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公开(公告)号：US09865785B2
公开(公告)日：2018-01-09
申请号：US15039303
申请日：2014-11-28
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Gruendl , Tobias Gebuhr , Markus Pindl
CPC classification number: H01L33/62 , G10L2015/223 , H01L24/48 , H01L33/486 , H01L33/54 , H01L2224/32245 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2224/92247 , H01L2924/00014 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
Abstract: A method of producing an optoelectronic component includes providing a lead frame subdivided by a separating region into first and second lead frame parts, carrying out etching in which at least one trench structure is produced on the upper side of the first lead frame, producing a molded body by molding a molding material around the lead frame such that 1) a cavity is formed and exposes a region of the upper side of the first lead frame part and a region of the upper side of the second lead frame part, and 2) the trench structure is provided on the upper side of the exposed region of the first lead frame part, and arranging the optoelectronic semiconductor chip on the upper side of the exposed region of the first lead frame part such that the trench structure is used as an alignment mark.
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公开(公告)号：US20180005924A1
公开(公告)日：2018-01-04
申请号：US15541765
申请日：2016-01-07
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Martin Brandl , Tobias Gebuhr
CPC classification number: H01L23/49544 , H01L21/561 , H01L23/49503 , H01L23/49562 , H01L24/97 , H01L33/0095 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2924/0002 , H01L2924/12041 , H01L2933/0033 , H01L2924/00014 , H01L2924/00
Abstract: A lead frame used to produce a chip package includes a first lead frame section and a second lead frame section connected to one another by a bar, wherein the bar includes a first longitudinal section, a second longitudinal section and a third longitudinal section, the first longitudinal section adjoins the first lead frame section and the third longitudinal section adjoins the second lead frame section, the first longitudinal section and the third longitudinal section are oriented parallel to one another, the first longitudinal section and the second longitudinal section form an angle not equal to 180° and not equal to 90°, and the lead frame is planar.
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公开(公告)号：US20170324012A1
公开(公告)日：2017-11-09
申请号：US15524644
申请日：2015-11-05
Applicant: OSRAM Opto Semiconductors Gmbh
Inventor： Michael Wittmann , Tobias Gebuhr , David Racz
CPC classification number: H01L33/62 , H01L33/486 , H01L33/50 , H01L2933/0041 , H01L2933/0066
Abstract: An optoelectronic component includes a first lead frame section and a second lead frame section spaced apart from one another, and having an optoelectronic semiconductor chip arranged on the first lead frame section and the second lead frame section, wherein the first lead frame section and the second lead frame section respectively have an upper side, a lower side and a first side flank extending between the upper side and the lower side, a first lateral solder contact surface of the optoelectronic component is formed on the first side flank of the first lead frame section, and the first lateral solder contact surface is formed by a recess arranged on the first side flank of the first lead frame section and extends from the upper side to the lower side of the first lead frame section.
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公开(公告)号：US09793442B2
公开(公告)日：2017-10-17
申请号：US15034017
申请日：2014-11-04
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Andreas Gruendl , Tobias Gebuhr , Markus Pindl
CPC classification number: H01L33/483 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
Abstract: An optoelectronic component includes a housing having a top side, wherein an anchoring structure which is a positive relief is arranged at the top side, a covering element is arranged above the top side and anchored at the anchoring structure, and the covering element completely covers the top side.
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公开(公告)号：US20160043291A1
公开(公告)日：2016-02-11
申请号：US14783255
申请日：2014-04-09
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Tobias Gebuhr , Christian Ziereis , Michael Zitzlsperger
CPC classification number: H01L33/56 , H01L25/0753 , H01L25/50 , H01L33/08 , H01L33/48 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00014
Abstract: An optoelectronic component includes a carrier including a mounting surface, at least one light-emitting element arranged on the mounting surface and electrically conductively connected to the carrier, at least one reinforcing body integrated in the optoelectronic component, a housing consisting of a housing encapsulation compound or a housing molding compound, wherein the light emitting component is arranged in an emitter cavity of the housing, and a reinforcing body cavity in which the reinforcing body is arranged fully or partially encapsulated or encased with a reinforcing body encapsulation compound.
Abstract translation: 光电子部件包括载体，其包括安装表面，至少一个发光元件，其布置在安装表面上并导电地连接到载体，至少一个集成在光电子部件中的增强体，由壳体封装化合物 或壳体模制化合物，其中所述发光部件布置在所述壳体的发射器腔体中，以及加强体腔体，其中所述增强体被完全或部分地包封或包裹有增强体包封化合物。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20150255313A1
公开(公告)日：2015-09-10
申请号：US14436578
申请日：2013-10-14
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Martin Brandl , Markus Boss , Markus Pindl , Simon Jerebic , Herbert Brunner , Tobias Gebuhr
CPC classification number: H01L21/563 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/85 , H01L24/97 , H01L31/0203 , H01L33/0095 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/85001 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/18301 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
Abstract: Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.
