公开(公告)号：US20170322255A1

公开(公告)日：2017-11-09

申请号：US15452933

申请日：2017-03-08

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker ,  Minhua Lu ,  Robert J. Polastre ,  Bucknell C. Webb

IPC: G01R31/309 ,  H05K1/02 ,  H05K1/18 ,  G01R31/28

Abstract: An electro-optical module assembly is provided that includes a flexible substrate having a first surface and a second surface opposite the first surface, wherein the flexible substrate contains an opening located therein that extends from the first surface to the second surface. An optical component is located on the second surface of the flexible substrate and is positioned to have a surface exposed by the opening. At least one electronic component is located on a first portion of the first surface of the flexible substrate, and at least one micro-energy source is located on a second portion of the first surface of the flexible substrate.

公开(公告)号：US20170237344A1

公开(公告)日：2017-08-17

申请号：US15584513

申请日：2017-05-02

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Leland Chang ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bucknell C. Webb ,  Robert Wisnieff

IPC: H02M3/156 ,  G05F3/02 ,  H01L23/64 ,  G06F1/26 ,  H01L25/065

CPC classification number: H02M3/156 ,  G05F3/02 ,  G06F1/26 ,  G06F1/263 ,  G06F1/266 ,  H01L23/5286 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H02M1/08 ,  H05K1/00 ,  Y10T29/49117 ,  H01L2224/11 ,  H01L2924/014

Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

公开(公告)号：US09697943B2

公开(公告)日：2017-07-04

申请号：US15348015

申请日：2016-11-10

Applicant: International Business Machines Corporation

Inventor： Robert E. Fontana, Jr. ,  William J. Gallagher ,  Philipp Herget ,  Eugene J. O'Sullivan ,  Lubomyr T. Romankiw ,  Naigang Wang ,  Bucknell C. Webb

IPC: B32B15/00 ,  H01F10/32 ,  H01F3/02 ,  H01F41/02 ,  C25D9/08 ,  C25D7/00 ,  C25D7/12 ,  C25D17/00

CPC classification number: H01F10/3231 ,  C25D3/54 ,  C25D3/58 ,  C25D5/10 ,  C25D5/14 ,  C25D5/18 ,  C25D5/50 ,  C25D7/001 ,  C25D7/123 ,  C25D9/08 ,  C25D9/10 ,  C25D17/001 ,  G11B5/66 ,  H01F3/02 ,  H01F10/3236 ,  H01F10/324 ,  H01F10/325 ,  H01F10/3254 ,  H01F41/02

Abstract: A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.

公开(公告)号：US20170085173A1

公开(公告)日：2017-03-23

申请号：US15366650

申请日：2016-12-01

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Leland Chang ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bucknell C. Webb ,  Robert Wisnieff

IPC: H02M3/156 ,  G06F1/26 ,  H01L25/065 ,  H01L23/64 ,  H01L23/00

CPC classification number: H02M3/156 ,  G05F3/02 ,  G06F1/26 ,  G06F1/263 ,  G06F1/266 ,  H01L23/5286 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H02M1/08 ,  H05K1/00 ,  Y10T29/49117 ,  H01L2224/11 ,  H01L2924/014

Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

公开(公告)号：US09601484B2

公开(公告)日：2017-03-21

申请号：US15156576

申请日：2016-05-17

Applicant: International Business Machines Corporation

Inventor： Philipp Herget ,  Eugene J. O'Sullivan ,  Lubomyr T. Romankiw ,  Naigang Wang ,  Bucknell C. Webb

IPC: H01L27/22 ,  H01L27/06 ,  H01F7/02 ,  H01L49/02

CPC classification number: H01L27/22 ,  G11B5/3163 ,  H01F1/14708 ,  H01F7/021 ,  H01F10/14 ,  H01F27/24 ,  H01F27/2804 ,  H01F2027/2809 ,  H01L27/0641 ,  H01L27/224 ,  H01L28/10 ,  H01L43/02 ,  H01L43/10 ,  H01L43/12

Abstract: A mechanism is provided for an integrated laminated magnetic device. A substrate and a multilayer stack structure form the device. The multilayer stack structure includes alternating magnetic layers and diode structures formed on the substrate. Each magnetic layer in the multilayer stack structure is separated from another magnetic layer in the multilayer stack structure by a diode structure.

公开(公告)号：US09583410B2

公开(公告)日：2017-02-28

申请号：US14221477

申请日：2014-03-21

Applicant: International Business Machines Corporation

Inventor： Daniel C. Edelstein ,  Michael A. Gaynes ,  Thomas M. Shaw ,  Bucknell C. Webb ,  Roy R. Yu

IPC: H01L23/29 ,  H01L23/31

CPC classification number: H01L23/293 ,  H01L23/291 ,  H01L23/3171 ,  H01L23/3192 ,  H01L2224/11

Abstract: A volumetric integrated circuit manufacturing method is provided. The method includes assembling a slab element of elongate chips, exposing a wiring layer between adjacent elongate chips of the slab element, metallizing a surface of the slab element at and around the exposed wiring layer to form a metallized surface electrically coupled to the wiring layer and passivating the metallized surface to hermetically seal the metallized surface.

