公开(公告)号：US07704880B1

公开(公告)日：2010-04-27

申请号：US12190082

申请日：2008-08-12

Applicant: Cyprian E. Uzoh ,  Bulent M. Basol ,  Hung-Ming Wang ,  Homayoun Talieh

Inventor： Cyprian E. Uzoh ,  Bulent M. Basol ,  Hung-Ming Wang ,  Homayoun Talieh

IPC: H01L21/44

CPC classification number: H01L21/2885 ,  C25D5/02 ,  C25D7/123 ,  C25D17/005

Abstract: A method is provided for manufacturing removable contact structures on the surface of a substrate to conduct electricity from a contact member to the surface during electroprocessing. The method comprises forming a conductive layer on the surface. A predetermined region of the conductive layer is selectively coated by a contact layer so that the contact member touches the contact layer as the electroprocessing is performed on the conductive layer.

Abstract translation: 提供了一种用于在基板的表面上制造可移除接触结构以在电加工期间将电从接触构件传导到表面的方法。 该方法包括在表面上形成导电层。 导电层的预定区域被接触层选择性地涂覆，使得当在导电层上进行电处理时，接触构件接触接触层。

公开(公告)号：US07098074B2

公开(公告)日：2006-08-29

申请号：US10699328

申请日：2003-10-31

Applicant: Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John W. Smith

Inventor： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John W. Smith

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/10 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05124

Abstract: A method is disclosed for making a microelectronic package. A material is applied to a first major surface of a microelectronic element to reduce the heights of protrusions projecting from the first major surface. The microelectronic element is assembled to a microelectronic component. A method of forming protrusions and an assembly incorporating the microelectronic element having protrusions is also disclosed.

Abstract translation: 公开了一种制造微电子封装的方法。 将材料施加到微电子元件的第一主表面以减小从第一主表面突出的突起的高度。 微电子元件组装到微电子元件上。 还公开了一种形成突起的方法和包括具有突起的微电子元件的组件。

公开(公告)号：US07257893B2

公开(公告)日：2007-08-21

申请号：US11447368

申请日：2006-06-05

Applicant: Hung-Ming Wang ,  Bulent M. Basol ,  Homayoun Talieh

Inventor： Hung-Ming Wang ,  Bulent M. Basol ,  Homayoun Talieh

IPC: H01K3/10

CPC classification number: H01L21/76877 ,  H01L21/2885 ,  H01L21/7684 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Consistent excess conductive material is provided for plated conductors in integrated circuit metallization, regardless of the size and depth of trenches/vias into which the conductive material is deposited. Accordingly, subsequent processing (e.g., material removal) can be consistent and efficient for wafers with different feature sizes (particularly different depths), and for wafers at different metallization levels.

Abstract translation: 为集成电路金属化中的电镀导体提供一致的过量导电材料，而不管沉积导电材料的沟槽/通孔的尺寸和深度。 因此，对于具有不同特征尺寸（特别是不同深度）的晶片以及对于不同金属化水平的晶片，后续处理（例如，材料去除）可以是一致的和有效的。

公开(公告)号：US20060275951A1

公开(公告)日：2006-12-07

申请号：US11487880

申请日：2006-07-17

Applicant: Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John Smith

Inventor： Michael Warner ,  Masud Beroz ,  David Light ,  Delin Li ,  Dennis Castillo ,  Hung-ming Wang ,  John Smith

IPC: H01L21/00

CPC classification number: H01L24/10 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05124

Abstract: A microelectronic assembly includes a first microelectronic element having a first face and contacts accessible at the first face, and a layer of a dielectric material having a bottom surface contacting the first microelectronic element, a top surface facing away from the first microelectronic element and holes extending between the top and bottom faces in alignment with the contacts on the first microelectronic element. The assembly includes conductive protrusions extending through the holes to the contacts, the conductive protrusions projecting beyond the top surface of the dielectric layer. The assembly also has a second microelectronic element having a first surface with conductive elements being accessible at the first surface thereof, the second microelectronic element being assembled with the first microelectronic element so that the contacts of the second microelectronic element are connected with the conductive protrusions and the top surface of the dielectric layer is spaced from the first surface of the second microelectronic element.

