公开(公告)号：US20060055056A1

公开(公告)日：2006-03-16

申请号：US10991490

申请日：2004-11-19

申请人： Shoji Miura ,  Yoshihiko Ozeki ,  Yoshimi Nakase ,  Nobuyuki Kato ,  Tetsuji Kondou ,  Takanori Teshima ,  Naoki Hirasawa

发明人： Shoji Miura ,  Yoshihiko Ozeki ,  Yoshimi Nakase ,  Nobuyuki Kato ,  Tetsuji Kondou ,  Takanori Teshima ,  Naoki Hirasawa

IPC分类号： H01L23/48

CPC分类号： H01L24/05 ,  H01L23/34 ,  H01L23/4334 ,  H01L23/4824 ,  H01L23/492 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/04042 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/2076 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

摘要： Semiconductor equipment includes: a semiconductor device; a pair of upper and lower heat radiation plates; and a heat radiation block. The heat radiation block has a planar shape, which is smaller than a planer shape of the semiconductor device. The semiconductor device includes a heat generation portion facing the heat radiation block. The heat generation portion has a periphery edge, which is determined such that a distance between the periphery edge of the heat generation portion and a periphery edge of the heat radiation block is equal to or shorter than 1.0 mm.

摘要翻译： 半导体设备包括：半导体器件; 一对上下热辐射板; 和散热块。 散热块的平面形状小于半导体器件的平面形状。 半导体器件包括面向散热块的发热部。 发热部具有外围边缘，其被确定为使得发热部分的周边边缘与散热块的周缘之间的距离等于或小于1.0mm。

公开(公告)号：US20070158850A1

公开(公告)日：2007-07-12

申请号：US11702498

申请日：2007-02-06

申请人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

发明人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

IPC分类号： H01L23/48

CPC分类号： H01L24/33 ,  H01L23/482 ,  H01L23/485 ,  H01L23/488 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/04941 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.

摘要翻译： 一种模具型半导体器件，包括：包括半导体部件的半导体芯片; 金属层; 焊料层; 以及通过金属层和焊料层连接到半导体芯片的金属构件。 焊料层由屈服应力小于金属层的焊料制成。 即使当用树脂模具密封半导体芯片时，也防止金属层开裂。

公开(公告)号：US07193326B2

公开(公告)日：2007-03-20

申请号：US10859130

申请日：2004-06-03

申请人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

发明人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

IPC分类号： H01L23/48

CPC分类号： H01L24/33 ,  H01L23/482 ,  H01L23/485 ,  H01L23/488 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/04941 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A mold type semiconductor device includes a semiconductor chip including a semiconductor part; a metallic layer; a solder layer; and a metallic member connecting to the semiconductor chip through the metallic layer and the solder layer. The solder layer is made of solder having yield stress smaller than that of the metallic layer. Even when the semiconductor chip is sealed with a resin mold, the metallic layer is prevented from cracking.

摘要翻译： 一种模具型半导体器件，包括：包括半导体部件的半导体芯片; 金属层; 焊料层; 以及通过金属层和焊料层连接到半导体芯片的金属构件。 焊料层由屈服应力小于金属层的焊料制成。 即使当用树脂模具密封半导体芯片时，也防止金属层开裂。

公开(公告)号：US07468318B2

公开(公告)日：2008-12-23

申请号：US11702498

申请日：2007-02-06

申请人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

发明人： Naohiko Hirano ,  Nobuyuki Kato ,  Takanori Teshima ,  Yoshitsugu Sakamoto ,  Shoji Miura ,  Akihiro Niimi

IPC分类号： H01L21/4763

CPC分类号： H01L24/33 ,  H01L23/482 ,  H01L23/485 ,  H01L23/488 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/291 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/04941 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing a mold type semiconductor device is provided. The device includes a semiconductor chip having a semiconductor part and a metallic member connecting to the chip via a conductive layer and a connecting member. The method includes: forming the semiconductor part on a semiconductor substrate so that a cell portion is provided; forming the conductive layer on the substrate; forming a first resist layer to cover a part of the conductive layer corresponding to the cell portion; etching the conductive layer with the first resist layer as a mask so that a first conductive layer is provided; removing the first resist layer and forming a second conductive layer to cover a surface and an edge of the first conductive layer. The second conductive layer has a Young's modulus equal to or larger than the semiconductor substrate.