Abstract translation: 提供了体积集成电路制造方法。 该方法包括组装细长芯片的平板元件，暴露板坯元件的相邻细长芯片之间的布线层，将暴露的布线层周围和周围的平板元件的表面金属化以形成电耦合到布线层的金属化表面，以及 钝化金属化表面以气密地密封金属化表面。

公开(公告)号：US20170040580A1

公开(公告)日：2017-02-09

申请号：US15040706

申请日：2016-02-10

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bucknell C. Webb ,  Cornelia T. Yang

IPC: H01M2/08 ,  H01M6/40 ,  H01M10/02 ,  H01M2/02

CPC classification number: H01M2/08 ,  H01M2/0207 ,  H01M2/026 ,  H01M6/40 ,  H01M10/0436 ,  H01M2220/30

Abstract: A microbattery structure for hermetically sealed microbatteries is provided. In one embodiment, the microbattery structure includes a first silicon substrate containing at least one pedestal which houses a cathode material of a microbattery and at least one depression which houses A FIRST sealant material of the microbattery. The structure further includes a second silicon substrate containing at least one pedestal which houses an anode material of the microbattery and at least one depression which houses a second sealant material of the microbattery. An insulated centerpiece is bonded to the first sealant material present in at least two depressions on the first silicon substrate. An interlock structure is formed by aligning and superimposing the second silicon substrate on the first silicon substrate in a mortise and tenon fashion and sealing the two substrates using a high force.

Abstract translation: 提供了用于密封微电池的微电池结构。 在一个实施例中，微电池结构包括第一硅衬底，其包含容纳微电池的阴极材料的至少一个基座和容纳微电池的第一密封剂材料的至少一个凹陷部。 该结构还包括第二硅衬底，其包含容纳微电池的阳极材料的至少一个基座和容纳微电池的第二密封剂材料的至少一个凹陷部。 绝缘中心件与存在于第一硅衬底上的至少两个凹陷中的第一密封剂材料结合。 通过使第二硅衬底以榫眼和榫头的方式对准和叠加在第一硅衬底上并通过高力密封两个衬底而形成互锁结构。

公开(公告)号：US09564165B2

公开(公告)日：2017-02-07

申请号：US15149727

申请日：2016-05-09

Applicant: International Business Machines Corporation

Inventor： Robert E. Fontana, Jr. ,  William J. Gallagher ,  Philipp Herget ,  Eugene J. O'Sullivan ,  Lubomyr T. Romankiw ,  Naigang Wang ,  Bucknell C. Webb

IPC: B32B15/00 ,  G11B5/66 ,  C25D7/00 ,  C25D7/12 ,  C25D3/54 ,  C25D5/10 ,  C25D5/14 ,  C25D9/10 ,  H01F10/32 ,  C25D3/58 ,  C25D5/18 ,  C25D5/50

CPC classification number: H01F10/3231 ,  C25D3/54 ,  C25D3/58 ,  C25D5/10 ,  C25D5/14 ,  C25D5/18 ,  C25D5/50 ,  C25D7/001 ,  C25D7/123 ,  C25D9/08 ,  C25D9/10 ,  C25D17/001 ,  G11B5/66 ,  H01F3/02 ,  H01F10/3236 ,  H01F10/324 ,  H01F10/325 ,  H01F10/3254 ,  H01F41/02

Abstract: A laminating structure includes a first magnetic layer, a second magnetic layer, a first spacer disposed between the first and second magnetic layers and a second spacer disposed on the second magnetic layer.

Abstract translation: 层叠结构包括第一磁性层，第二磁性层，设置在第一和第二磁性层之间的第一间隔件和设置在第二磁性层上的第二间隔件。

公开(公告)号：US09520779B2

公开(公告)日：2016-12-13

申请号：US15072675

申请日：2016-03-17

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Leland Chang ,  Evan G. Colgan ,  John U. Knickerbocker ,  Bucknell C. Webb ,  Robert Wisnieff

IPC: G05F3/02 ,  H02M3/156 ,  H01L23/64 ,  H01L23/00 ,  H01L25/065 ,  G06F1/26

CPC classification number: H02M3/156 ,  G05F3/02 ,  G06F1/26 ,  G06F1/263 ,  G06F1/266 ,  H01L23/5286 ,  H01L23/64 ,  H01L23/642 ,  H01L23/645 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/1436 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H02M1/08 ,  H05K1/00 ,  Y10T29/49117 ,  H01L2224/11 ,  H01L2924/014

Abstract: A switching power supply in an integrated circuit, an integrated circuit comprising a switching power supply, and a method of assembling a switching power supply in an integrated circuit are disclosed. In one embodiment, the invention provides a three-dimensional switching power supply in an integrated circuit comprising a device layer. The switching power supply comprises three distinct strata arranged in series with the device layer, the three distinct strata including a switching layer including switching circuits, a capacitor layer including banks of capacitors, and an inductor layer including inductors. This switching power supply further comprises a multitude of connectors electrically and mechanically connecting together the device layer, the switching layer, the capacitor layer, and the inductor layer. The switching circuits, the capacitors and the inductors form a switching power supply for supplying power to the device layer.

公开(公告)号：US20160136401A1

公开(公告)日：2016-05-19

申请号：US14542614

申请日：2014-11-16

Applicant: International Business Machines Corporation

Inventor： Bucknell C. Webb

IPC: A61M31/00

CPC classification number: A61M31/002

Abstract: A delivery device including a substrate formed in a coil comprising a plurality of loops, an active agent deposited between an inner surface and an outer surface of the substrate formed in the coil, and a pair of end caps, each end cap disposed on a corresponding end of the coil.

Abstract translation: 一种输送装置，包括形成在包括多个环的线圈中的基板，沉积在形成在线圈中的基板的内表面和外表面之间的活性剂，以及一对端盖，每个端盖设置在相应的 线圈末端。