公开(公告)号：US20100136746A1

公开(公告)日：2010-06-03

申请号：US12452137

申请日：2008-06-20

申请人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/60

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.

摘要翻译： 该方法涉及通过柔性连接机械地互连的一组芯片的生产。 集成在基板上的芯片各自包括接收区域。 组合的芯片通过连接元件串联连接在接收区域中。 芯片然后被释放，连接元件形成柔性连接。

公开(公告)号：US08012795B2

公开(公告)日：2011-09-06

申请号：US12379357

申请日：2009-02-19

申请人： Jean Brun ,  Benoît Lepine ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Benoît Lepine ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/00 ,  H01L21/50

CPC分类号： H01L25/0655 ,  H01L21/6835 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T29/41 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method enables an assembly of chips, initially formed on a wafer, to be formed. Each chip comprises two parallel main faces joined by side faces. At least one of the side faces comprises at least one groove for housing a thread element. The wafer is first of all stuck onto a flexible film and the chips are then cut. The film is then deformed to space the chips apart from one another and to make the grooves accessible. A daisy chain is then formed joining the chips via at least one thread element, each chip being inserted in the daisy chain by inserting the thread in the groove of said chip and then removing the chip from the deformable film.

摘要翻译： 该方法使得能够形成初始形成在晶片上的芯片的组装。 每个芯片包括由侧面连接的两个平行的主面。 至少一个侧面包括用于容纳螺纹元件的至少一个凹槽。 首先将晶片粘在柔性膜上，然后切割芯片。 然后将薄膜变形以使芯片彼此分开，并使凹槽可访问。 然后通过至少一个螺纹元件形成连接芯片的菊花链，每个芯片通过将线插入所述芯片的凹槽中而插入菊链中，然后从可变形薄膜去除芯片。

公开(公告)号：US08093617B2

公开(公告)日：2012-01-10

申请号：US12310246

申请日：2007-06-21

申请人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

发明人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

IPC分类号： H01L33/00

CPC分类号： H01L25/0657 ,  G06K19/027 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/481 ,  H01L23/58 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01Q1/2208 ,  H01Q7/00 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip.

摘要翻译： 微电子芯片包括两个平行的主面和侧面。 至少一个面包括设置有至少一个电连接元件并形成用于线元件的壳体的凹部。 线元件同时通过所述连接元件构成芯片和外部之间的电连接，以及用于所述芯片的柔性机械支撑。

公开(公告)号：US20090200066A1

公开(公告)日：2009-08-13

申请号：US12310246

申请日：2007-06-21

申请人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

发明人： Dominique Vicard ,  Bruno Mourey ,  Jean Brun

IPC分类号： H05K1/03 ,  H01K3/10

CPC分类号： H01L25/0657 ,  G06K19/027 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/481 ,  H01L23/58 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01Q1/2208 ,  H01Q7/00 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip.

摘要翻译： 微电子芯片包括两个平行的主面和侧面。 至少一个面包括设置有至少一个电连接元件并形成用于线元件的壳体的凹部。 线元件同时通过所述连接元件构成芯片和外部之间的电连接，以及用于所述芯片的柔性机械支撑。

公开(公告)号：US08258011B2

公开(公告)日：2012-09-04

申请号：US12452137

申请日：2008-06-20

申请人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/44

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method relates to production of a set of chips mechanically interconnected by means of a flexible connection. The chips, integrated on a substrate, each comprise a receiving area. The chips of the set are connected in series in the receiving areas by a connecting element. The chips are then released, the connecting element forming a flexible connection.