Abstract translation: 微电子组件包括具有第一面和在第一面可接触的触点的第一微电子元件和具有接触第一微电子元件的底表面的电介质材料层，背离第一微电子元件的顶表面和延伸 在顶面和底面之间，与第一微电子元件上的触点对齐。 组件包括延伸穿过孔到触头的导电突起，导电突出部突出超过电介质层的顶表面。 组件还具有第二微电子元件，其具有第一表面，其导电元件在其第一表面处可访问，第二微电子元件与第一微电子元件组装，使得第二微电子元件的触点与导电突起连接， 电介质层的顶表面与第二微电子元件的第一表面间隔开。

公开(公告)号：US06465744B2

公开(公告)日：2002-10-15

申请号：US09277521

申请日：1999-03-26

Applicant: David R. Baker ,  Hung-Ming Wang

Inventor： David R. Baker ,  Hung-Ming Wang

IPC: H05K116

CPC classification number: H01L23/49572 ,  H01L23/3107 ,  H01L23/49582 ,  H01L24/01 ,  H01L2924/00014 ,  H01L2924/12042 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/4921 ,  Y10T428/12493 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24983 ,  H01L2224/45099 ,  H01L2924/00

Abstract: Flexible leads for making electrical connection in microelectronic components includes two metallic layers. The structural or core layer of the lead is formed having a hardness greater than the hardness of the second layer. The relative hardness between the first and second layers is achieved by controlling the grain size during deposition of the respective layers from an electroless or electroplating bath.

公开(公告)号：US20070066054A1

公开(公告)日：2007-03-22

申请号：US11232718

申请日：2005-09-21

Applicant: Cyprian Uzoh ,  Bulent Basol ,  Hung-Ming Wang ,  Homayoun Talieh

Inventor： Cyprian Uzoh ,  Bulent Basol ,  Hung-Ming Wang ,  Homayoun Talieh

IPC: H01L21/44

CPC classification number: H01L21/2885 ,  C25D5/02 ,  C25D7/123 ,  C25D17/005

Abstract: A method is provided for manufacturing removable contact structures on the surface of a substrate to conduct electricity from a contact member to the surface during electroprocessing. The method comprises forming a conductive layer on the surface. A predetermined region of the conductive layer is selectively coated by a contact layer so that the contact member touches the contact layer as the electroprocessing is performed on the conductive layer.

Abstract translation: 提供了一种用于在基板的表面上制造可移除接触结构以在电加工期间将电从接触构件传导到表面的方法。 该方法包括在表面上形成导电层。 导电层的预定区域被接触层选择性地涂覆，使得当在导电层上进行电处理时，接触构件接触接触层。

公开(公告)号：US20070050974A1

公开(公告)日：2007-03-08

申请号：US11447368

申请日：2006-06-05

Applicant: Hung-Ming Wang ,  Bulent Basol ,  Homayoun Talieh

Inventor： Hung-Ming Wang ,  Bulent Basol ,  Homayoun Talieh

IPC: H05K3/02

CPC classification number: H01L21/76877 ,  H01L21/2885 ,  H01L21/7684 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: Consistent excess conductive material is provided for plated conductors in integrated circuit metallization, regardless of the size and depth of trenches/vias into which the conductive material is deposited. Accordingly, subsequent processing (e.g., material removal) can be consistent and efficient for wafers with different feature sizes (particularly different depths), and for wafers at different metallization levels.

公开(公告)号：US06255723B1

公开(公告)日：2001-07-03

申请号：US09179273

申请日：1998-10-27

Applicant: David Light ,  John W. Smith ,  Thomas H. DiStefano ,  David R. Baker ,  Hung-Ming Wang

Inventor： David Light ,  John W. Smith ,  Thomas H. DiStefano ,  David R. Baker ,  Hung-Ming Wang

IPC: H01L23495

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327

Abstract: A layered lead is disclosed including a layer of structural material which has top and bottom sides, a layer of fatigue-resistant material on the top and bottom surfaces and a layer of bonding material covering the fatigue-resistant layer on the bottom surface for connection to a contact on a chip. An asymmetrical distribution of bonding material on the top and bottom sides may be used to provide reinforcement of the lead against stress. The fatigue-resistant material also acts as a barrier against diffusion between the metal layers.

