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    Circuitized structure including flexible circuit with elastomeric member bonded thereto and method of making
    31.
    发明公开
    Circuitized structure including flexible circuit with elastomeric member bonded thereto and method of making 失效
    电路结构包括具有弹性部分的复合柔性电路及其制造方法。

    公开(公告)号：EP0675569A1

    公开(公告)日：1995-10-04

    申请号：EP95101138.6

    申请日：1995-01-27

    Applicant: International Business Machines Corporation

    Inventor： Brodsky, William Louis ,  Herard, James Daniel ,  Macek, Thomas George ,  Sharp, Timothy Lee ,  Shovlowsky, George Joseph

    IPC: H01R13/24

    CPC classification number: H01R13/2414 ,  H01R12/62 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/325 ,  H05K3/361 ,  H05K3/365 ,  H05K2201/0133 ,  H05K2201/09045 ,  Y10T29/49126

    Abstract: A circuitized structure including a flexible circuit (51) with at least one layer (53) of dielectric having a plurality of electrically conductive members (e.g., copper pads (13)) thereon. An elastomeric member (41) including a plurality of upstanding portions (47) each having a respective metallic pad member thereon is utilized, this elastomeric-pad structure being bonded to the flexible circuit at locations relative to respective ones of the conductive members so as to assure substantially independent force exertion thereon, e.g., when the flexible circuit (51) is electrically coupled to a separate, circuitized substrate such as a printed circuit board. A method for making an elastomeric support member for use in such a circuitized substrate is also provided.

    Abstract translation: 电路化结构包括柔性电路（51）与电介质具有导电构件（例如，铜焊盘（13））在其上的多个至少一个层（53）。 在弹性构件（41）包括直立部分的多个（47）每个都具有在其上的金属respectivement垫构件被利用，此弹性垫结构被结合到所述柔性电路在相对于respectivement导电性部件中的一些，以便位置 基本上保证独立施力于其上，例如，当柔性电路（51）被电耦合到一个单独的电路化衬底：诸如印刷电路板。 因此，提供一种用于制造在弹性支撑构件用于在寻求一种电路化衬底的方法。

    WIRING BODY, WIRING SUBSTRATE, AND TOUCH SENSOR
    33.
    发明公开
    WIRING BODY, WIRING SUBSTRATE, AND TOUCH SENSOR 审中-公开

    公开(公告)号：EP3177117A4

    公开(公告)日：2017-12-20

    申请号：EP16743575

    申请日：2016-01-29

    Applicant: FUJIKURA LTD

    Inventor： MURAKAMI MAKOTO

    IPC: H05K3/20 ,  G06F3/041 ,  H05K3/38

    CPC classification number: G06F3/041 ,  G06F3/044 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K3/20 ,  H05K3/207 ,  H05K2201/09045 ,  H05K2201/09681 ,  H05K2203/0502

    Abstract: A wiring body (2) includes a conductive portion (5) including a contact surface (51) having a concave-convex shape including a concave portion (511) and a convex portion (512) in a section view in a longitudinal direction, and a top surface (52) facing the contact surface (51), and containing at least conductive particles (CP), and an adhesive layer (4) formed by being stacked on the contact surface (51). The adhesive layer (4) includes a smooth portion (41) provided at a substantially constant thickness and having a substantially smooth main surface (411), and a protrusion (42) provided on the smooth portion (41) to correspond to the conductive portion (5) and protruding from the main surface (411) toward a side of the conductive portion (5), the protrusion (42) comes into contact with the contact surface (51) and includes a concave-convex surface complementary to the concave-convex shape of the contact surface (51), the contact surface (51) is positioned on a side of the top surface (52) with respect to the main surface (411), and the following Formula (1) is satisfied. L 1 > L 2 ... (1). In the above Formula (1), L 1 denotes a unit length of the contact surface (51) in the section view in the longitudinal direction, and L 2 denotes a unit length of the top surface (52) in the section view in the longitudinal direction.

    WIRING BODY, WIRING SUBSTRATE, TOUCH SENSOR, AND WIRING BODY MANUFACTURING METHOD
    35.
    发明公开
    WIRING BODY, WIRING SUBSTRATE, TOUCH SENSOR, AND WIRING BODY MANUFACTURING METHOD 审中-公开
    电路体，电路基板上，触摸和生产电路身体的方法

    公开(公告)号：EP3176682A1

    公开(公告)日：2017-06-07

    申请号：EP16746575.6

    申请日：2016-02-01

    Applicant: Fujikura, Ltd.

