4/30 ,  H01G4/40 ,  H01L23/15 ,  H01L23/49822 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2201/086 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926

公开(公告)号：EP2763513A4

公开(公告)日：2015-10-21

申请号：EP12836336

申请日：2012-09-29

Applicant: KYOCERA CORP

Inventor： HAYASHI KATSURA

IPC: H05K3/46 ,  H01L23/14 ,  H01L23/498 ,  H01L23/538 ,  H05K1/05 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/15192 ,  H01L2924/15321 ,  H05K1/056 ,  H05K1/185 ,  H05K3/4608 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H01L2924/00012 ,  H01L2924/00

Abstract: To provide a wiring substrate that meets the demand for improving connection reliability with an electronic component, a component embedded substrate that incorporates an embedded component into the wiring substrate, and a package structure in which an electronic component is mounted on the wiring substrate or the component embedded substrate. [Solution] The wiring substrate is provided with a metal plate (2), and a wiring layer (5) that has a plurality of insulating layers (3) and a conductive layer (4) arranged on the plurality of insulating layers (3) and is arranged on at least one principal surface of the metal plate (2). The plurality of insulating layers (3) in the wiring layer (5) has a first insulating layer (6) which is provided so as to contact the principal surface of the metal plate (2) and has a larger thermal expansion rate in the planar direction than the metal plate (2) and a second insulating layer (7) which is laminated on the first insulating layer (6) so as to contact the first insulating layer (6) and has smaller thermal expansion rate in the planar direction than the metal plate (2). The first insulating layer (6) includes a resin (8). The second insulating layer (7) includes a plurality of first particles (10) that are made of an inorganic insulating material and mutually connected, and has a part of the first insulating layer (6) arranged in a gap between the plurality of first particles (10).

公开(公告)号：EP2919287A1

公开(公告)日：2015-09-16

申请号：EP12888036.6

申请日：2012-11-06

Applicant: NGK Insulators, Ltd.

Inventor： YANO Shinsuke ,  TANI Makoto ,  NAKANISHI Hirokazu

IPC: H01L33/64

CPC classification number: H05K1/0207 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/16245 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/053 ,  H05K2201/0137 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/1126

Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided.

Abstract translation: 包括具有预定值或更大厚度的金属基底的发光二极管的基板被构成为使得与预定范围内的发光二极管（LED）的电连接的顶部导体的厚度在其内 电绝缘金属基体和顶部导体的绝缘层和顶部导体的厚度的预定范围和厚度满足预定关系。 因此，提供了一种发光二极管的基板，其通过在不降低基板的绝缘可靠性和高湿度可靠性的情况下实现作为整个基板的总热阻的低热阻而显示出高的散热能力。

公开(公告)号：EP1606108B1

公开(公告)日：2015-08-19

申请号：EP04723419.0

申请日：2004-03-25

Applicant: LG Chem Ltd.

Inventor： PARK, Soon-yong ,  KYUNG, You-jin ,  SONG, Heon-sik ,  AHN, Byeong-in; ,  KO, Joo-eun ,  PARK, Yong-jun ,  JANG, Se-myung,

IPC: B32B15/08

CPC classification number: B32B15/08 ,  B32B27/08 ,  B32B27/281 ,  B32B2307/308 ,  B32B2307/734 ,  B32B2457/08 ,  H05K1/0346 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/068 ,  Y10T428/31681 ,  Y10T428/31721

公开(公告)号：EP2728616A4

公开(公告)日：2015-03-18

申请号：EP12805403

申请日：2012-06-06

Applicant: NGK INSULATORS LTD

Inventor： HIRAI TAKAMI ,  YANO SHINSUKE ,  NANATAKI TSUTOMU ,  YAMAGUCHI HIROFUMI

IPC: H01L25/07 ,  H01L23/36 ,  H01L25/18 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K7/06 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/642 ,  H01L24/45 ,  H01L25/162 ,  H01L25/165 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4903 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3511 ,  H05K1/0207 ,  H05K1/0231 ,  H05K1/0263 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/145 ,  H05K1/162 ,  H05K3/0061 ,  H05K2201/068 ,  H05K2201/10015 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: [Summary] [Subject] In a high-capacity module, while attaining reduction in size and weight, reduction in serge, and reduction in a loss, overheating of the module due to the curvature of a power circuit board accompanying thermal expansion of a composition member of the power circuit due to heat generation from a high exothermic element should be prevented. [Solution means] A drive circuit is laminated via a high exothermic element disposed on a power circuit, and it is configured so that the average thermal expansion coefficient of the side of the power circuit of the drive circuit board may be larger than the average thermal expansion coefficient of the side opposite to the power circuit. Thereby, the drive circuit board will be curved in the same direction as the power circuit board when the power circuit board is curved due to heat generation from the high exothermic element accompanying the operation of the module. Thereby, in a high-capacity module, while attaining reduction in size and weight, reduction in serge, and reduction in a loss, poor junction between the high exothermic element of the power circuit and the drive circuit board can be suppressed and heat generating from the high exothermic element can be more effectively released.