Abstract translation: 公开了一种分层引线，其包括具有顶侧和底侧的结构材料层，在顶表面和底表面上的耐疲劳材料层，以及覆盖底表面上的抗疲劳层的接合材料层，用于连接到 芯片上的一个接触。 可以使用顶部和底部上的接合材料的不对称分布来提供引线抵抗应力的增强。 耐疲劳材料还用作阻挡金属层之间扩散的屏障。

公开(公告)号：US09680273B2

公开(公告)日：2017-06-13

申请号：US13843274

申请日：2013-03-15

Applicant: David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

Inventor： David Noel Light ,  Hung-Ming Wang ,  David Rodney Baker ,  Peter Tho Nguyen ,  Dexter Shih-Wei Pao

IPC: H01R43/16 ,  H01R12/70 ,  H01R12/73 ,  H01R12/71 ,  H01R13/24 ,  H05K3/28 ,  H05K3/40

CPC classification number: H01R43/16 ,  H01R12/7082 ,  H01R12/714 ,  H01R12/73 ,  H01R13/2407 ,  H01R13/2442 ,  H05K3/281 ,  H05K3/285 ,  H05K3/4015 ,  H05K2201/0116 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/2036 ,  Y10T29/49208

Abstract: Disclosed is an electrical connector having a substrate and movable electrical contacts which are mounted to the substrate and extend a distance D from the substrate. A layer of compressible material (such as a foam or elastomeric material) is positioned on the substrate adjacent at least some of the electrical contacts and ideally has an uncompressed thickness slightly greater than the distance D to provide for protection of the electrical contacts. When a mating electrical device such as an electrical connector or other circuit member is mated to the electrical connector with its electrical contacts and its layer of compressible material, the layer of compressible material is compressed to a thickness less than the distance D, allowing the contacts to make a suitable electrical interconnection to the mating electrical device. The compressible material may be selected which has a force-to-compression plot which includes at least one inflection, defining a first region on one side of the inflection where a given increment of force provides a larger increment of compression and a second region on the other side of the inflection where the same increment of compressive force provides a substantially smaller increment of compression. The compressible material can function to prevent damage to the movable electrical contacts from handling, packing, shipping, assembly, testing, connection and/or mating of the connector.

公开(公告)号：US20170077336A1

公开(公告)日：2017-03-16

申请号：US14852315

申请日：2015-09-11

Applicant: David D. Smith ,  Sung Dug Kim ,  Joseph Behnke ,  Hung-Ming Wang

Inventor： David D. Smith ,  Sung Dug Kim ,  Joseph Behnke ,  Hung-Ming Wang

IPC: H01L31/054 ,  H01L31/068 ,  H01L31/0224 ,  H01L31/18 ,  H01L31/048 ,  H01L31/0236

CPC classification number: H01L31/0547 ,  H01L31/022441 ,  H01L31/02366 ,  H01L31/048 ,  H01L31/0684 ,  H01L31/18 ,  Y02E10/52 ,  Y02E10/547

Abstract: A solar cell and a solar laminate are described. The solar cell can have a front side which faces the sun during normal operation and a back side opposite front side. The solar cell can include conductive contacts having substantially reflective outer regions disposed on the back side of the solar cell. The solar laminate can include a first encapsulant, the first encapsulant disposed on the back side of the solar cell and a second encapsulant. The solar laminate can include the solar cell laminated between the first and second encapsulant. The substantially reflective outer regions of the conductive contacts and the first encapsulant can be configured to scatter and/or diffuse light at the back side of the solar laminate for substantial light collection at the back side of the solar cell. Methods of fabricating the solar cell are also described herein.

Abstract translation: 描述了太阳能电池和太阳能层压板。 太阳能电池可以在正常操作期间具有面向太阳的前侧和与前侧相反的背面。 太阳能电池可以包括具有设置在太阳能电池的背面上的基本上反射的外部区域的导电触点。 太阳能层压板可以包括第一密封剂，设置在太阳能电池的背面上的第一密封剂和第二密封剂。 太阳能层压板可以包括层压在第一和第二密封剂之间的太阳能电池。 导电触点和第一密封剂的基本上反射的外部区域可以被配置为在太阳能电池层的背面散射和/或漫射光，以在太阳能电池的背面进行实质的光收集。 本文还描述了制造太阳能电池的方法。