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    IMPREGNATED GLASS FIBER STRANDS AND PRODUCTS INCLUDING THE SAME
    71.
    发明公开
    IMPREGNATED GLASS FIBER STRANDS AND PRODUCTS INCLUDING THE SAME 审中-公开
    浸渍玻璃自旋纱线及制品含有它的

    公开(公告)号：EP1204613A1

    公开(公告)日：2002-05-15

    申请号：EP00948977.4

    申请日：2000-07-28

    Applicant: PPG Industries Ohio, Inc.

    Inventor： NOVICH, Bruce, E. ,  LAMMON-HILINSKI, Kami ,  ROBERTSON, Walter, J. ,  WU, Xiang ,  VELPARI, Vedagiri ,  LAWTON, Ernest, L. ,  RICE, William, B.

    IPC: C03C25/10 ,  C08J5/08 ,  H05K1/03

    CPC classification number: C03C25/00 ,  C03C25/10 ,  C03C25/47 ,  C03C25/48 ,  C08J5/08 ,  H05K1/0366 ,  H05K3/0047 ,  H05K2201/0166 ,  H05K2201/0175 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0239 ,  H05K2201/0245 ,  H05K2201/0254 ,  H05K2201/029 ,  H05K2203/127

    Abstract: The present invention provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and lamellar particles having a thermal conductivity of at least 1 Watt per meter K at a temperature of 300K. The present invention also provides an at least partially coated fiber strand comprising a plurality of fibers, the coating comprising an organic component and non-hydratable, lamellar particles. The present invention further provides an at least partially coated fiber strand comprising a plurality of fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said fibers, the resin compatible coating composition comprising: (a) a plurality of discrete particles formed from materials selected from non-heat expandable organic materials, inorganic polymeric materials, non-heat expandable composite materials and mixtures thereof, the particles having an average particle size sufficient to allow strand wet out; (b) at least one lubricious material different from said plurality of discrete particles; and (c) at least one film-forming material. The present invention also provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of lamellar, inorganic particles having a Mohs' hardness value which does not exceed the Mohs' hardness value of said glass fibers; and (b) at least one polymeric material. The present invention further provides an at least partially coated fiber strand comprising a plurality of glass fibers having a resin compatible coating composition on at least a portion of a surface of at least one of said glass fibers, the resin compatible coating composition comprising: (a) a plurality of hollow, non-heat expandable organic particles; and (b) at least one lubricious material different from the at least one hollow organic particle.

    Epoxy adhesives and copper foils and copper clad laminates using same
    74.
    发明公开
    Epoxy adhesives and copper foils and copper clad laminates using same 失效
    Epoxidharzklebstoffe und damit hergestellte Kupferfolien und kupferkaschierte Schichtstoffplatten。

    公开(公告)号：EP0676435A1

    公开(公告)日：1995-10-11

    申请号：EP95302049.2

    申请日：1995-03-28

    Applicant: GOULD ELECTRONICS INC.

    Inventor： Poutasse, Charles A. ,  Kovacs, Adrea M. ,  Sack, Katherine V. ,  Winchester, James R.

    IPC: C08G59/18 ,  H05K3/38

    CPC classification number: H05K3/384 ,  C08G59/18 ,  C09J163/00 ,  H05K3/022 ,  H05K3/385 ,  H05K3/386 ,  H05K3/389 ,  H05K2201/0239 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0315 ,  H05K2203/0723 ,  Y10T428/12076 ,  Y10T428/12181 ,  Y10T428/12347 ,  Y10T428/12493 ,  Y10T428/12569 ,  Y10T428/12681 ,  Y10T428/12687 ,  Y10T428/12694 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/31522 ,  Y10T428/31529 ,  Y10T428/31678

    Abstract: This invention relates to an adhesive composition, comprising: (A) at least one multifictional epoxy; and (B) the composition derived from (B-1) at least one difunctional epoxy resin and (B-2) at least one compound represented by the formula

            R-(G) n    (I)


    wherein in Formula (I): R is an aromatic, alicyclic or heterocyclic group; G is a functional group selected from the group consisting of COOH, OH, SH, NH₂, NHR¹, (NHC(=NH)) m NH₂, R²COOH, R²OH, R²SH, R²NH₂ and R²NHR¹, wherein R¹ is a hydrocarbon group, R² is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; and n is a number ranging from 3 up to the number of displaceable hydrogens on R; with the proviso that when at least one G is NH₂ or R²NH₂, n is a number ranging from 2 up to the number of displaceable hydrogens on R, and when at least one G is (NHC(=NH)) m NH₂, n is a number ranging from 1 up to the number of displaceable hydrogens on R. The invention also relates to copper foils having the foregoing adhesive composition adhered to at least one side thereof to enhance the adhesion between said foils and dielectric substrates. The invention also relates to laminates comprising copper foil, a dielectric substrate, and an adhesion-promoting layer comprising the foregoing adhesive composition disposed between and adhered to the foil and the substrate.

