公开(公告)号：EP0957665A2

公开(公告)日：1999-11-17

申请号：EP99303101.2

申请日：1999-04-21

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Terashima, Kiminori

IPC: H05K9/00

CPC classification number: H05K9/0028 ,  H05K3/3405 ,  H05K3/3447 ,  H05K7/02 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: In the electronic device of the present invention, leg portions (1b) of a frame are projected downward from the underside of a printed circuit board (2), so the positioning of the electronic device can be done by inserting the leg portions into holes formed in a mother printed circuit board. Thus, when the electronic device is surface-mounted to the mother board, there is no fear of its dislocation even under vibration or shock. Accordingly, the electronic device is not deteriorated at all in its quality.

Abstract translation: 在本发明的电子设备中，框架的脚部（1b）从印刷电路板（2）的下侧向下突出，因此可以通过将脚部插入形成的孔中来进行电子设备的定位 在母版印刷电路板上。 因此，当将电子装置表面安装到母板时，即使在振动或冲击下也不会有其位错的担心。 因此，电子设备的质量根本不劣化。

公开(公告)号：EP0955702A1

公开(公告)日：1999-11-10

申请号：EP99107699.3

申请日：1999-04-17

Applicant: Festo AG & Co

Inventor： Franz, Jochen ,  Rühle, Peter ,  Böck, Jürgen

IPC: H01R17/12 ,  H01R9/05

CPC classification number: H05K3/326 ,  H01R12/721 ,  H01R13/6658 ,  H05K1/119 ,  H05K2201/09063 ,  H05K2201/09181 ,  H05K2201/1003 ,  H05K2201/10446 ,  H05K2201/1059 ,  Y10S439/931 ,  Y10S439/951

Abstract: Es wird eine Verbindungsvorrichtung zur elektrischen Verbindung einer Trägerplatte (18) mit einem anderen Bauteil (4) vorgeschlagen. Die Trägerplatte (18) hat eine zu ihrer Stirnseite (31) offene Aussparung (30), die seitlich von Federarmen (41, 42) begrenzt ist, an denen sich Kontaktflächen für die elektrische Verbindung befinden.

Abstract translation: 连接装置具有用于电气部件和/或电缆的非导电承载板（18），其具有接触装置（2），用于与另一部件（4）和后开口（30）的反接头（3）接触， 在其横向边界壁上形成接触表面。 当制造电连接时，接触表面被压靠在与开口接合的接触反面上。 接触表面位于弹性臂（41,42）上，其弹性地是可横向移动的弹簧，使得两个弹簧臂抵抗由插入开口（30）中的反接触装置（3）的恢复力而扩展。

公开(公告)号：EP0941020A2

公开(公告)日：1999-09-08

申请号：EP99200506.6

申请日：1999-02-23

Applicant: Philips Patentverwaltung GmbH ,  Koninklijke Philips Electronics N.V.

Inventor： Matuschik, Peter, Dipl.-Ing.

IPC: H05K3/34 ,  H01R9/09

CPC classification number: H01R12/57 ,  H05K3/3405 ,  H05K3/403 ,  H05K2201/0376 ,  H05K2201/09181 ,  H05K2201/1034 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: Die Erfindung betrifft eine Leiterplatte (1) mit mittels eines Reflow-Lötprozesses mit der Leiterplatte (1) elektrisch verbundenen SMD-Bauelementen.
Um eine Leiterplatte zu schaffen, die Anschlußelemente aufweist, deren Montage möglichst kostengünstig ist, wird vorgeschlagen, daß die Leiterplatte (1) ein oder mehrere für eine elektrische Verbindung mit anderen elektrischen Komponenten dienende Anschlußelemente (3a, ..., 3f) aufweist, die in Ausnehmungen der Leiterplatte (1) gelagert sind und nicht nach außen über die Leiterplattenoberfläche, auf der die SMD-Bauelemente befestigt sind, hinausragen.

Abstract translation: 本发明通过回流焊接工艺（1）电连接SMD元件涉及一种印刷电路板（1）与所述印刷电路板。 为了提供具有连接元件的电路板，该组件是成本有效地，它提出，所述电路板（1）一个或多个服务用于与连接元件的其它电气部件的电连接部（3a，...，3F），其 被安装在印刷电路板（1），而不是通过在其上SMD元件安装在印刷电路板表面的外部，突出的凹部。

公开(公告)号：EP0862238A2

公开(公告)日：1998-09-02

申请号：EP98103314.5

申请日：1998-02-25

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Ishii, Tetsuya ,  Katagiri, Hiroshi ,  Shingaki, Tadashi ,  Takemura, Tatsuya

IPC: H01P7/08

CPC classification number: H01P7/084 ,  H05K1/0243 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/10068

