摘要:
Inner surface strain of a container is reduced by suppressing a temperature drop of blow air, and heat resistance of the container is increased by enhancing the degree of crystallization. A blow air supply unit for a blow molding machine for molding a hollow bottle container 1 by supplying heated blow air into a preform includes: a high-pressure air source 11 for generating high-pressure blow air; a high-pressure gate valve 12 for opening/closing a blow air channel on the downstream of the high-pressure air source 11; a heat exchanger 13 for heating the blow air on the downstream of the high-pressure gate valve 12; a throttle valve 14 for throttling the flow rate of blow air on the downstream side of the heat exchanger 13; and a switchover valve 15 for switching the blow air on the downstream of the throttle valve 14.
摘要:
Inner surface strain of a container is reduced by suppressing a temperature drop of blow air, and heat resistance of the container is increased by enhancing the degree of crystallization. A blow air supply unit for a blow molding machine for molding a hollow bottle container 1 by supplying heated blow air into a preform includes: a high-pressure air source 11 for generating high-pressure blow air; a high-pressure gate valve 12 for opening/closing a blow air channel on the downstream of the high-pressure air source 11; a heat exchanger 13 for heating the blow air on the downstream of the high-pressure gate valve 12; a throttle valve 14 for throttling the flow rate of blow air on the downstream side of the heat exchanger 13; and a switchover valve 15 for switching the blow air on the downstream of the throttle valve 14.
摘要:
The absorbent article of the present invention comprises: a liquid-pervious surface sheet, a liquid-impervious backside sheet provided at the position opposing said surface sheet, and an absorption body provided between said surface sheet and said backside sheet, wherein the absorbent article comprises an endless compressed groove, surrounding a central part of said absorbent article, which is formed in said surface sheet and said absorption body in the thickness direction, and a plurality of concave parts, provided inside and outside said compressed groove, which are formed in said surface sheet and said absorption body in the thickness direction, and an uncompressed region bordering inner and outer edges of the compressed groove, wherein the closest distance between said compressed groove and the nearest concave parts is greater than the distance between adjacent ones of those same concave parts.
摘要:
A plurality of convex portions that protrude radially outward from a plurality of positions separated in the circumferential direction are provided on the outer peripheral surface of a driven gear. Each convex portion has, in the circumferential direction of the driven gear, a rising surface that rises from a minimum diameter position to a maximum diameter position in the direction opposite the rotational direction of the driven gear, and a falling surface that falls from that maximum diameter position to a minimum diameter position that is adjacent to and in back of that maximum diameter position with respect to the rotational direction of the driven gear. The circumferential length of the falling surface is greater than the circumferential length of the rising surface.
摘要:
An absorbent article package is individually packaged by folding a packaging sheet and an absorbent article in a state where the absorbent article is arranged on the packaging sheet. In a state where the individually-packaged absorbent article is opened, in the packaging sheet and the absorbent article, a first folding line based on which the absorbent article and the packaging sheet are folded towards the topsheet side, and a second folding line based on which the absorbent article and the packaging sheet are folded towards the backsheet side are formed adjacent to each other in the longitudinal direction.
摘要:
According to the present invention, an HCV replicon-replicating cell is produced by a production method including a step of introducing RNA containing an HCV replicon sequence and a selectable marker gene sequence into a Li23 cell or a cured cell derived from a Li23 cell. Further, a full-length HCV RNA-replicating cell is produced by a production method including a step of introducing RNA containing a full-length HCV genome sequence and a selectable marker gene sequence into a Li23 cell or a cured cell derived from a Li23 cell. The use of these cells enables the construction of an HCV life cycle reproduction system that is derived from a cell line other than the HuH-7 cell line and that has capabilities equivalent to those of an HCV life cycle reproduction system derived from the HuH-7 cell line.
摘要:
A plurality of convex portions that protrude radially outward from a plurality of positions separated in the circumferential direction are provided on the outer peripheral surface of a driven gear. Each convex portion has, in the circumferential direction of the driven gear, a rising surface that rises from a minimum diameter position to a maximum diameter position in the direction opposite the rotational direction of the driven gear, and a falling surface that falls from that maximum diameter position to a minimum diameter position that is adjacent to and in back of that maximum diameter position with respect to the rotational direction of the driven gear. The circumferential length of the falling surface is greater than the circumferential length of the rising surface.
摘要:
A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.
摘要:
A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.
摘要:
Semiconductor equipment includes: a semiconductor device; a pair of upper and lower heat radiation plates; and a heat radiation block. The heat radiation block has a planar shape, which is smaller than a planer shape of the semiconductor device. The semiconductor device includes a heat generation portion facing the heat radiation block. The heat generation portion has a periphery edge, which is determined such that a distance between the periphery edge of the heat generation portion and a periphery edge of the heat radiation block is equal to or shorter than 1.0 mm.