摘要翻译： 提供了一种用于制造模具型半导体器件的方法。 该器件包括具有半导体部件和通过导电层和连接部件与芯片连接的金属部件的半导体芯片。 该方法包括：在半导体衬底上形成半导体部分以便提供电池部分; 在所述基板上形成所述导电层; 形成第一抗蚀剂层以覆盖对应于所述电池单元部分的所述导电层的一部分; 用第一抗蚀剂层作为掩模蚀刻导电层，从而提供第一导电层; 去除第一抗蚀剂层并形成第二导电层以覆盖第一导电层的表面和边缘。 第二导电层的杨氏模量等于或大于半导体衬底。

公开(公告)号：US20050077617A1

公开(公告)日：2005-04-14

申请号：US10895947

申请日：2004-07-22

申请人： Naohiko Hirano ,  Nobuyuki Kato ,  Kuniaki Mamitsu ,  Yoshimi Nakase

发明人： Naohiko Hirano ,  Nobuyuki Kato ,  Kuniaki Mamitsu ,  Yoshimi Nakase

IPC分类号： H01L21/60 ,  H01L23/00 ,  H01L23/36 ,  H01L23/42 ,  H01L23/433 ,  H01L23/492 ,  H01L23/58

CPC分类号： H01L23/492 ,  H01L23/4334 ,  H01L23/562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A semiconductor device includes a heat generation element; a bonding member; first and second heat radiation plates disposed on first and second sides of the heat generation element through the bonding member; a heat radiation block disposed between the first heat radiation plate and the heat generation element through the bonding member; and a resin mold. The heat radiation block has a thickness in a range between 0.5 mm and 1.5 mm. The semiconductor device has high reliability of the bonding member.

摘要翻译： 半导体器件包括发热元件; 接合部件; 第一和第二散热板，其通过接合构件设置在发热体的第一和第二侧上; 散热块，其通过所述接合构件设置在所述第一散热板和所述发热体之间; 和树脂模具。 散热块的厚度在0.5mm至1.5mm的范围内。 半导体器件具有高粘合部件的可靠性。

公开(公告)号：US07239016B2

公开(公告)日：2007-07-03

申请号：US10895947

申请日：2004-07-22

申请人： Naohiko Hirano ,  Nobuyuki Kato ,  Kuniaki Mamitsu ,  Yoshimi Nakase

发明人： Naohiko Hirano ,  Nobuyuki Kato ,  Kuniaki Mamitsu ,  Yoshimi Nakase

IPC分类号： H01L23/34

CPC分类号： H01L23/492 ,  H01L23/4334 ,  H01L23/562 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199

摘要： A semiconductor device includes a heat generation element; a bonding member; first and second heat radiation plates disposed on first and second sides of the heat generation element through the bonding member; a heat radiation block disposed between the first heat radiation plate and the heat generation element through the bonding member; and a resin mold. The heat radiation block has a thickness in a range between 0.5 mm and 1.5 mm. The semiconductor device has high reliability of the bonding member.

摘要翻译： 半导体器件包括发热元件; 接合部件; 第一和第二散热板，其通过接合构件设置在发热体的第一和第二侧上; 散热块，其通过所述接合构件设置在所述第一散热板和所述发热体之间; 和树脂模具。 散热块的厚度在0.5mm至1.5mm的范围内。 半导体器件具有高粘合部件的可靠性。

公开(公告)号：US09433542B2

公开(公告)日：2016-09-06

申请号：US14002762

申请日：2012-02-27

申请人： Nobuyuki Kato ,  Tatsuya Tamura ,  Toshihisa Hayashi ,  Masashi Kitagawa

发明人： Nobuyuki Kato ,  Tatsuya Tamura ,  Toshihisa Hayashi ,  Masashi Kitagawa

IPC分类号： A61F13/475 ,  A61F13/533 ,  A61F13/537 ,  A61F13/15 ,  A61F13/535 ,  A61F13/539 ,  A61F13/47

CPC分类号： A61F13/537 ,  A61F13/15617 ,  A61F13/15731 ,  A61F13/4704 ,  A61F13/4756 ,  A61F13/535 ,  A61F13/539 ,  Y10T156/1041

摘要： The absorbent article of the present invention comprises: a liquid-pervious surface sheet, a liquid-impervious backside sheet provided at the position opposing said surface sheet, and an absorption body provided between said surface sheet and said backside sheet, wherein the absorbent article comprises an endless compressed groove, surrounding a central part of said absorbent article, which is formed in said surface sheet and said absorption body in the thickness direction, and a plurality of concave parts, provided inside and outside said compressed groove, which are formed in said surface sheet and said absorption body in the thickness direction, and an uncompressed region bordering inner and outer edges of the compressed groove, wherein the closest distance between said compressed groove and the nearest concave parts is greater than the distance between adjacent ones of those same concave parts.

