公开(公告)号：US11942580B2

公开(公告)日：2024-03-26

申请号：US17498105

申请日：2021-10-11

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L23/00 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54 ,  H01L33/58 ,  H01S5/02 ,  H01S5/183 ,  H10K50/84 ,  H10K50/858 ,  H10K71/00

CPC classification number: H01L33/56 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/02164 ,  H01L31/02327 ,  H01L31/186 ,  H01L33/0095 ,  H01L33/44 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01S5/02 ,  H01S5/183 ,  H10K50/84 ,  H10K50/858 ,  H10K71/00 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2933/0025 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/15311 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US20220028908A1

公开(公告)日：2022-01-27

申请号：US17498105

申请日：2021-10-11

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L27/146 ,  H01L31/0203 ,  H01L33/54 ,  H01L51/52 ,  H01L51/56

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US20200045828A1

公开(公告)日：2020-02-06

申请号：US16597447

申请日：2019-10-09

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Bojan Tesanovic ,  Nicola Spring ,  Simon Gubser ,  Robert Lenart ,  Mario Cesana

IPC: H05K3/00 ,  H01L27/146 ,  H01L33/48 ,  H05K1/02

Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.

公开(公告)号：US11996505B2

公开(公告)日：2024-05-28

申请号：US17294749

申请日：2019-11-27

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Ji Wang ,  Kam Wah Leong ,  QiChuan Yu ,  Simon Gubser ,  Yoong Kheng Teoh

IPC: B29C45/34 ,  B29C33/12 ,  B29C70/88 ,  B29C71/02 ,  B29C71/04 ,  B29D11/00 ,  H01L25/16 ,  H01L33/56 ,  B29C45/00 ,  B29C45/14 ,  B29K63/00 ,  B29L31/34 ,  H05K3/28

CPC classification number: H01L33/56 ,  B29C33/12 ,  B29D11/00307 ,  B29D11/00807 ,  H01L25/167 ,  B29C2045/0075 ,  B29C45/14065 ,  B29C2045/14114 ,  B29C45/14639 ,  B29C2791/006 ,  B29K2063/00 ,  B29L2031/34 ,  B29L2031/3425 ,  H01L2933/005 ,  H05K3/284

Abstract: Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).

公开(公告)号：US11145796B2

公开(公告)日：2021-10-12

申请号：US16919556

申请日：2020-07-02

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

IPC: H01L33/56 ,  H01L31/0232 ,  H01L27/146 ,  H01L23/00 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/00 ,  H01L33/58 ,  H01L51/52 ,  H01L51/56 ,  H01S5/02 ,  H01S5/183 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54

Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

公开(公告)号：US11018269B2

公开(公告)日：2021-05-25

申请号：US16073418

申请日：2017-02-21

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  James Eilertsen ,  Sundar Raman Gnana Sambandam

IPC: H01L33/58 ,  H01L33/54 ,  H01L33/00 ,  H01L33/44 ,  H01L33/48 ,  H01L31/0203 ,  G01S7/481 ,  H01L25/16 ,  G01S17/02 ,  H01L23/00 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/18 ,  G01S17/04

Abstract: The wafer-level manufacturing method makes possible to manufacture ultrathin optical devices such as opto-electronic modules. A clear encapsulation is applied to an initial wafer including active optical components and a wafer-size substrate. Thereon, a photostructurable opaque coating is produced which includes apertures. Then, trenches are produced which extend through the clear encapsulation and establish side walls of intermediate products. Then, an opaque encapsulation is applied to the intermediate products, thus filling the trenches. Cutting through the opaque encapsulation material present in the trenches, singulated optical modules are produced, wherein side walls of the intermediate products are covered by the opaque encapsulation material. The wafer-size substrate can be attached to a rigid carrier wafer during most process steps.

公开(公告)号：US10551596B2

公开(公告)日：2020-02-04

申请号：US15631395

申请日：2017-06-23

Applicant: AMS SENSORS SINGAPORE PTE. LTD.

Inventor： Guo Xiong Wu ,  Ming Jie Lee ,  Simon Gubser ,  Qichuan Yu ,  Joon Heng Tan

IPC: G02B5/20 ,  G02B13/00 ,  G02B7/00 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/0232 ,  H01L33/50 ,  H01L33/52 ,  H01L33/58 ,  H01S5/00 ,  H01S5/022

Abstract: The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, micro-spacers can be applied on a first optical element layer, and a second optical element layer can be provided on the first micro-spacers. By providing the second optical element layer on the first micro-spacers, the second optical element layer and the first optical element layer can be separated from one another by air or vacuum gaps each of which is laterally surrounded by a portion of the first micro-spacers.

公开(公告)号：US20230314660A1

公开(公告)日：2023-10-05

申请号：US18041977

申请日：2021-08-25

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Barbara Horvath ,  Simon Gubser

IPC: G02B1/04 ,  G02B3/00

CPC classification number: G02B1/041 ,  G02B3/0031 ,  G02B5/0268

Abstract: A method of manufacturing an optical element, the method comprising: providing a substrate; providing a tool comprising, on a first side, a section defining a surface structure of the optical element; aligning the tool and the substrate with respect to each other and bringing the tool and a first side of the substrate together, with material between the tool and the substrate; positioning a transparent masking structure adjacent to the substrate onto which the material has adhered, the masking structure comprising a masking layer; emitting light through the masking structure to be incident on a portion of the material to cure said potion of the material, wherein the masking layer prevents light from being incident on a remaining portion of the material such that the remaining portion of the material is uncured; and removing the uncured remaining portion of the material.

公开(公告)号：US20220020901A1

公开(公告)日：2022-01-20

申请号：US17294749

申请日：2019-11-27

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Ji Wang ,  Kam Wah Leong ,  QiChuan Yu ,  Simon Gubser ,  Yoong Kheng Teoh

IPC: H01L33/56 ,  B29D11/00 ,  H01L25/16 ,  B29C33/12 ,  H01L33/00

Abstract: Manufacturing optoelectronic modules includes supporting a printed circuit board substrate (27) on a first vacuum injection tool (24). The printed circuit board substrate (27) has at least one optoelectronic component mounted thereon and has a solder mask (40) on a surface (46) facing away from the first vacuum injection tool (24). The method includes causing the first vacuum injection tool (24) and a second vacuum injection tool (22) to be brought closer to one another such that a surface (46) of the second vacuum injection tool (22) is in contact with the solder mask (40). Subsequently, a first epoxy (100, 20) is provided, using a vacuum injection technique, in spaces (104) between the upper tool (22) and the solder mask (40).

公开(公告)号：US11013123B2

公开(公告)日：2021-05-18

申请号：US16597447

申请日：2019-10-09

Applicant: ams Sensors Singapore Pte. Ltd.

Inventor： Bojan Tesanovic ,  Nicola Spring ,  Simon Gubser ,  Robert Lenart ,  Mario Cesana

IPC: H05K3/00 ,  H01L27/146 ,  H01L33/48 ,  H05K1/02 ,  H01L33/58 ,  H05K3/28 ,  H01L33/62

Abstract: Molded circuit substrates include a conductive layer surrounded by an insulating sidewall. The insulating sidewall further provides a structural component for an electronic module into which the molded circuit substrate is incorporated. Accordingly, the molded circuit substrates can permit better performance, reduce electronic module thickness, and reduce fabrication costs. Methods for fabricating molded circuit substrates can facilitate precise positioning of insulating sidewalls, insulating partitions, electrical contacts and other components.