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公开(公告)号：US20150284296A1
公开(公告)日：2015-10-08
申请号：US14443505
申请日：2012-11-20
发明人： Hideyo Osanai , Yukihiro Kitamura , Hiroto Aoki , Yukihiro Kanechika , Ken Sugawara , Yasuko Takeda
CPC分类号： C04B37/02 , B23K1/19 , B32B15/04 , B32B18/00 , C04B35/581 , C04B37/026 , C04B41/91 , C04B2235/96 , C04B2235/963 , C04B2237/125 , C04B2237/127 , C04B2237/366 , C04B2237/407 , C04B2237/52 , C04B2237/704 , C04B2237/706 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/022 , H05K3/38 , Y10T428/24355 , H01L2924/00
摘要： After a wet blasting treatment for jetting a slurry, which contains spherical alumina as abrasive grains in a liquid, to the surface of a ceramic substrate 10 of aluminum nitride sintered body so that the ceramic substrate 10 has a residual stress of not higher than −50 MPa and so that the surface of the ceramic substrate 10 to be bonded to the metal plate 14 has an arithmetic average roughness Ra of 0.15 to 0.30 μm, a ten-point average roughness Rz of 0.7 to 1.1 μm and a maximum height Ry of 0.9 to 1.7 μm while causing the ceramic substrate to have a flexural strength of not higher than 500 MPa and causing the thickness of a residual stress layer 10a formed along the surface of the ceramic substrate 10 to be 25 μm or less, the metal plate 14 of copper or a copper alloy is bonded to the ceramic substrate 10, which is obtained by the wet blasting treatment, via a brazing filler metal 12 to produce a metal/ceramic bonding substrate which has an excellent bonding strength of the ceramic substrate 10 to the metal plate 14 and which has an excellent heat cycle resistance.
摘要翻译： 在将含有液体中的作为磨粒的球状氧化铝的浆料喷射到氮化铝烧结体的陶瓷基板10的表面的湿式喷砂处理之后，陶瓷基板10具有不高于-50的残余应力 并且使得与金属板14接合的陶瓷基板10的表面的算术平均粗糙度Ra为0.15〜0.30μm，十点平均粗糙度Rz为0.7〜1.1μm，最大高度Ry为0.9 使陶瓷基板具有不高于500MPa的弯曲强度，并使沿陶瓷基板10的表面形成的残余应力层10a的厚度为25μm以下，金属板14为 通过钎焊金属12将铜或铜合金结合到通过湿式喷砂处理获得的陶瓷基板10上，以制造具有优异的陶瓷结合强度的金属/陶瓷接合基板 并且具有优异的耐热循环性。
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公开(公告)号：US09944565B2
公开(公告)日：2018-04-17
申请号：US14443505
申请日：2012-11-20
发明人： Hideyo Osanai , Yukihiro Kitamura , Hiroto Aoki , Yukihiro Kanechika , Ken Sugawara , Yasuko Takeda
IPC分类号： B21D39/00 , C04B37/02 , H05K1/03 , H05K3/02 , H01L23/373 , B23K1/19 , B32B15/04 , B32B18/00 , C04B35/581 , C04B41/91 , H05K3/38
CPC分类号： C04B37/02 , B23K1/19 , B32B15/04 , B32B18/00 , C04B35/581 , C04B37/026 , C04B41/91 , C04B2235/96 , C04B2235/963 , C04B2237/125 , C04B2237/127 , C04B2237/366 , C04B2237/407 , C04B2237/52 , C04B2237/704 , C04B2237/706 , H01L23/3735 , H01L2924/0002 , H05K1/0306 , H05K3/022 , H05K3/38 , Y10T428/24355 , H01L2924/00
摘要： After a wet blasting treatment for jetting a slurry, which contains spherical alumina as abrasive grains in a liquid, to the surface of a ceramic substrate 10 of aluminum nitride sintered body so that the ceramic substrate 10 has a residual stress of not higher than −50 MPa and so that the surface of the ceramic substrate 10 to be bonded to the metal plate 14 has an arithmetic average roughness Ra of 0.15 to 0.30 μm, a ten-point average roughness Rz of 0.7 to 1.1 μm and a maximum height Ry of 0.9 to 1.7 μm while causing the ceramic substrate to have a flexural strength of not higher than 500 MPa and causing the thickness of a residual stress layer 10a formed along the surface of the ceramic substrate 10 to be 25 μm or less, the metal plate 14 of copper or a copper alloy is bonded to the ceramic substrate 10, which is obtained by the wet blasting treatment, via a brazing filler metal 12 to produce a metal/ceramic bonding substrate which has an excellent bonding strength of the ceramic substrate 10 to the metal plate 14 and which has an excellent heat cycle resistance.
