公开(公告)号：US20080105558A1

公开(公告)日：2008-05-08

申请号：US11927680

申请日：2007-10-30

Applicant: Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

Inventor： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

IPC: C25D5/10

CPC classification number: B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

Abstract translation: 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

公开(公告)号：US20070045121A1

公开(公告)日：2007-03-01

申请号：US11435809

申请日：2006-05-16

Applicant: Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

Inventor： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

IPC: C25D5/02

CPC classification number: B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

Abstract: In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

Abstract translation: 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

公开(公告)号：US20050189958A1

公开(公告)日：2005-09-01

申请号：US11029171

申请日：2005-01-03

Applicant: Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Dennis Smalley ,  Pavel Lembrikov

Inventor： Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Dennis Smalley ,  Pavel Lembrikov

IPC: G01R31/02

CPC classification number: G01R1/06727 ,  G01R1/06738 ,  G01R1/07357 ,  G01R31/2886

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及悬臂式探针结构的各种设计。 一些实施例涉及制造这种悬臂结构的方法。 在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗 能力和/或类似物。

公开(公告)号：US6076409A

公开(公告)日：2000-06-20

申请号：US995829

申请日：1997-12-22

Applicant: Christopher Bang

Inventor： Christopher Bang

IPC: G01L9/04 ,  G01L9/00 ,  G01L19/06 ,  G01L7/00

CPC classification number: G01L19/143 ,  G01L19/0038 ,  G01L19/0645

Abstract: Media compatible packages for pressure sensing devices include molded polymeric housings and diaphragms which mount and isolate pressure sensing devices in operative contact with any type of corrosive or non-corrosive media for pressure measurement. The various pressure sensor package housings include a main cavity in which a pressure sensor is mounted, a polymeric diaphragm bonded to the housing within the main cavity, at least one media port which leads to a pressure port on one side of the diaphragm, and a pressure transfer cavity on an opposite side of the diaphragm in which a pressure sensor is located. A fill port through a wall of the housing between the diaphragm and the pressure sensor allows the pressure transfer cavity to be filled with a pressure transfer medium such as oil and then sealed, without introducing any excess pressure. The use of bondable polymers to form the housing and thin film diaphragms provides excellent media compatibility for pressure measurements in corrosive environments. Differential dual port packages having a media conduit and diaphragm on opposite sides of a single sensor are also provided. Internal walls of the connectable halves of the pressure sensor housing are configured to capture, position and hold a pressure sensing device within a main cavity of the housing, and to form at least one pressure transfer cavity between a pressure sensing device and a diaphragm.

Abstract translation: 用于压力感测装置的介质兼容包装包括模制的聚合物壳体和隔膜，其安装和隔离与任何类型的腐蚀性或非腐蚀性介质压力测量有效接触的压力感测装置。 各种压力传感器封装壳体包括其中安装有压力传感器的主腔，在主空腔内结合到壳体的聚合膜，至少一个通向隔膜一侧的压力端口的介质口，以及 在压力传感器所在的膜片的相对侧上的压力传递腔。 通过隔膜和压力传感器之间的壳体的壁的填充口允许压力传递腔填充有诸如油的压力传递介质，然后密封，而不引入任何过量的压力。 使用可结合的聚合物形成外壳和薄膜隔膜为腐蚀性环境中的压力测量提供了出色的介质兼容性。 还提供了在单个传感器的相对侧上具有介质导管和隔膜的差分双端口封装。 压力传感器壳体的可连接半部的内壁构造成在壳体的主腔内捕获，定位和保持压力感测装置，并且在压力感测装置和隔膜之间形成至少一个压力传递空腔。

公开(公告)号：US20080106280A1

公开(公告)日：2008-05-08

申请号：US11928707

申请日：2007-10-30

Applicant: Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Vacit Arat ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis Smalley

Inventor： Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Vacit Arat ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis Smalley

IPC: G01R1/067

CPC classification number: G01R3/00 ,  A61N1/00 ,  C25D1/00 ,  C25D1/003 ,  G01R1/06722 ,  G01R1/06744 ,  G01R1/06761

Abstract: Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.

