-
公开(公告)号：TWI604539B
公开(公告)日：2017-11-01
申请号：TW104127107
申请日：2015-08-20
发明人： 盧東寶 , LU, TUNG BAO , 王恆生 , WANG, HENG SHENG , 徐子涵 , HSU, TZU HAN
IPC分类号： H01L21/60 , H01L23/488 , B23K1/00
CPC分类号： H01L24/11 , C23C18/1653 , C25D3/60 , C25D3/62 , C25D5/02 , C25D5/505 , C25D7/123 , G02F1/1333 , H01L21/324 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/742 , H01L24/81 , H01L24/83 , H01L24/92 , H01L33/62 , H01L2224/0345 , H01L2224/03452 , H01L2224/03462 , H01L2224/03464 , H01L2224/05139 , H01L2224/05144 , H01L2224/05155 , H01L2224/05164 , H01L2224/05166 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/06102 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/1147 , H01L2224/11849 , H01L2224/13006 , H01L2224/13007 , H01L2224/13013 , H01L2224/13014 , H01L2224/1308 , H01L2224/13082 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/1403 , H01L2224/14051 , H01L2224/16227 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81203 , H01L2224/81447 , H01L2224/81815 , H01L2224/83104 , H01L2224/92125 , H01L2924/00015 , H01L2924/01029 , H01L2924/01047 , H01L2924/01079 , H01L2924/014 , H01L2924/12041 , H01L2924/20107 , H01L2924/20108 , H01L2924/2064 , H01L2924/351 , H01L2924/0105 , H01L2224/48 , H01L2924/00014 , H01L2924/01074 , H01L2924/00012 , H01L2224/81411 , H01L2924/0665
-
公开(公告)号：TWI563614B
公开(公告)日：2016-12-21
申请号：TW103145294
申请日：2014-12-24
发明人： 黃文濬 , HUANG, WENCHUN , 李建成 , LI, CHIENCHEN , 劉國洲 , LIU, KUOCHIO , 薛瑞雲 , SHIUE, RUEYYUN , 鄭錫圭 , CHENG, HSIKUEI , 林志賢 , LIN, CHIHHSIEN , 林俊成 , LIN, JINGCHENG , 陸湘台 , LU, HSIANGTAI , 謝子逸 , SHIEH, TZIYI
CPC分类号： H01L21/565 , H01L21/486 , H01L21/56 , H01L21/561 , H01L21/563 , H01L21/6835 , H01L21/6836 , H01L23/145 , H01L23/147 , H01L23/28 , H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3114 , H01L23/3128 , H01L23/3135 , H01L23/36 , H01L23/49816 , H01L23/49827 , H01L23/5329 , H01L23/5384 , H01L23/60 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68327 , H01L2221/6834 , H01L2224/0345 , H01L2224/03452 , H01L2224/0401 , H01L2224/0557 , H01L2224/05573 , H01L2224/05583 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05666 , H01L2224/05671 , H01L2224/05684 , H01L2224/06181 , H01L2224/11002 , H01L2224/1132 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/73204 , H01L2224/73253 , H01L2224/81192 , H01L2224/81815 , H01L2224/81895 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/94 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06589 , H01L2924/10252 , H01L2924/10253 , H01L2924/10254 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/10333 , H01L2924/10335 , H01L2924/10342 , H01L2924/12042 , H01L2924/1431 , H01L2924/1432 , H01L2924/1434 , H01L2924/15311 , H01L2924/157 , H01L2924/1579 , H01L2924/181 , H01L2924/18161 , H01L2924/00 , H01L2224/11 , H01L2224/03 , H01L2924/00012
-
公开(公告)号：TWI545709B
公开(公告)日：2016-08-11
申请号：TW102113240
申请日：2013-04-15
发明人： 沈更新 , SHEN, GENG SHIN
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L21/4853 , H01L24/11 , H01L24/13 , H01L2224/03912 , H01L2224/0401 , H01L2224/05027 , H01L2224/05166 , H01L2224/05572 , H01L2224/05582 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11318 , H01L2224/1132 , H01L2224/11332 , H01L2224/11334 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/1147 , H01L2224/11849 , H01L2224/13082 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2924/00014 , H01L2924/01074 , H01L2224/05552
-
公开(公告)号：TW201604979A
公开(公告)日：2016-02-01
申请号：TW103125555
申请日：2014-07-25
发明人： 吳非艱 , WU, FEI JAIN , 廖蒼生 , LIAO, TSANG SHENG , 黃靜怡 , HUANG, CHING YI , 李俊德 , LEE, CHUN TE
IPC分类号： H01L21/60
