公开(公告)号：US20210014429A1

公开(公告)日：2021-01-14

申请号：US17013287

申请日：2020-09-04

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Jukka Alasirnio ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  G03B37/04 ,  G03B35/08 ,  G03B15/05 ,  G03B17/12 ,  G02B13/00 ,  H04N5/225 ,  H04N5/33

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

公开(公告)号：US10741736B2

公开(公告)日：2020-08-11

申请号：US15473935

申请日：2017-03-30

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L31/0232 ,  H01L27/146 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00 ,  H01L33/58 ,  H01L51/52 ,  H01L51/56 ,  H01S5/00 ,  H01S5/02 ,  H01S5/183 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US10283542B2

公开(公告)日：2019-05-07

申请号：US15622813

申请日：2017-06-14

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Hartmut Rudmann ,  Mario Cesana ,  Jens Geiger ,  Peter Roentgen ,  Vincenzo Condorelli

IPC: H01L27/146

Abstract: Optoelectronic modules include a silicon substrate in which or on which there is an optoelectronic device. An optics assembly is disposed over the optoelectronic device, and a spacer separates the silicon substrate from the optics assembly. Methods of fabricating such modules also are described.

公开(公告)号：US11942580B2

公开(公告)日：2024-03-26

申请号：US17498105

申请日：2021-10-11

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L23/00 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54 ,  H01L33/58 ,  H01S5/02 ,  H01S5/183 ,  H10K50/84 ,  H10K50/858 ,  H10K71/00

CPC classification number: H01L33/56 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02164 ,  H01L31/02327 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01S5/02 ,  H01S5/183 ,  H10K50/84 ,  H10K50/858 ,  H10K71/00 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US10771714B2

公开(公告)日：2020-09-08

申请号：US15121459

申请日：2015-02-23

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Jukka Alasirniö ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  G03B37/04 ,  G03B35/08 ,  G03B15/05 ,  G03B17/12 ,  G02B13/00 ,  H04N5/225 ,  H04N5/33

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

公开(公告)号：US11575843B2

公开(公告)日：2023-02-07

申请号：US17013287

申请日：2020-09-04

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Jukka Alasirnio ,  Tobias Senn ,  Ohad Meitav ,  Moshe Doron ,  Alireza Yasan ,  Mario Cesana ,  Florin Cutu ,  Hartmut Rudmann ,  Markus Rossi ,  Peter Roentgen ,  Daniel Perez Calero ,  Bassam Hallal ,  Jens Geiger

IPC: H04N5/247 ,  G03B37/04 ,  G03B35/08 ,  G03B15/05 ,  G03B17/12 ,  G02B13/00 ,  H04N5/225 ,  H04N5/33

Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.

公开(公告)号：US11145796B2

公开(公告)日：2021-10-12

申请号：US16919556

申请日：2020-07-02

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L31/0232 ,  H01L27/146 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00 ,  H01L33/58 ,  H01L51/52 ,  H01L51/56 ,  H01S5/02 ,  H01S5/183 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US10547385B2

公开(公告)日：2020-01-28

申请号：US15504613

申请日：2015-08-18

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Bassam Hallal ,  Hartmut Rudmann ,  Mario Cesana ,  Nicole Ebentheuer

IPC: H04B10/40 ,  H04B10/80 ,  H04B10/112 ,  H04B10/114 ,  H04L5/16 ,  H04M1/737 ,  G02B19/00 ,  H01S5/022 ,  H01S5/183

Abstract: An optoelectronic module includes a transceiver operable to transmit data optically. The transceiver includes a light emitter to emit light from the module, and a light detector to detect light entering the module. The light detector is disposed at a rotationally symmetric position with respect to a central axis of the module. Such modules can help facilitate the exchange of data optically between two devices.

公开(公告)号：US10373996B2

公开(公告)日：2019-08-06

申请号：US15651510

申请日：2017-07-17

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Stephan Heimgartner ,  Ville Kettunen ,  Nicola Spring ,  Alexander Bietsch ,  Mario Cesana ,  Hartmut Rudmann ,  Jukka Alasirnio ,  Robert Lenart

IPC: H04N5/225 ,  H01L27/146 ,  G02B27/00 ,  H01L31/18 ,  H01L31/0216 ,  H01L31/0232

Abstract: Fabricating optical devices can include mounting a plurality of singulated lens systems over a substrate, adjusting a thickness of the substrate below at least some of the lens systems to provide respective focal length corrections for the lens systems, and subsequently separating the substrate into a plurality of optical modules, each of which includes one of the lens systems mounted over a portion of the substrate. Adjusting a thickness of the substrate can include, for example, micro-machining the substrate to form respective holes below at least some of the lens systems or adding one or more layers below at least some of the lens systems so as to correct for variations in the focal lengths of the lens systems.

公开(公告)号：US20220028908A1

公开(公告)日：2022-01-27

申请号：US17498105

申请日：2021-10-11

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L27/146 ,  H01L31/0203 ,  H01L33/54 ,  H01L51/52 ,  H01L51/56

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.