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公开(公告)号：US20220033317A1
公开(公告)日：2022-02-03
申请号：US17383541
申请日：2021-07-23
发明人： Koji Kobayashi , Takuma Tsubota , Hideyo Osanai , Daisuke Oya
摘要： There is provided an aluminum/ceramic bonding substrate having a ceramic substrate, an aluminum plate of an aluminum alloy which is bonded directly to one side of the ceramic substrate, an aluminum base plate of the aluminum alloy which is bonded directly to the other side of the ceramic substrate, and a plate-shaped reinforcing member which has a higher strength than that of the aluminum base plate and which is arranged in the aluminum base plate to be bonded directly to the aluminum base plate, wherein the aluminum alloy contains 0.01 to 0.2% by weight of magnesium, 0.01 to 0.1% by weight of silicon, and the balance being aluminum and unavoidable impurities.
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公开(公告)号：US20140083671A1
公开(公告)日：2014-03-27
申请号：US14036551
申请日：2013-09-25
发明人： Satoru Ideguchi , Hideyo Osanai , Hirotaka Kotani
IPC分类号： F28F21/08
CPC分类号： F28F21/08 , H01L21/4871 , H01L21/4882 , H01L23/367 , H01L23/3672 , H01L23/3677 , H01L23/3733 , H01L23/3735 , H01L2924/0002 , H01L2924/00
摘要： A heat radiating plate 10 of a metal material includes a flat plate portion 10a, a large number of columnar protruding portions 10b which protrude from one major surface of the flat plate portion and which are integrated with the flat plate portion, and a reinforcing plate member 12 of a material, which has a higher melting point than that of the flat plate portion and columnar protruding portions and which is arranged in a region, which is arranged in the flat plate portion and which is close to one major surface of the flat plate portion, the reinforcing member passing through the flat plate portion to extend in directions substantially parallel to the one major surface of the flat plate portion and having end faces exposed to the outside, the whole surface of the reinforcing member except for the end faces being bonded directly to the flat plate portion.
摘要翻译： 金属材料的散热板10包括平板部分10a，从平板部分的一个主表面突出并与平板部分一体化的多个柱状突出部分10b，以及加强板部件 12，其具有比平板部分和柱状突出部分更高的熔点，并且布置在布置在平板部分中并且靠近平板的一个主表面的区域中 所述加强构件穿过所述平板部分，以在大致平行于所述平板部分的一个主表面的方向延伸并且具有暴露于外部的端面，除了所述端面之外的加强构件的整个表面被接合 直接到平板部分。
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公开(公告)号：US11919288B2
公开(公告)日：2024-03-05
申请号：US17468808
申请日：2021-09-08
发明人： Hideyo Osanai , Akira Sugawara
CPC分类号： B32B9/041 , B22D19/04 , B23K1/19 , B32B9/007 , H05K1/0201 , H05K7/2039 , B23K1/0016 , B23K2101/36 , B32B2250/03 , B32B2250/40 , B32B2307/302 , B32B2307/724 , B32B2457/08
摘要： To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m2 or more.