Abstract: A multilayer microelectronic circuit to be directly mounted on a substrate and to be used, for example, as a resonator. The multilayer microelectronic circuit comprises a plurality of dielectric layers and patterned electrodes which are laminated one upon another to form a laminated structure, the dielectric layers and the patterned electrodes forming an electrical circuit. The laminated structure has side surfaces extending along a direction in which the dielectric layers and the patterned electrodes are laminated. An input line is formed at one of the side surfaces and connected with an input section of the electrical circuit. An output line is formed at one of the side surfaces and connected with an output section of the electrical circuit. A grounding line is formed at one of the side surfaces and connected with a grounding section of the electrical circuit. Additionally, a signal line formed at one of the side surfaces, for connecting sections of the electrical circuit. The signal line has an end positioned adjacent a mounting surface at which the multilayer microelectronic circuit is directly mounted on the substrate, in which the end of the signal line is separate from the mounting surface so as to be insulated from electrical contact with the substrate.

Abstract translation: 要直接安装在基片上并用作例如谐振器的多层微电子电路。 多层微电子电路包括多个介质层和图案化电极，它们彼此层叠以形成层压结构，电介质层和图案化电极形成电路。 层叠结构具有沿着电介质层和图案化电极层叠的方向延伸的侧面。 输入线形成在一个侧面并与电路的输入部分连接。 输出线形成在一个侧面并与电路的输出部连接。 在一个侧面形成接地线，并与电路的接地部连接。 另外，形成在一个侧表面上用于连接电路的部分的信号线。 信号线具有位于多个微电子电路直接安装在基板上的安装表面附近的端部，其中信号线的端部与安装表面分离，从而与基板电接触绝缘。

公开(公告)号：EP0653905A1

公开(公告)日：1995-05-17

申请号：EP94308374.1

申请日：1994-11-14

Applicant: International Business Machines Corporation

Inventor： Downie, Alan Peter ,  Gallagher, Peter ,  Garrity, John Joseph ,  Robertson, Brian Leslie

IPC: H05K3/40 ,  H05K3/36

CPC classification number: H05K1/141 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/09181 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T29/49789

Abstract: A direct chip attach module (DCAM) 10 comprises one or more electronic components 30 bonded to a printed circuit on a substrate. The DCAM is bonded to an electronic circuit assembly by means of connection pads 50 formed on the edge of the DCAM substrate. This enables easy visual inspection of solder joints between the DCAM and the assembly.
DCAM substrates 70 are provided in panel form and vias 50 are drilled and plated at predetermined connection points. The DCAM is then excised from the panel and the cut vias provide connection pads 50 on the edge of the substrate.

Abstract translation: 直接芯片连接模块（DCAM）10包括结合到基板上的印刷电路的一个或多个电子部件30。 DCAM通过形成在DCAM衬底的边缘上的连接焊盘50而结合到电子电路组件。 这使得能够容易地目视检查DCAM和组件之间的焊点。 DCAM衬底70以面板形式提供，并且通孔50在预定的连接点进行钻孔和电镀。 然后从面板切出DCAM，并且切割通孔在衬底的边缘上提供连接焊盘50。

公开(公告)号：EP0649562A1

公开(公告)日：1995-04-26

申请号：EP93917069.0

申请日：1993-07-08

Applicant: RAYCHEM CORPORATION

Inventor： GRAVES, Gregory, A. ,  ZHANG, Michael ,  CHANDLER, Daniel ,  CHANG, Chi-Ming Dep.of Chemical Engineering ,  FANG, Shou-Mean

IPC: H01C1 ,  H01C7 ,  H01G4 ,  H05K1 ,  H05K3

CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising: (a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and (b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element. Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.

公开(公告)号：EP0360727B1

公开(公告)日：1994-10-12

申请号：EP89730120.6

申请日：1989-05-11

Applicant: KRONE Aktiengesellschaft

Inventor： Fitzgerald, Robert ,  Bramkamp, Wilhelm ,  Hegner, Gunter ,  Biederstedt, Lutz ,  Gerke, Dieter ,  Müller, Manfred ,  Radelow, Wolfgang

IPC: H01R4/24 ,  H01R4/58

CPC classification number: H01R4/2425 ,  H01R13/03 ,  H05K1/119 ,  H05K3/326 ,  H05K3/403 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09827 ,  H05K2201/10287 ,  H05K2201/1059 ,  Y10S439/931

