公开(公告)号：EP2395823A4

公开(公告)日：2013-01-23

申请号：EP10721264

申请日：2010-02-22

Applicant: PANASONIC CORP

Inventor： KONDO KENJI ,  HIDAKA MASAHITO ,  KUYAMA KOJI ,  KAMOGI YUTAKA

IPC: H05K3/34 ,  B23K35/26 ,  C22C13/00

CPC classification number: H05K3/3463 ,  B23K1/0016 ,  B23K35/262 ,  H05K2201/068 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T428/12493 ,  Y10T428/24132 ,  Y10T428/24826 ,  Y10T428/24926

Abstract: A mounting structure 1 in which an electronic component 5 is surface-mounted with solder 4 to a wiring substrate 2 is disclosed. The solder is Sn-Ag-Bi-In-based solder containing 0.1% by weight or more and 5% by weight or less of Bi, and more than 3% by weight and less than 9% by weight of In, with the balance being made up of Sn, Ag and unavoidable impurities. The wiring substrate has a coefficient of linear expansion of 13 ppm/K or less in all directions. Thus, it is possible to realize a mounting structure using lead-free solder and for which the occurrence of cracks in a solder joint portion due to a 1000-cycle thermal shock test from -40 to 150°C has been suppressed.

公开(公告)号：EP2495732A2

公开(公告)日：2012-09-05

申请号：EP12003885.6

申请日：2001-04-27

Applicant: Sekisui Chemical Co., Ltd.

Inventor： Kuroda, Hiroshi ,  Okinaga, Nobuyuki

IPC: H01B5/00 ,  H01B5/16 ,  C08J7/06 ,  H01R11/01 ,  H05K1/09 ,  H05K3/32 ,  H01L21/60 ,  H01L21/311 ,  C25D7/12 ,  H05K3/34

CPC classification number: H01R4/00 ,  H01R4/02 ,  H01R4/04 ,  H01R13/035 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/068 ,  H05K2203/0425 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: This invention provides a conductive fine particle for soldering two or more electrodes of an electric circuit, the conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like.
A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3 × 10 -5 to 7 × 10 -5 (1/K).

Abstract translation: 本发明提供一种用于焊接电路的两个或更多个电极的导电细颗粒，导电细颗粒具有放松施加到基板的电路等的力的能力。 一种导电性细颗粒，其包含由表面被至少一个金属层覆盖的树脂制成的核心微粒，其中所述树脂的线性膨胀系数为3×10 -5至7×10 -5（1 / K ）。

公开(公告)号：EP2436029A2

公开(公告)日：2012-04-04

申请号：EP10781274.5

申请日：2010-05-28

Applicant: Arizona Board Of Regents, A Body Corporate Acting For And On Behalf Of Northern Arizona University

Inventor： O'ROURKE, Shawn ,  MOYER, Curtis ,  AGENO, Scott ,  BOTTESCH, Dirk ,  O'BRIEN, Barry ,  MARRS, Michael

IPC: H01L21/20

CPC classification number: H01L21/6835 ,  H01L29/66765 ,  H01L29/78603 ,  H01L2221/6835 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K3/007 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/068

Abstract: Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180°C; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.

公开(公告)号：EP2188121A4

公开(公告)日：2012-02-01

申请号：EP08797972

申请日：2008-08-15

Applicant: OAK MITSUI INC

Inventor： PRAMANIK PRANABES K ,  RADEWITZ JACLYN ,  YAMAZAKI KAZUKIRO

IPC: H01L21/316 ,  H01G4/20 ,  H05K1/16

CPC classification number: H01L21/31691 ,  H01G4/206 ,  H01L28/55 ,  H05K1/162 ,  H05K2201/0209 ,  H05K2201/068

公开(公告)号：EP2293656A4

公开(公告)日：2011-11-02

申请号：EP09754617

申请日：2009-05-21

Applicant: DENKI KAGAKU KOGYO KK

Inventor： NISHI TAIKI ,  MIYAKAWA TAKESHI ,  YAMAZAKI KIYOKAZU ,  SAIKI TAKASHI

IPC: H05K1/05 ,  F21V29/00 ,  H01L33/00

CPC classification number: H05K1/056 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/60 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0274 ,  H05K3/0061 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/2054 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T428/12569 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252 ,  H01L2924/00