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/03912 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/1147 , H01L2224/11848 , H01L2224/13005 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16237 , H01L2924/01028 , H01L2924/01029 , H01L2924/35 , H01L2924/00014 , H01L2924/01082 , H01L2924/00012 , H01L2924/206
摘要： 一種具有凸塊的基板製造方法，在一半導體基板上形成至少一銅層後，藉由控制形成於該銅層上的一鎳層厚度，以使該銅層與該鎳層所組成的一凸塊結構在退火後，該凸塊結構的硬度可符合要求，以避免該具有凸塊的基板覆晶結合於一玻璃基板時，造成該玻璃基板的破裂。
简体摘要： 一种具有凸块的基板制造方法，在一半导体基板上形成至少一铜层后，借由控制形成于该铜层上的一镍层厚度，以使该铜层与该镍层所组成的一凸块结构在退火后，该凸块结构的硬度可符合要求，以避免该具有凸块的基板覆晶结合于一玻璃基板时，造成该玻璃基板的破裂。
-
公开(公告)号：TW201539687A
公开(公告)日：2015-10-16
申请号：TW103145404
申请日：2014-12-25
发明人： 李立國 , LEE, LI GUO , 劉宜臻 , LIU, YI CHEN , 劉永盛 , LIU, YUNG SHENG , 賴怡仁 , LAI, YI JEN , 陳俊仁 , CHEN, CHUN JEN , 鄭錫圭 , CHENG, HSI KUEI
IPC分类号： H01L23/488 , H01L23/522
CPC分类号： H01L24/13 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/81 , H01L2224/0345 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05022 , H01L2224/05023 , H01L2224/05124 , H01L2224/05139 , H01L2224/05147 , H01L2224/05184 , H01L2224/05556 , H01L2224/05568 , H01L2224/05572 , H01L2224/05647 , H01L2224/05666 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/1147 , H01L2224/13007 , H01L2224/13021 , H01L2224/13023 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13139 , H01L2224/13147 , H01L2224/81191 , H01L2224/81815 , H01L2924/00012 , H01L2924/13091 , H01L2924/00014 , H01L2924/014 , H01L2924/01073 , H01L2924/01049 , H01L2924/0105 , H01L2924/0103 , H01L2924/01025 , H01L2924/01024 , H01L2924/01022 , H01L2924/01032 , H01L2924/01038 , H01L2924/01078 , H01L2924/01012 , H01L2924/01013 , H01L2924/0104 , H01L2924/013 , H01L2924/00013 , H01L2924/01074 , H01L2924/01029 , H01L2924/01047 , H01L2924/01028 , H01L2924/01079 , H01L2924/00
摘要： 在實施例中提供一種半導體結構及其形成方法。半導體結構包括第一基板及金屬墊形成在第一基板上。半導體結構還包括晶種層形成在金屬墊上及導體柱形成在晶種層上。此外，晶種層具有側壁及底表面，且晶種層的側壁及底表面之間的角度介於約20度至約90度。
简体摘要： 在实施例中提供一种半导体结构及其形成方法。半导体结构包括第一基板及金属垫形成在第一基板上。半导体结构还包括晶种层形成在金属垫上及导体柱形成在晶种层上。此外，晶种层具有侧壁及底表面，且晶种层的侧壁及底表面之间的角度介于约20度至约90度。
-
公开(公告)号：TW201539684A
公开(公告)日：2015-10-16
申请号：TW103145157
申请日：2014-12-24
发明人： 李立國 , LEE, LI GUO , 劉永盛 , LIU, YUNG SHENG , 劉宜臻 , LIU, YI CHEN , 賴怡仁 , LAI, YI JEN , 陳俊仁 , CHEN, CHUN JEN , 鄭錫圭 , CHENG, HSI KUEI
IPC分类号： H01L23/48 , H01L23/488
CPC分类号： H01L21/563 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/0345 , H01L2224/03452 , H01L2224/0362 , H01L2224/03912 , H01L2224/0401 , H01L2224/05016 , H01L2224/05023 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05558 , H01L2224/05562 , H01L2224/05564 , H01L2224/05568 , H01L2224/0558 , H01L2224/05655 , H01L2224/05666 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/1147 , H01L2224/11849 , H01L2224/13006 , H01L2224/13111 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13166 , H01L2224/13169 , H01L2224/1607 , H01L2224/16238 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/92125 , H01L2924/13091 , H01L2924/00 , H01L2924/00012 , H01L2924/00014 , H01L2924/01029 , H01L2924/01074 , H01L2924/014
摘要： 提供了封裝結構及製作方法。封裝結構包括半導體基底及半導體基底上之第一導電構件。封裝結構還包括基底及基底上之第二導電構件。第二導電構件透過接合結構而與第一導電構件接合。封裝結構更包括圍繞接合結構之保護材料，且保護材料直接接觸第一導電構件之側表面。
简体摘要： 提供了封装结构及制作方法。封装结构包括半导体基底及半导体基底上之第一导电构件。封装结构还包括基底及基底上之第二导电构件。第二导电构件透过接合结构而与第一导电构件接合。封装结构更包括围绕接合结构之保护材料，且保护材料直接接触第一导电构件之侧表面。
-
公开(公告)号：TWI488244B
公开(公告)日：2015-06-11
申请号：TW103125555
申请日：2014-07-25
发明人： 吳非艱 , WU, FEI JAIN , 廖蒼生 , LIAO, TSANG SHENG , 黃靜怡 , HUANG, CHING YI , 李俊德 , LEE, CHUN TE
IPC分类号： H01L21/60