Abstract translation: 公开了用于制造光电半导体器件的光电半导体器件和方法。 在一个实施例中，该方法包括在辅助载体上施加导电的第一和第二接触元件的多个布置，在每个布置的第二接触元件上施加光电子半导体芯片，并将光电子半导体芯片导电连接到第一接触元件 为每个安排。 该方法还包括用封装材料封装第一接触元件和第二接触元件以形成封装主体，并将封装主体分成多个光电子半导体器件，其中封装材料与下侧齐平，面向辅助载体 的每个第一接触元件，并且其中所述封装材料与每个第二接触元件的面向所述辅助载体的底面齐平。
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7.发明申请公开(公告)号：US20150200138A1
公开(公告)日：2015-07-16
申请号：US14405393
申请日：2013-05-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schlereth , Michael Bestele , Christian Gaertner , Tobias Gebuhr , Hans-Christoph Gallmeier , Peter Holzer , Karlheinz Arndt , Albert Schneider
IPC: H01L21/78 , H01L23/495 , H01L21/66 , H01L21/50
CPC classification number: H01L21/78 , G01R31/2635 , H01L21/50 , H01L22/10 , H01L23/49541 , H01L23/49565 , H01L33/0095 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: In one embodiment, the method is configured for producing optoelectronic semiconductor components (1) and includes the steps of: providing a leadframe assembly (20) with a multiplicity of leadframes (2), each having at least two leadframe parts (21, 22); forming at least a part of the leadframe assembly (20) with a housing material for housing bodies (4); dividing the leadframe assembly (20) between at least one part of the columns (C) and/or the rows (R), wherein the leadframes (2) remain arranged in a matrix-like manner; equipping the leadframes (2) with at least one optoelectronic semiconductor chip (3); testing at least one part of the leadframes (2) equipped with the semiconductor chips (3) and formed with the housing material after the step of dividing; and separating to form the semiconductor components (1) after the step of forming and after the step of testing.
Abstract translation: 在一个实施例中，该方法被配置用于制造光电子半导体部件（1），并且包括以下步骤：提供具有多个引线框架（2）的引线框组件（20），每个引线框架（2）具有至少两个引线框部件（21,22） ; 用用于壳体（4）的壳体材料形成所述引线框架组件（20）的至少一部分; 在所述列（C）的至少一部分和/或所述行（R）之间划分所述引线框架组件（20），其中所述引线框架（2）保持以矩阵状方式布置; 将引线框架（2）装配至少一个光电半导体芯片（3）; 测试配备有半导体芯片（3）的引线框（2）的至少一部分，并在分割步骤之后形成外壳材料; 并且在成型步骤和测试步骤之后分离形成半导体部件（1）。
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8.发明申请公开(公告)号：US20150076549A1
公开(公告)日：2015-03-19
申请号：US14346673
申请日：2012-12-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tobias Gebuhr , Michael Zitzlsperger
CPC classification number: H01L33/62 , H01L22/32 , H01L24/97 , H01L27/15 , H01L33/005 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/19107 , H01L2933/0066 , H01L2924/00014 , H01L2924/00
Abstract: In at least one embodiment of the method, the method is used to produce optoelectronic semiconductor components. A lead frame assemblage includes a plurality of lead frames. The lead frames each includes at least two lead frame parts and the lead frames in the lead frame assemblage are electrically connected to one another by connecting webs. The lead frame assemblage is fitted on an intermediate carrier. At least a portion of the connecting webs is removed and/or interrupted. Additional electrical connecting elements are fitted between adjacent lead frames and/or lead frame parts. A potting body mechanically connects the lead frame parts of the individual lead frames to one another. The resulting structure is singulated to form the semiconductor components.
Abstract translation: 在该方法的至少一个实施例中，该方法用于产生光电子半导体部件。 引线框组合包括多个引线框架。 引线框架每个包括至少两个引线框架部件，并且引线框架组件中的引线框架通过连接网彼此电连接。 引线框组合安装在中间载体上。 连接腹板的至少一部分被去除和/或中断。 附加的电连接元件安装在相邻引线框架和/或引线框架部件之间。 灌封体将单个引线框架的引线框架部分彼此机械连接。 将所得结构单个化以形成半导体组件。
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公开(公告)号：US11107958B2
公开(公告)日：2021-08-31
申请号：US16489393
申请日：2018-03-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Tobias Gebuhr , Markus Burger , Markus Boß , Markus Pindl
IPC: H01L33/54 , H01L25/075 , H01L33/62
Abstract: A method of producing optoelectronic semiconductor components includes A) providing a chip carrier with electrical conductor structures on a carrier upper side, B) applying at least one semi-conductor chip configured to produce light on at least one of the electrical conductor structures, C) applying at least one sealing structure to at least one of the electrical conductor structures so that the sealing structure completely surrounds at least one contact area when viewed from the top, and D) producing a mold body directly at the at least one semiconductor chip and directly at the at least one sealing structure by transfer molding or injection molding, wherein, in an injection mold, the at least one sealing structure seals the at least one contact area against a material of the mold body so that the at least one contact area remains free of the mold body.
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公开(公告)号：US20190189855A1
公开(公告)日：2019-06-20
申请号：US16221872
申请日：2018-12-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Reeswinkel , Tobias Gebuhr , Artöm Khassanov
CPC classification number: H01L33/44 , G02B6/4239 , G03F7/165 , H01L21/02126 , H01L33/504 , H01L33/52
Abstract: An optoelectronic device includes an active layer stack that generates or detects radiation, a radiation entrance or radiation exit surface including an inorganic material, and a protective layer disposed over the radiation entrance or radiation exit surface and including chemical compounds each containing an anchor group and a head group, wherein the anchor group is bonded to the inorganic material, and an encapsulation laterally surrounding at least the active layer stack or at least the active layer stack and the protective layer.
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