摘要翻译： 该方法涉及通过柔性连接机械地互连的一组芯片的生产。 集成在基板上的芯片各自包括接收区域。 组合的芯片通过连接元件串联连接在接收区域中。 芯片然后被释放，连接元件形成柔性连接。

公开(公告)号：US20090227069A1

公开(公告)日：2009-09-10

申请号：US12379357

申请日：2009-02-19

申请人： Jean Brun ,  Benoit Lepine ,  Bruno Mourey ,  Dominique Vicard

发明人： Jean Brun ,  Benoit Lepine ,  Bruno Mourey ,  Dominique Vicard

IPC分类号： H01L21/78 ,  H01L21/67

CPC分类号： H01L25/0655 ,  H01L21/6835 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T29/41 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The method enables an assembly of chips, initially formed on a wafer, to be formed. Each chip comprises two parallel main faces joined by side faces. At least one of the side faces comprises at least one groove for housing a thread element. The wafer is first of all stuck onto a flexible film and the chips are then cut. The film is then deformed to space the chips apart from one another and to make the grooves accessible. A daisy chain is then formed joining the chips via at least one thread element, each chip being inserted in the daisy chain by inserting the thread in the groove of said chip and then removing the chip from the deformable film.

摘要翻译： 该方法使得能够形成初始形成在晶片上的芯片的组装。 每个芯片包括由侧面连接的两个平行的主面。 至少一个侧面包括用于容纳螺纹元件的至少一个凹槽。 首先将晶片粘在柔性膜上，然后切割芯片。 然后将薄膜变形以将芯片彼此分开，并使凹槽可访问。 然后通过至少一个螺纹元件形成连接芯片的菊花链，每个芯片通过将线插入所述芯片的凹槽中而插入菊链中，然后从可变形薄膜去除芯片。

公开(公告)号：US08814054B2

公开(公告)日：2014-08-26

申请号：US13703255

申请日：2011-06-23

申请人： Jean Brun ,  Laurent Lancon ,  Dominique Vicard

发明人： Jean Brun ,  Laurent Lancon ,  Dominique Vicard

IPC分类号： G06K19/06 ,  D02G3/36 ,  G06K19/077 ,  H01L25/00 ,  H01L23/00

CPC分类号： G06K19/07749 ,  D02G3/362 ,  D10B2401/18 ,  G06K19/07718 ,  G06K19/07758 ,  G06K19/07786 ,  H01L24/78 ,  H01L24/85 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/78 ,  H01L2224/8517 ,  H01L2224/858 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01058 ,  Y10T29/49002 ,  H01L2224/48 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for forming a sheathed wire includes the steps of: axially advancing a core through a sheathing zone; wrapping a sheathing fiber around the core in the sheathing zone; and providing, in the sheathing zone, a series of microelectronic chip elements each provided with a wire section, in such a way that the sheathing fiber that wraps around the core also wraps around a chip element and the wire section thereof to form a sheathed wire incorporating spaced-apart chip elements.

摘要翻译： 一种用于形成护套线的方法包括以下步骤：使芯通过护套区域轴向推进; 在护套区域围绕芯部缠绕护套纤维; 并且在护套区域中提供一系列各自设置有线部分的微电子芯片元件，使得围绕芯部包覆的护套纤维也缠绕在芯片元件及其线部分上以形成护套线 结合间隔开的芯片元件。

公开(公告)号：US08654540B2

公开(公告)日：2014-02-18

申请号：US12977460

申请日：2010-12-23

申请人： Jean Brun ,  Dominique Vicard

发明人： Jean Brun ,  Dominique Vicard

IPC分类号： H05K7/00 ,  H05K1/00 ,  H05K1/03 ,  H05K7/12 ,  H01L21/00

CPC分类号： G06K19/077 ,  H01L23/58 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/83 ,  H01L24/85 ,  H01L24/94 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/0401 ,  H01L2224/29109 ,  H01L2224/29116 ,  H01L2224/32057 ,  H01L2224/4899 ,  H01L2224/49 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/85007 ,  H01L2224/85138 ,  H01L2224/85203 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  Y10T29/49169 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A first step of the method for assembling a wire element with an electronic chip comprises arranging the wire element in a groove of the chip delineated by a first element and a second element, joined by a link element comprising a plastically deformable material, and a second step then comprises clamping the first and second elements to deform the link element until the wire element is secured in the groove.