公开(公告)号：EP0542533A1

公开(公告)日：1993-05-19

申请号：EP92310311.3

申请日：1992-11-12

Applicant: NEC CORPORATION

Inventor： Moriyama, Yoshifumi, NEC Corparation

IPC: H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/49805 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/181 ,  H05K1/111 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/10727 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: In a semiconductor chip carrier which has a rectangular insulating substrate (2) having four corners (2a,2b,2c,2d) and electrode leads deposited on a peripheral surface of the substrate and which is mounted onto a circuit board with each electrode lead being connected to the corresponding board electrode through a solder mass, widths of the electrode leads (32b) care wider at each of the four corners than those of the electrode leads (32a) located at positions except the four corners. An area of the contact through the solder between each electrode lead positioned at each corner and the corresponding board electrode is wider than that between each of the other electrode lead and each corresponding board electrode. As each electrode lead positioned at each corner is strongly connected to the board electrode, it is seldom peeled off from the board electrode even when the circuit board is twisted or warped during or after the process of mounting the chip carrier onto the circuit board.

Abstract translation: 在具有四个角（2a，2b，2c，2d）的矩形绝缘基板（2）和沉积在基板周边表面上的电极引线的半导体芯片载体中，并且每个电极引线为安装在电路板上 通过焊料连接到相应的板电极，电极引线（32b）的宽度在四个角中的每一个处都比位于除了四个角之外的位置的电极引线（32a）的宽度更宽。 位于每个拐角处的每个电极引线与对应的板电极之间通过焊料的接触区域比另一个电极引线和每个相应的电路板电极之间的接触区域宽。 由于位于每个拐角处的每个电极引线牢固地连接到板电极，所以即使在将芯片载体安装到电路板上或之后的电路板被扭曲或翘曲时，也很少从板电极剥离。

公开(公告)号：EP0467698A2

公开(公告)日：1992-01-22

申请号：EP91306594.2

申请日：1991-07-19

Applicant: NORTHERN TELECOM LIMITED

Inventor： Barnhouse, Robert L. ,  Estes, H. Scott

IPC: H05K3/42

CPC classification number: H05K3/403 ,  H05K3/0047 ,  H05K3/043 ,  H05K3/061 ,  H05K3/108 ,  H05K3/308 ,  H05K3/427 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/10295 ,  H05K2201/10893 ,  H05K2203/0557

Abstract: A printed circuit board having holes provided with two or more electrical conductors (16,34) on the surface of each hole. The conductors are circumferentially spaced apart around each hole so as to electrically isolate them from one another and each conductor is connected to an individual circuit line of the board. The conductors may be through-hole conductors. Alternatively, the holes are pin receiving holes for insertion of pins having two or more conductor lines for electrical contact with the conductors within the holes.

Abstract translation: 一种印刷电路板，具有在每个孔的表面上设置有两个或多个电导体（16,34）的孔。 导体围绕每个孔周向间隔开，以便将它们彼此电隔离，并且每个导体连接到板的单独电路线。 导体可以是通孔导体。 或者，孔是用于插入具有两个或更多个导线的销的销接收孔，用于与孔内的导体电接触。

公开(公告)号：EP0333237A3

公开(公告)日：1990-03-21

申请号：EP89109818.8

申请日：1985-05-16

Applicant: BRITISH TELECOMMUNICATIONS public limited company

Inventor： Whitehead, Graham Keith ,  Taylor, Kenneth

IPC: H01L23/50 ,  H01L23/12

CPC classification number: H05K3/3442 ,  H01L23/057 ,  H01L23/13 ,  H01L23/145 ,  H01L23/3677 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/244 ,  H05K3/403 ,  H05K3/42 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/09181 ,  H05K2201/09709 ,  H05K2201/10727 ,  H05K2201/10909 ,  H05K2203/0723 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00

Abstract: A chip carrier produced by injection moulding from an aromatic thermoplastic polymer has a relief pattern in a die attachment site (8). The relief pattern isolates an attached die from the thermally induced strains when the carrier is attached to a circuit board. In further features, the chip carrier includes a body (1) having a central region and sidewalls (3) connected to the central region by an elastically deformable region (33), in order to further reduce thermal strains. Also for the same reason a heat sink (41) may be attached underneath the carrier below the carrier's die attachment site (8) and thermally conductive material (40, 42) may connect them together. The heat sink may be used for mechanical anchorage.

Abstract translation: 通过从芳香族热塑性聚合物注塑制造的芯片载体在芯片附着部位（8）具有浮雕图案。 当载体附接到电路板时，浮雕图案将附着的模具与热诱导应变隔离。 在另外的特征中，芯片载体包括具有中心区域的主体（1）和通过可弹性变形区域（33）连接到中心区域的侧壁（3），以便进一步减少热应变。 同样的原因，散热器（41）可以在载体下方的载体的芯片附接位置（8）下方附接，并且导热材料（40,42）可以将它们连接在一起。 散热器可用于机械锚固。