公开(公告)号：EP2178116A4

公开(公告)日：2011-05-04

申请号：EP08827123

申请日：2008-08-05

Applicant: IBIDEN CO LTD

Inventor： TANAKA HIRONORI ,  KAWANO SHUICHI

IPC: H01L23/12 ,  H01L23/14 ,  H01L23/15 ,  H01L23/32 ,  H05K3/46

CPC classification number: H01L23/49894 ,  H01L23/147 ,  H01L23/49822 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K3/0029 ,  H05K3/4602 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/063 ,  Y10T29/49165 ,  H01L2224/05599

公开(公告)号：EP2113524A4

公开(公告)日：2011-03-30

申请号：EP08720788

申请日：2008-02-21

Applicant: PANASONIC ELEC WORKS CO LTD

Inventor： FUJINO KENTARO ,  SAWADA TOMOAKI ,  NISHINO MITSUYOSHI ,  SHINPO TAKASHI ,  NAKAMURA YOSHIHIKO ,  YAMAGUCHI MAO

IPC: C08G59/62 ,  B32B15/092 ,  C08J5/24 ,  C08K3/22 ,  C08K3/36 ,  C08L63/00 ,  H05K1/03

CPC classification number: H05K1/0373 ,  B32B5/022 ,  B32B5/024 ,  B32B5/22 ,  B32B5/26 ,  B32B15/12 ,  B32B15/14 ,  B32B15/20 ,  B32B29/005 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2307/558 ,  B32B2307/56 ,  B32B2307/714 ,  B32B2307/734 ,  B32B2457/08 ,  C08G59/50 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  Y10T428/31522

公开(公告)号：EP1734068A4

公开(公告)日：2011-01-19

申请号：EP05719312

申请日：2005-02-18

Applicant: POLYMATECH CO LTD

Inventor： TOBITA MASAYUKI ,  KIMURA TORU ,  AOKI HISASHI ,  SHIMOYAMA NAOYUKI ,  ISHIGAKI TSUKASA ,  OCHI MITSUKAZU ,  HARADA MIYUKI

IPC: C08J5/24 ,  B32B15/08 ,  B32B27/04 ,  C08G59/28 ,  C08G59/50 ,  C08K7/02 ,  C08L63/00 ,  H05K1/03 ,  H05K3/00

CPC classification number: C08G59/28 ,  B32B15/08 ,  B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  B32B27/18 ,  B32B27/38 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  C08G59/5033 ,  C08J5/24 ,  C08J2363/00 ,  C08K7/02 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/249924 ,  C08L63/00

公开(公告)号：EP2153707A2

公开(公告)日：2010-02-17

申请号：EP08749798.8

申请日：2008-04-28

Applicant: Robert Bosch GmbH ,  Würth Elektronik Rot am See GmbH & Co. KG ,  Fraunhofer-Gesellschaft

Inventor： SCHAAF, Ulrich ,  KUGLER, Andreas ,  BECKER, Karl-Friederich ,  NEUMANN, Alexander ,  KOSTELNIK, Jan

IPC: H05K1/18

CPC classification number: H01L23/5389 ,  H01L23/3121 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/83132 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1461 ,  H01L2924/181 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/188 ,  H05K3/4602 ,  H05K3/4641 ,  H05K2201/068 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49139 ,  H01L2924/00

Abstract: The invention relates to a method for producing an electronic assembly (21), wherein, in a first step, at least one electronic component (9) is fastened on an isolating layer (5) of a conductive film (1), the conductive film (1) with the electronic component (9) is laminated onto a printed circuit board carrier (13) and finally a conductor structure (15) is formed by structuring the conductive film (1). The coefficient of expansion of the isolating layer (5) is between the coefficient of expansion of the printed circuit board carrier (13) and the coefficient of expansion of the conductor structure (15), and/or electronic components (9), which need small passages for contacting with the conductor structure (15), are pressed further into the isolating layer (5) than electronic components (9), which need larger passages in the isolating layer (5), and/or the conductor structure (15) is forced apart before the application of a further conductor structure (27).