摘要翻译： 本发明的吸收性物品包括：透液性表面片，设置在与所述表面片相对的位置处的不透液性背面片，以及设置在所述表面片和所述背面片之间的吸收体，其中，所述吸收性物品包含 围绕形成在所述表面片和所述吸收体的厚度方向的所述吸收性物品的中心部分的无端压缩槽，以及设置在所述压缩槽的内部和外部的多个凹部， 表面片和所述吸收体在厚度方向上，以及与所述压缩槽的内边缘和外边缘接合的未压缩区域，其中所述压缩槽和最近的凹入部分之间的最近距离大于相邻的相同凹部 部分。

公开(公告)号：US08684712B2

公开(公告)日：2014-04-01

申请号：US12776456

申请日：2010-05-10

申请人： Hiroyasu Honda ,  Hideki Miyata ,  Nobuyuki Kato

发明人： Hiroyasu Honda ,  Hideki Miyata ,  Nobuyuki Kato

IPC分类号： F01C1/02 ,  F03C2/00

CPC分类号： F04C2/102 ,  F04C2/084 ,  F04C2240/50 ,  F05C2225/00

摘要： A plurality of convex portions that protrude radially outward from a plurality of positions separated in the circumferential direction are provided on the outer peripheral surface of a driven gear. Each convex portion has, in the circumferential direction of the driven gear, a rising surface that rises from a minimum diameter position to a maximum diameter position in the direction opposite the rotational direction of the driven gear, and a falling surface that falls from that maximum diameter position to a minimum diameter position that is adjacent to and in back of that maximum diameter position with respect to the rotational direction of the driven gear. The circumferential length of the falling surface is greater than the circumferential length of the rising surface.

摘要翻译： 在从动齿轮的外周面设置有从圆周方向分离的多个位置向径向外侧突出的多个凸部。 每个凸部在从动齿轮的圆周方向上具有从与从动齿轮的旋转方向相反的方向从最小直径位置升高到最大直径位置的上升面，以及从该最大直径位置落下的下降面 直径位置相对于从动齿轮的旋转方向相邻于该最大直径位置的最小直径位置。 落下面的圆周长度大于上升面的圆周长度。

公开(公告)号：US20130317470A1

公开(公告)日：2013-11-28

申请号：US13976233

申请日：2011-12-27

申请人： Nobuyuki Kato ,  Masahiro Kashiwagi ,  Tatsuya Tamura ,  Masashi Kitagawa

发明人： Nobuyuki Kato ,  Masahiro Kashiwagi ,  Tatsuya Tamura ,  Masashi Kitagawa

IPC分类号： A61F13/551 ,  A61F13/15

CPC分类号： A61F13/5514 ,  A61F13/15577 ,  A61F13/15747

摘要： An absorbent article package is individually packaged by folding a packaging sheet and an absorbent article in a state where the absorbent article is arranged on the packaging sheet. In a state where the individually-packaged absorbent article is opened, in the packaging sheet and the absorbent article, a first folding line based on which the absorbent article and the packaging sheet are folded towards the topsheet side, and a second folding line based on which the absorbent article and the packaging sheet are folded towards the backsheet side are formed adjacent to each other in the longitudinal direction.

摘要翻译： 通过在吸收性物品配置在包装片上的状态下折叠包装片和吸收性物品，分别包装吸收性物品包装。 在打开单独包装的吸收性物品的状态下，在包装用片材和吸收性物品中，将吸收性物品和包装用片材朝向顶片侧折叠的第一折叠线和基于 所述吸收性物品和所述包装用薄片朝向所述背面侧折叠而形成为在长度方向上彼此相邻地形成。

公开(公告)号：US20110129868A1

公开(公告)日：2011-06-02

申请号：US13054905

申请日：2009-09-01

申请人： Nobuyuki Kato ,  Masanori Ikeda

发明人： Nobuyuki Kato ,  Masanori Ikeda

IPC分类号： C12Q1/02 ,  C12N15/87 ,  C12N5/071 ,  C12N7/00

CPC分类号： G01N33/5008 ,  A61K31/00 ,  C07K14/005 ,  C12N7/00 ,  C12N15/86 ,  C12N2770/24222 ,  C12N2770/24243 ,  C12N2770/24252 ,  G01N2333/186

摘要： According to the present invention, an HCV replicon-replicating cell is produced by a production method including a step of introducing RNA containing an HCV replicon sequence and a selectable marker gene sequence into a Li23 cell or a cured cell derived from a Li23 cell. Further, a full-length HCV RNA-replicating cell is produced by a production method including a step of introducing RNA containing a full-length HCV genome sequence and a selectable marker gene sequence into a Li23 cell or a cured cell derived from a Li23 cell. The use of these cells enables the construction of an HCV life cycle reproduction system that is derived from a cell line other than the HuH-7 cell line and that has capabilities equivalent to those of an HCV life cycle reproduction system derived from the HuH-7 cell line.

摘要翻译： 根据本发明，通过包括将含有HCV复制子序列和选择标记基因序列的RNA引入到Li23细胞或来自Li23细胞的固化细胞的步骤的制备方法制备HCV复制子复制细胞。 此外，通过包括将含有全长HCV基因组序列和选择性标记基因序列的RNA引入到Li23细胞或源自Li23细胞的固化细胞的步骤的制备方法制备全长HCV RNA复制细胞 。 这些细胞的使用使得能够构建来自除了HuH-7细胞系之外的细胞系的HCV生命周期再生系统，并且具有与源自HuH-7的HCV生命周期再生系统相当的能力 细胞系。