摘要翻译： 用于组装具有电子芯片的线元件的方法的第一步包括将线元件布置在由第一元件和第二元件所描绘的沟槽中，第二元件由包括可塑性变形的材料的连接元件连接， 步骤包括夹紧第一和第二元件以使连杆元件变形，直到线元件固定在槽中。

公开(公告)号：US08471773B2

公开(公告)日：2013-06-25

申请号：US12665419

申请日：2008-06-18

申请人： Dominique Vicard ,  Jean Brun ,  Benoît Lepine

发明人： Dominique Vicard ,  Jean Brun ,  Benoît Lepine

IPC分类号： H01Q1/24

CPC分类号： H01L25/50 ,  G06K19/07718 ,  G06K19/07754 ,  G06K19/07779 ,  G06K19/07786 ,  H01L21/6835 ,  H01L23/5387 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L24/94 ,  H01L25/0655 ,  H01L2223/6677 ,  H01L2224/24137 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/4519 ,  H01L2224/48139 ,  H01L2224/8585 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/2283 ,  Y10T29/49016 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The invention relates to the fabrication of radiofrequency transmission/reception devices. The invention makes provision for: the making of radiofrequency transmission/reception chips devoid of antennas; the connecting in series of the chips by at least two conducting wire elements whose respective lengths between two neighboring chips are chosen as a function of the transmission/reception frequency, each element contacting electrically at least one terminal of a chip and ensuring an at least temporary function of mechanical holding of the chips chainwise; and the cutting at regular intervals of the serial connection to form, for each chip, two strands of an antenna of the device.

摘要翻译： 本发明涉及射频发送/接收设备的制造。 本发明提供：制造没有天线的射频发送/接收芯片; 通过至少两个导线元件连接芯片的串联，其中两个相邻芯片之间的相应长度被选择为发射/接收频率的函数，每个元件电接触芯片的至少一个端子并确保至少临时 机械夹持芯片的功能; 并且以规则的间隔对串行连接进行切割，以便为每个芯片形成设备的天线的两股。

公开(公告)号：US20110001237A1

公开(公告)日：2011-01-06

申请号：US12919512

申请日：2008-10-21

申请人： Jean Brun ,  Dominique Vicard ,  Sophie Verrun

发明人： Jean Brun ,  Dominique Vicard ,  Sophie Verrun

IPC分类号： H01L23/498

CPC分类号： H01L25/0655 ,  H01L21/6835 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48 ,  H01L2224/78301 ,  H01L2224/85001 ,  H01L2224/85365 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/20751 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  Y10T29/41 ,  H01L2924/20752 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： The assembly comprises at least one microelectronic chip having two parallel main surfaces and lateral surfaces, at least one of the lateral faces comprising a longitudinal groove housing a wire element having an axis parallel to the longitudinal axis of the groove. The groove is delineated by at least two side walls. The wire element is secured to the chip at the level of a clamping area between at least one bump arranged on one of the side walls, and the side wall of the groove opposite said bump. The clamping area has a smaller height than the diameter of the wire element and a free area is arranged laterally to the bump along the longitudinal axis of the groove. The free area has a height, corresponding to the distance separating the two side walls, that is greater than the diameter of the wire element.

摘要翻译： 组件包括至少一个具有两个平行的主表面和侧表面的微电子芯片，至少一个侧面包括容纳具有平行于凹槽的纵向轴线的线的线元件的纵向槽。 凹槽由至少两个侧壁描绘。 线元件在布置在一个侧壁上的至少一个凸块与与凸起相对的凹槽的侧壁之间的夹紧区域的水平处固定到芯片。 夹紧区域具有比线元件的直径更小的高度，并且沿凹槽的纵向轴线横向布置凸块的自由区域。 自由区域具有与分离两个侧壁的距离相对应的高度，该高度大于线元件的直径。