    Abstract translation: 本发明涉及粘合剂组合物，其包含：（A）至少一种多环氧树脂; 和（B）衍生自（B-1）至少一种双官能环氧树脂的组合物和（B-2）至少一种由式R-（G）n（I）表示的化合物，其中在式（I）中：R 是芳族，脂环族或杂环基; G是选自COOH，OH，SH，NH 2，NHR 1，（NHC（= NH））m NH 2，R 2 COOH，R 2 OH，R 2 SH ，R 2 NH 2和R 2 NHR 1，其中R 1是烃基，R 2是亚烷基或亚烷基，m是1至约4的数; 并且n是从3到R上的可置换氢的数目的数字; 条件是当至少一个G是NH 2或R 2 NH 2时，n是在R上至2个直到可置换氢数的数目，当至少一个G是（NHC（= NH））m NH 2 n为1以上的可移位氢数R上的数字。本发明还涉及具有粘附到其至少一侧上的粘合剂组合物的铜箔，以增强所述箔和电介质基底之间的粘合性。 本发明还涉及包括铜箔，电介质基底和包含上述粘合剂组合物的粘合促进层的层压体，所述粘合剂组合物设置在箔和衬底之间并粘附到箔和衬底上。

    Printed circuits and base materials precatalyzed for etal deposition
    78.
    发明公开
    Printed circuits and base materials precatalyzed for etal deposition 失效
    Gedruckte Schaltungen und Basismaterialienfürmetallische Ablagerung。

    公开(公告)号：EP0460548A2

    公开(公告)日：1991-12-11

    申请号：EP91108947.2

    申请日：1991-05-31

    Applicant: AMP-AKZO CORPORATION

    Inventor： Kohm, Thomas S.

    IPC: C23C18/20 ,  H05K1/03 ,  H05K3/18

    CPC classification number: H05K1/0373 ,  C23C18/206 ,  C23C18/30 ,  H05K3/181 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0239 ,  H05K2201/0245

    Abstract: The invention relates to a polymeric base material which is catalytic for metal deposition. The base material comprises a first catalyst comprising a particulate silicate filler dispersed in the polymeric base material and an aromatic moiety having a hydroxyl substituent dissolved in or attached to the polymers of the polymeric base material. The polymeric base material optionally includes a second catalyst for metal deposition selected from the group of noble metals and noble metal compounds. In one aspect, the base material is a laminate comprised of glass cloth prepregs. The impregnating varnish comprises an epoxy resin, a silicate filler, and a curing agent for the epoxy resin, the curing agent being selected from the group consisting of phenolic resins and aromatic compounds having at least one hydroxyl group on the aromatic ring and mixtures of such curing agents.
    In yet another aspect, the invention comprises printed wiring boards having plated-through holes produced on the above base materials. The walls of the plated-through holes are plated with a copper deposit in which the sum of the thermal expansion and the strain at the elastic limit is approximately the same as the thermal expansion of the thickness of the base material.

    Abstract translation: 本发明涉及一种催化金属沉积的聚合物基材。 基础材料包括第一催化剂，其包含分散在聚合物基体材料中的颗粒状硅酸盐填料和具有溶解在聚合物基材的聚合物中或连接到聚合物基材的聚合物上的羟基取代基的芳族部分。 聚合物基材任选地包括选自贵金属和贵金属化合物的用于金属沉积的第二催化剂。 一方面，基材是由玻璃布预浸料制成的层压体。 浸渍清漆包括环氧树脂，硅酸盐填料和用于环氧树脂的固化剂，所述固化剂选自酚醛树脂和芳族环上具有至少一个羟基的芳族化合物，以及其混合物 固化剂。 在另一方面，本发明包括在上述基材上制造的具有电镀通孔的印刷线路板。 电镀通孔的壁镀有铜沉积物，其中弹性极限处的热膨胀和应变之和与基材厚度的热膨胀大致相同。

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