Abstract translation: 本发明涉及一种用于制造电子组件（21）的方法，其中在第一步骤中，将至少一个电子部件（9）固定在导电膜（1）的隔离层（5）上，所述导电膜 （1）与电子元件（9）层压到印刷电路板载体（13）上，最后通过构造导电膜（1）形成导体结构（15）。 隔离层（5）的膨胀系数在印刷电路板载体（13）的膨胀系数和导体结构（15）和/或电子部件（9）的膨胀系数之间 和导体结构（15）接触的小通道比在绝缘层（5）和/或导体结构（15）中需要较大通道的电子元件（9）进一步压入隔离层（5） 在施加另外的导体结构（27）之前被迫分开。

公开(公告)号：EP2113524A1

公开(公告)日：2009-11-04

申请号：EP08720788.2

申请日：2008-02-21

Applicant: Panasonic Electric Works Co., Ltd

Inventor： FUJINO, Kentaro ,  SAWADA, Tomoaki ,  NISHINO, Mitsuyoshi ,  SHINPO, Takashi ,  NAKAMURA, Yoshihiko ,  YAMAGUCHI, Mao

IPC: C08G59/62 ,  B32B15/092 ,  C08J5/24 ,  C08K3/22 ,  C08K3/36 ,  C08L63/00 ,  H05K1/03

CPC classification number: H05K1/0373 ,  B32B5/022 ,  B32B5/024 ,  B32B5/22 ,  B32B5/26 ,  B32B15/12 ,  B32B15/14 ,  B32B15/20 ,  B32B29/005 ,  B32B2260/021 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  B32B2262/101 ,  B32B2307/206 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/308 ,  B32B2307/50 ,  B32B2307/558 ,  B32B2307/56 ,  B32B2307/714 ,  B32B2307/734 ,  B32B2457/08 ,  C08G59/50 ,  C08G59/621 ,  C08J5/24 ,  C08J2363/00 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/068 ,  Y10T428/31522

Abstract: The present invention provides an improved epoxy resin composition enabling better dimensional stability of a laminate by decreasing the coefficient of thermal expansion in its thickness direction of a laminate manufactured using an epoxy resin composition as a material, and by retaining a high level of adhesion in the cured product thereof, enabling better drilling workability of the laminate and suppression of crack development therein during the drilling process, and enabling to decrease impregnation of the plating solution into the laminate associated with those cracks.
This epoxy resin composition includes:
(A) an epoxy resin;
(B) a curing agent composed of phenolic novolac resin curing agent or amine curing agent,
(C) an inorganic filler composed of aluminum hydroxide with or without spherical silica; and
(D) an elastic component made of minute particles having a core-shell structure with its shell constituted by a resin which is compatible with said epoxy resin (A).
The epoxy resin composition exhibits, when cured into an article, a linear coefficient (a z ) of thermal expansion of 48 or less with respect to a thickness of said article.

Abstract translation: 本发明提供一种改进的环氧树脂组合物，通过降低使用环氧树脂组合物作为材料制造的层压板的厚度方向的热膨胀系数，并且通过在 使得其能够在钻井过程中能够提高层压体的钻孔加工性，抑制裂纹的发生，能够将镀液浸渍到与这些裂纹相关联的层叠体中。 该环氧树脂组合物包括：（A）环氧树脂; （B）由酚醛清漆树脂固化剂或胺固化剂组成的固化剂，（C）由具有或不具有球形二氧化硅的氢氧化铝组成的无机填料; 和（D）由具有壳壳结构的微小颗粒制成的弹性组分，其外壳由与所述环氧树脂（A）相容的树脂构成。 环氧树脂组合物当固化成制品时，其热膨胀系数（z）相对于所述制品的厚度为48或更小。