    Inventor： SHIOJIRI, Takeshi ,  HONDO, Takaharu

    IPC: G06F3/044 ,  G06F3/041

    CPC classification number: G06F3/044 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0313 ,  H05K3/10 ,  H05K3/28 ,  H05K2201/09045 ,  H05K2201/09827 ,  H05K2201/10151

    Abstract: A wiring body (3) includes a first conductor layer (32) including a first conductor wire (322), a resin layer (33) covering the first conductor layer, and a second conductor layer (34) disposed on the first conductor layer through the resin layer and including a second conductor wire (342), and satisfies Formula (1) described below. H 1 − H 2 T 1 / 3
    Here, in Formula (1) described above, H 1 is a maximum height of the second conductor wire in a first region (E1) corresponding to the first conductor wire in a first predetermined sectional surface crossing the wiring body along the second conductor wire, H 2 is a minimum height of the second conductor wire in a second region (E2) which is adjacent to the first region and has the same width as that of the first region in the first predetermined sectional surface, and T 1 is a thickness of the first conductor wire in the first predetermined sectional surface.

    Abstract translation: 一种布线体（3）包括：包括第一导线（322），覆盖所述第一导体层的树脂层（33），以及设置在第一导体层上的第二导体层（34）通过第一导体层（32） 树脂层和包括下面描述的第二导线（342）和SATIS外资企业式（1）。 H 1“H 2

    WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SAME
    38.
    发明公开
    WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SAME 有权
    接线基板，多片接线基板及其制造方法

    公开(公告)号：EP2704537A1

    公开(公告)日：2014-03-05

    申请号：EP12777596.3

    申请日：2012-02-01

    Applicant: NGK Spark Plug Co., Ltd.

    Inventor： HASEGAWA, Masami ,  HIRAYAMA, Satoshi ,  KITO, Naoki

    IPC: H05K1/02 ,  H05K3/00 ,  H01L23/12

    CPC classification number: H05K1/0306 ,  C04B41/0036 ,  H01L23/10 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2224/97 ,  H01L2924/0002 ,  H05K1/14 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/403 ,  H05K2201/017 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/0909 ,  H05K2201/09154 ,  H01L2924/00

    Abstract: Provided are a wiring substrate including a substrate main body and a metalized layer provided on the front surface of the substrate main body so as to extend along side surfaces thereof, in which a plating film and a brazing material layer covering the surface of the metalized layer are not damaged; a multi-piece wiring substrate array for simultaneously providing a plurality of the wiring substrates; and a method for producing the multi-piece wiring substrate array.
    The wiring substrate 1a includes a substrate main body 2 which is formed of a ceramic laminate S and has a rectangular shape in plan view, and which has a front surface 3 and a back surface 4 and has four side surfaces 5, each being located between the front surface 3 and the back surface 4, and having a groove surface 7 located on a side toward the front surface 3 and a fracture surface 6 located on a side toward the back surface 4; and a metalized layer 11 which is formed on the front surface 3 of the substrate main body 2 so as to extend along the four side surfaces 5, and which has a rectangular frame shape in plan view, wherein a horizontal surface 13 of the ceramic laminate S of the substrate main body 2 is exposed between the metalized layer 11 and the groove surface 7 of each side surface 5 of the substrate main body 2.

    Abstract translation: 本发明提供一种配线基板，其包括基板主体和设置在该基板主体的前表面上的金属化层，以沿着其侧表面延伸，其中镀覆膜和覆盖该金属化层的表面的钎焊材料层 没有损坏; 多片布线基板阵列，用于同时提供多个布线基板; 以及制造该多件式布线基板阵列的方法。 布线基板1a包括：由陶瓷层叠体S形成的俯视呈矩形形状的基板主体2，其具有前表面3和后表面4，并具有四个侧表面5，每个侧表面位于 前表面3和后表面4，并且具有位于前表面3一侧的凹槽表面7和位于背表面4一侧的断裂表面6; 以及在基板主体2的表面3上沿着四个侧面5延伸而形成的俯视矩形框状的金属化层11，其中，陶瓷层叠体的水平面13 基板主体2的S在金属化层11与基板主体2的各侧面5的槽面7之间露出。

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