CPC分类号： H01L24/11 , H01L24/13 , H01L2224/03912 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/1145 , H01L2224/11452 , H01L2224/1146 , H01L2224/1147 , H01L2224/11848 , H01L2224/13005 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16237 , H01L2924/01028 , H01L2924/01029 , H01L2924/35 , H01L2924/00014 , H01L2924/01082 , H01L2924/00012 , H01L2924/206
-
公开(公告)号：TWI479624B
公开(公告)日：2015-04-01
申请号：TW103115385
申请日：2011-07-07
发明人： 吳偉誠 , WU, WEICHENG , 侯上勇 , HOU, SHANGYUN , 鄭心圃 , JENG, SHINPUU , 劉醇鴻 , LIU, TZUANHORNG , 邱志威 , CHIU, TZUWEI , 史朝文 , SHIH, CHAOWEN
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L24/11 , H01L23/3114 , H01L23/3157 , H01L23/525 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/02126 , H01L2224/0235 , H01L2224/0345 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05005 , H01L2224/05008 , H01L2224/05012 , H01L2224/05014 , H01L2224/05015 , H01L2224/05018 , H01L2224/05022 , H01L2224/05027 , H01L2224/05166 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05558 , H01L2224/05559 , H01L2224/05562 , H01L2224/05572 , H01L2224/05573 , H01L2224/05582 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/05687 , H01L2224/06131 , H01L2224/10126 , H01L2224/1132 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/11912 , H01L2224/1308 , H01L2224/13083 , H01L2224/13109 , H01L2224/13111 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/94 , H01L2924/00014 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/35 , H01L2924/3512 , H01L2924/35121 , H01L2224/03 , H01L2224/11 , H01L2924/04941 , H01L2924/04953 , H01L2924/01028 , H01L2924/01022 , H01L2924/01083 , H01L2924/01051 , H01L2924/00 , H01L2224/05552
-
公开(公告)号：TWI464849B
公开(公告)日：2014-12-11
申请号：TW099137918
申请日：2010-11-04
发明人： 沈政宏 , SHEN, CHENG HUNG , 郭庭豪 , KUO, TIN HAO , 郭正錚 , KUO, CHEN CHENG , 陳承先 , CHEN, CHEN SHIEN , 莊曜群 , CHUANG, YAO CHUN
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L23/3171 , H01L23/3192 , H01L23/49811 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0345 , H01L2224/03452 , H01L2224/03912 , H01L2224/0401 , H01L2224/05073 , H01L2224/05166 , H01L2224/05647 , H01L2224/05666 , H01L2224/05681 , H01L2224/11444 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/1147 , H01L2224/13012 , H01L2224/13014 , H01L2224/13015 , H01L2224/13099 , H01L2224/13111 , H01L2224/13116 , H01L2224/13124 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/1403 , H01L2224/14051 , H01L2224/14131 , H01L2224/14179 , H01L2224/14515 , H01L2224/14517 , H01L2224/16145 , H01L2224/16225 , H01L2224/17051 , H01L2224/17517 , H01L2224/29011 , H01L2224/29013 , H01L2224/29101 , H01L2224/29111 , H01L2224/81191 , H01L2224/81193 , H01L2224/81815 , H01L2224/83193 , H01L2225/06513 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/01007 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
-
公开(公告)号：TWI449140B
公开(公告)日：2014-08-11
申请号：TW099136673
申请日：2010-10-27
发明人： 黃見翎 , HWANG, CHIEN LING , 蔡惠榕 , TSAI, HUI JUNG , 吳逸文 , WU, YI WEM , 劉重希 , LIU, CHUNG SHI
IPC分类号： H01L23/488
CPC分类号： H01L21/7688 , C23C14/34 , C25D5/022 , C25D7/00 , H01L21/76879 , H01L21/76883 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L2224/0361 , H01L2224/03826 , H01L2224/03831 , H01L2224/03912 , H01L2224/0401 , H01L2224/05166 , H01L2224/05181 , H01L2224/05572 , H01L2224/05647 , H01L2224/10126 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11622 , H01L2224/13147 , H01L2224/1354 , H01L2224/13565 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/81024 , H01L2224/81193 , H01L2224/81447 , H01L2224/81815 , H01L2224/81911 , H01L2225/06513 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/00 , H01L2224/05552
-
-
-
-
-
-
-
-
-
搜索结果
68 条记录 (耗时 0.014 秒)