公开(公告)号：EP2763513A1

公开(公告)日：2014-08-06

申请号：EP12836336.3

申请日：2012-09-29

Applicant: Kyocera Corporation

Inventor： HAYASHI, Katsura

IPC: H05K1/05 ,  H05K3/46

CPC classification number: H05K1/0271 ,  H01L23/13 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/15192 ,  H01L2924/15321 ,  H05K1/056 ,  H05K1/185 ,  H05K3/4608 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0269 ,  H05K2201/068 ,  H01L2924/00012 ,  H01L2924/00

Abstract: To provide a wiring substrate that meets the demand for improving connection reliability with an electronic component, a component embedded substrate that incorporates an embedded component into the wiring substrate, and a package structure in which an electronic component is mounted on the wiring substrate or the component embedded substrate. [Solution] The wiring substrate is provided with a metal plate (2), and a wiring layer (5) that has a plurality of insulating layers (3) and a conductive layer (4) arranged on the plurality of insulating layers (3) and is arranged on at least one principal surface of the metal plate (2). The plurality of insulating layers (3) in the wiring layer (5) has a first insulating layer (6) which is provided so as to contact the principal surface of the metal plate (2) and has a larger thermal expansion rate in the planar direction than the metal plate (2) and a second insulating layer (7) which is laminated on the first insulating layer (6) so as to contact the first insulating layer (6) and has smaller thermal expansion rate in the planar direction than the metal plate (2). The first insulating layer (6) includes a resin (8). The second insulating layer (7) includes a plurality of first particles (10) that are made of an inorganic insulating material and mutually connected, and has a part of the first insulating layer (6) arranged in a gap between the plurality of first particles (10).

Abstract translation: 为了提供一种能够满足提高与电子部件的连接可靠性的要求的布线基板，将布线基板中嵌入有嵌入部件的部件嵌入基板以及将电子部件安装在布线基板或部件上的封装结构 嵌入式基板。 [解决方案]布线基板设置有金属板（2）和布置在多个绝缘层（3）上的多个绝缘层（3）和导电层（4）的布线层（5） 并布置在金属板（2）的至少一个主表面上。 布线层（5）中的多个绝缘层（3）具有第一绝缘层（6），其设置成与金属板（2）的主表面接触，并且在平面上具有较大的热膨胀率 方向比金属板（2）和第二绝缘层（7）层叠在第一绝缘层（6）上以与第一绝缘层（6）接触，并且在平面方向上的热膨胀率比 金属板（2）。 第一绝缘层（6）包括树脂（8）。 第二绝缘层（7）包括由无机绝缘材料制成并相互连接的多个第一颗粒（10），并且具有布置在多个第一颗粒之间的间隙中的第一绝缘层（6）的一部分 （10）。

公开(公告)号：EP2080224A4

公开(公告)日：2014-07-16

申请号：EP07830673

申请日：2007-10-26

Applicant: MITSUBISHI MATERIALS CORP ,  TOYOTA MOTOR CO LTD

Inventor： KITAHARA TAKESHI ,  ISHIZUKA HIROYA ,  KUROMITSU YOSHIROU ,  WATANABE TOMOYUKI

IPC: H01L23/373 ,  H01L23/12 ,  H01L25/07 ,  H01L25/18 ,  H05K1/09

CPC classification number: H01L23/3735 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/072 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/83424 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0061 ,  H05K3/202 ,  H05K3/38 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/0405 ,  H01L2924/014

公开(公告)号：EP2575415A3

公开(公告)日：2013-11-27

申请号：EP12185974.8

申请日：2012-09-25

Applicant: Honeywell International Inc.

Inventor： Clark, Matthew ,  Galbrecht, Craig A. ,  Goblish, George L. ,  Koshiol, Myles

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H05K2201/068 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09854 ,  Y10T29/49124

Abstract: An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.

公开(公告)号：EP2603063A1

公开(公告)日：2013-06-12

申请号：EP12191363.6

申请日：2012-11-06

Applicant: Canon Kabushiki Kaisha

Inventor： Ikeda, Shinya

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  H01L2224/16225 ,  H01L2225/107 ,  H01L2924/3511 ,  H05K1/181 ,  H05K2201/068 ,  H05K2201/10545 ,  H05K2201/10734 ,  Y02P70/611

Abstract: In a printed wiring board (2) of a printed circuit board, a region for mounting a first semiconductor package (4) is divided into a first region (9) on which first solder ball electrodes (7) are disposed and a second region (10) on which first solder ball electrodes are not disposed, and a region for mounting a second semiconductor package (6) on the back side of the first semiconductor package is located within a region on the back side of the second region.

Abstract translation: 在印刷电路板的印刷线路板（2）中，用于安装第一半导体封装（4）的区域被划分为其上设置有第一焊球电极（7）的第一区域（9）和第二区域 在第一半导体封装的背面上未安置第一焊球电极的区域以及用于安装第二半导体封装的区域位于第二区域的背侧区域内。