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公开(公告)号：US09831157B2
公开(公告)日：2017-11-28
申请号：US14917095
申请日：2014-09-02
发明人： Naoya Sunachi , Hideyo Osanai , Satoru Kurita
IPC分类号： H01L21/00 , H01L23/48 , H01L23/492 , H01L23/373 , H05K3/34 , H01L21/48 , H01L23/498 , H05K1/05 , H01L23/00
CPC分类号： H01L23/4924 , H01L21/4846 , H01L21/4878 , H01L23/3735 , H01L23/3736 , H01L23/498 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/04026 , H01L2224/05644 , H01L2224/27442 , H01L2224/29139 , H01L2224/29339 , H01L2224/29394 , H01L2224/32225 , H01L2224/32245 , H01L2224/75315 , H01L2224/83009 , H01L2224/83192 , H01L2224/83203 , H01L2224/83385 , H01L2224/83447 , H01L2224/8384 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H05K1/053 , H05K3/3431 , H05K2203/0307 , Y02P70/613 , H01L2924/00014 , H01L2924/00012
摘要： In a method for producing an electronic part mounting substrate wherein an electronic part 14 is mounted on one major surface (a surface to which the electronic part 14 is to be bonded) of the metal plate 10 of copper, or aluminum or the aluminum alloy (when a plating film 20 of copper is formed on the surface), the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) is surface-machined to be coarsened so as to have a surface roughness of not less than 0.4 μm, and then, a silver paste is applied on the surface-machined major surface (or the surface-machined surface of the plating film 20 of copper) to arrange the electronic part 14 thereon to sinter silver in the silver paste to form a silver bonding layer 12 to bond the electronic part 14 to the one major surface of the metal plate 10 (or the surface of the plating film 20 of copper) with the silver bonding layer 12.
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公开(公告)号：US20220367316A1
公开(公告)日：2022-11-17
申请号：US17623293
申请日：2020-06-11
发明人： Hideyo Osanai , Akira Sugawara
IPC分类号： H01L23/373 , H01L21/48
摘要： There is provided an inexpensive metal/ceramic bonding substrate which has a metal circuit plate of aluminum or an aluminum alloy bonded directly to a ceramic substrate and which can prevent a large difference in level from being caused on portions corresponding to the grain boundaries of aluminum or the aluminum alloy even if heat cycles are repeatedly applied to the metal/ceramic bonding substrate, and a method for producing the same. In the preferred embodiment of a metal/ceramic bonding substrate, one side of a ceramic substrate 12 is bonded directly to a metal base plate 10 of aluminum or an aluminum alloy, and the other side of the ceramic substrate 12 is bonded directly to one side of a first metal plate 14 (for circuit pattern) of aluminum or the aluminum alloy, the other side of first metal plate 14 being bonded directly to one side of a graphite sheet 16, and the other side of the graphite sheet 16 being bonded directly to a second metal plate (for circuit pattern) 18 of aluminum or the aluminum alloy.
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公开(公告)号：US20220080704A1
公开(公告)日：2022-03-17
申请号：US17468808
申请日：2021-09-08
发明人： Hideyo Osanai , Akira Sugawara
摘要： To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m2 or more.
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公开(公告)号：US20220032580A1
公开(公告)日：2022-02-03
申请号：US17430894
申请日：2020-02-10
发明人： Hideyo Osanai
摘要： There are provide a metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing the same. The metal/ceramic bonding substrate is produced by a method including the steps of: arranging a ceramic substrate 10 in a mold 20; putting the mold 20 in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to −45° C. or lower in the furnace; injecting a molten metal of aluminum into the mold 20 so as to allow the molten metal to contact the surface of the ceramic substrate 10; and cooling and solidifying the molten metal to form a metal plate 14 for circuit pattern of aluminum on one side of the ceramic substrate 10 to bond one side of the metal plate 14 for circuit pattern directly to the ceramic substrate 10, while forming a metal base plate 12 of aluminum on the other side of the ceramic substrate 10 to bond the metal base plate 12 directly to the ceramic substrate 10.
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公开(公告)号：US10510557B2
公开(公告)日：2019-12-17
申请号：US14087117
申请日：2013-11-22
发明人： Naoya Sunachi , Hideyo Osanai , Satoru Kurita
摘要： An electronic part mounting substrate includes: a metal plate 10 (for mounting thereon electronic parts) of aluminum or an aluminum alloy having a substantially rectangular planar shape, one major surface of the metal plate 10 being surface-processed so as to have a surface roughness of not less than 0.2 micrometers; a plating film 20 of nickel or a nickel alloy formed on the one major surface of the metal plate 10; an electronic part 14 bonded to the plating film 20 by a silver bonding layer 12 (containing a sintered body of silver); a ceramic substrate 16 having a substantially rectangular planar shape, one major surface of the ceramic substrate 16 being bonded to the other major surface of the metal plate 10; and a radiating metal plate (metal base plate) 18 bonded to the other major surface of the ceramic substrate 16.
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