Abstract translation: 用于测试或以其他方式与半导体管芯或其他电子部件进行电接触的多层探针结构通过在多个覆盖层和附着层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，结构可以包括旨在增强功能性，可构建性或两者的配置。

公开(公告)号：US20080093424A1

公开(公告)日：2008-04-24

申请号：US11929539

申请日：2007-10-30

Applicant: Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

Inventor： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

IPC: B29C65/00 ,  B23K35/12

CPC classification number: B23K35/0222 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/12 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

公开(公告)号：US20080062638A1

公开(公告)日：2008-03-13

申请号：US11685118

申请日：2007-03-12

Applicant: Adam Cohen ,  Daniel Feinberg ,  Christopher Bang

Inventor： Adam Cohen ,  Daniel Feinberg ,  Christopher Bang

IPC: H05K7/02 ,  H05K7/20

CPC classification number: B81C3/002 ,  B81B2201/042 ,  B81C3/008 ,  B81C2203/051 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H01P11/007 ,  H05K3/4647

Abstract: Permanent or temporary alignment and/or retention structures for receiving multiple components are provided. The structures are preferably formed monolithically via a plurality of deposition operations (e.g. electrodeposition operations). The structures typically include two or more positioning fixtures that control or aid in the positioning of components relative to one another, such features may include (1) positioning guides or stops that fix or at least partially limit the positioning of components in one or more orientations or directions, (2) retention elements that hold positioned components in desired orientations or locations, and/or (3) positioning and/or retention elements that receive and hold adjustment modules into which components can be fixed and which in turn can be used for fine adjustments of position and/or orientation of the components.

Abstract translation: 提供用于接收多个部件的永久或临时对准和/或保持结构。 优选地，这些结构通过多个沉积操作（例如电沉积操作）一体地形成。 结构通常包括两个或更多个控制或辅助部件相对于彼此的定位的定位夹具，这些特征可以包括（1）定位引导件或止动件，其固定或至少部分地限制部件在一个或多个取向中的定位 或方向，（2）将定位的部件保持在期望的取向或位置的保持元件，和/或（3）接收和保持调节模块的定位和/或保持元件，组件可以被固定到其中， 微调零件的位置和/或取向。

公开(公告)号：US20070199822A1

公开(公告)日：2007-08-30

申请号：US11621429

申请日：2007-01-09

Applicant: Christopher Bang

Inventor： Christopher Bang

IPC: C25D1/00

CPC classification number: G01P15/0802 ,  B33Y10/00 ,  B81B2201/042 ,  B81C99/0085 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2201/0197 ,  G01P15/125

Abstract: Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Abstract translation: 提供了模制结构，制造模制结构的方法和设备。 用于模具的表面特征的至少一部分由多层电化学制造的结构（例如通过EFAB TM形成工艺制造）形成，并且通常包含具有在1至100μm范围内的分辨率的特征。 根据需要，将层状结构与其他模具部件组合，并将模塑材料注入模具中并硬化。 层压结构与任何其它模具部件一起被除去（例如通过蚀刻）以产生模塑制品。 在一些实施例中，分层结构的部分保留在模制品中，并且在其它实施例中，在部分或完全去除层状结构之后添加另外的模制材料。

公开(公告)号：US20070182427A1

公开(公告)日：2007-08-09

申请号：US11695593

申请日：2007-04-02

Applicant: Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Dennis Smalley ,  Pavel Lembrikov

Inventor： Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Dennis Smalley ,  Pavel Lembrikov

IPC: G01R31/305

CPC classification number: C25D5/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

公开(公告)号：US20070170943A1

公开(公告)日：2007-07-26

申请号：US11695577

申请日：2007-04-02

Applicant: Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Dennis Smalley ,  Pavel Lembrikov

Inventor： Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Dennis Smalley ,  Pavel Lembrikov

IPC: G01R31/02

CPC classification number: C25D5/02 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06738 ,  G01R1/06744 ,  G01R1/06755 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及悬臂式探针结构的各种设计。 一些实施例涉及制造这种悬臂结构的方法。 在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗 能力和/或类似物。